JP6533652B2 - 端子部材のめっき方法およびめっき装置 - Google Patents
端子部材のめっき方法およびめっき装置 Download PDFInfo
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- JP6533652B2 JP6533652B2 JP2014187299A JP2014187299A JP6533652B2 JP 6533652 B2 JP6533652 B2 JP 6533652B2 JP 2014187299 A JP2014187299 A JP 2014187299A JP 2014187299 A JP2014187299 A JP 2014187299A JP 6533652 B2 JP6533652 B2 JP 6533652B2
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- plating
- terminal
- side wall
- jig
- wall member
- Prior art date
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- 238000007747 plating Methods 0.000 title claims description 169
- 238000000034 method Methods 0.000 title claims description 24
- 239000011810 insulating material Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005406 washing Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000007547 defect Effects 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
2 端子
3 キャリア部
4 ガイド穴
11 ドラム型治具
12 位置決めピン
13 開口部
14 取付孔
31 側壁部材
32 プレート
33 脚部
Claims (11)
- 端子部材をドラム型治具の側面に密着させ、前記端子部材の先端の端子に、前記ドラム型治具の内部から、前記ドラム型治具の側面に形成された開口部を介してめっき液を供給してめっきを形成する端子部材のめっき方法であって、
前記開口部の周囲に、前記端子の側面に沿って、絶縁材料からなる側壁部材を設け、
前記側壁部材の左右の側壁間距離と、前記端子の幅との差を0.7mm以下にし、
前記側壁部材の左右の側壁間距離を、前記開口部の幅よりも小さくして、前記端子にめっきを形成することを特徴とする、端子部材のめっき方法。 - 前記側壁部材の左右の側壁間距離と、前記端子の幅との差を0.3mm以下にすることを特徴とする、請求項1に記載の端子部材のめっき方法。
- 前記側壁部材の左右の側壁間距離と、前記端子の幅との差を0.2mm以上にすることを特徴とする、請求項1または2のいずれか一項に記載の端子部材のめっき方法。
- 前記めっきがAuまたはAgであることを特徴とする、請求項1〜3のいずれか一項に記載の端子部材のめっき方法。
- 前記めっきを形成する前に、前記端子に下地めっきを形成することを特徴とする、請求項1〜4のいずれか一項に記載の端子部材のめっき方法。
- 端子部材の先端の端子をめっきする端子部材のめっき装置であって、
ドラム型治具の側面に、前記ドラム型治具の内部からめっき液を供給する開口部が形成され、前記開口部の周囲に、前記端子の側面に沿って、絶縁材料からなる側壁部材が設けられ、
前記側壁部材の左右の側壁間距離と、前記端子の幅との差が0.7mm以下であり、
前記側壁部材の左右の側壁間距離が、前記開口部の幅よりも小さいことを特徴とする、端子部材のめっき装置。 - 前記側壁部材の左右の側壁間距離と、前記端子の幅との差が0.3mm以下であることを特徴とする、請求項6に記載の端子部材のめっき装置。
- 前記側壁部材の左右の側壁間距離と、前記端子の幅との差が0.2mm以上であることを特徴とする、請求項6または7のいずれか一項に記載の端子部材のめっき装置。
- 前記側壁部材は、前記治具に着脱自在であることを特徴とする、請求項6〜8のいずれか一項に記載の端子部材のめっき装置。
- 前記側壁部材は、プレート上に設置され、前記プレートは、前記治具に形成された取付孔よりも径が小さい脚部を有し、前記脚部を前記取付孔に差し込むことによって前記治具に取り付けられることを特徴とする、請求項9に記載の端子部材のめっき装置。
- 前記プレートの脚部は、シリコン樹脂からなる弾性材で形成されていることを特徴とする、請求項10に記載の端子部材のめっき装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014187299A JP6533652B2 (ja) | 2013-10-24 | 2014-09-16 | 端子部材のめっき方法およびめっき装置 |
PCT/JP2014/077936 WO2015060298A1 (ja) | 2013-10-24 | 2014-10-21 | 端子部材のめっき方法、めっき装置、および端子部材 |
MX2016005256A MX2016005256A (es) | 2013-10-24 | 2014-10-21 | Metodo de enchapado para miembro de terminal, aparato de enchapado para el mismo y miembro de terminal. |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013220977 | 2013-10-24 | ||
JP2013220977 | 2013-10-24 | ||
JP2014187299A JP6533652B2 (ja) | 2013-10-24 | 2014-09-16 | 端子部材のめっき方法およびめっき装置 |
Publications (2)
Publication Number | Publication Date |
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JP2015108186A JP2015108186A (ja) | 2015-06-11 |
JP6533652B2 true JP6533652B2 (ja) | 2019-06-19 |
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JP2014187299A Active JP6533652B2 (ja) | 2013-10-24 | 2014-09-16 | 端子部材のめっき方法およびめっき装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6533652B2 (ja) |
MX (1) | MX2016005256A (ja) |
WO (1) | WO2015060298A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6687415B2 (ja) * | 2016-02-22 | 2020-04-22 | Dowaメタルテック株式会社 | 部分めっき方法およびそれに用いるマスク部材 |
JP2023121244A (ja) * | 2022-02-21 | 2023-08-31 | Dowaメタルテック株式会社 | 部分めっき用マスク部材及び部分めっき方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60190593A (ja) * | 1984-03-09 | 1985-09-28 | Sonitsukusu:Kk | 部分メツキ用貼り合せ構造のノズル |
JPS63105989A (ja) * | 1986-10-22 | 1988-05-11 | Electroplating Eng Of Japan Co | 噴射メツキ装置 |
JPH0297692A (ja) * | 1988-09-30 | 1990-04-10 | Fujitsu Ltd | 部分めっき方法 |
JP2000038695A (ja) * | 1998-07-22 | 2000-02-08 | Mitsubishi Plastics Ind Ltd | リードフレームメッキ用マスキング材 |
JP4765207B2 (ja) * | 2001-06-26 | 2011-09-07 | パナソニック株式会社 | 全面電気メッキ装置およびそれによって全面メッキリードフレームを製造する方法 |
JP2011108818A (ja) * | 2009-11-17 | 2011-06-02 | Mitsui High Tec Inc | リードフレームの製造方法および半導体装置の製造方法 |
-
2014
- 2014-09-16 JP JP2014187299A patent/JP6533652B2/ja active Active
- 2014-10-21 MX MX2016005256A patent/MX2016005256A/es unknown
- 2014-10-21 WO PCT/JP2014/077936 patent/WO2015060298A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2015060298A1 (ja) | 2015-04-30 |
JP2015108186A (ja) | 2015-06-11 |
MX2016005256A (es) | 2016-11-07 |
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