JP6532213B2 - 撮像素子、撮像装置及び携帯電話機 - Google Patents

撮像素子、撮像装置及び携帯電話機 Download PDF

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JP6532213B2
JP6532213B2 JP2014223195A JP2014223195A JP6532213B2 JP 6532213 B2 JP6532213 B2 JP 6532213B2 JP 2014223195 A JP2014223195 A JP 2014223195A JP 2014223195 A JP2014223195 A JP 2014223195A JP 6532213 B2 JP6532213 B2 JP 6532213B2
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readout
pixels
column
imaging device
pixel
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Japanese (ja)
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JP2015130648A5 (enExample
JP2015130648A (ja
Inventor
尚平 兎澤
尚平 兎澤
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014223195A priority Critical patent/JP6532213B2/ja
Priority to US14/555,045 priority patent/US9426396B2/en
Priority to KR1020140167121A priority patent/KR101745313B1/ko
Priority to CN201410721278.8A priority patent/CN104683711B/zh
Publication of JP2015130648A publication Critical patent/JP2015130648A/ja
Publication of JP2015130648A5 publication Critical patent/JP2015130648A5/ja
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Publication of JP6532213B2 publication Critical patent/JP6532213B2/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
    • H04N25/445—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by skipping some contiguous pixels within the read portion of the array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
    • H04N25/447—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by preserving the colour pattern with or without loss of information
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/709—Circuitry for control of the power supply
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2014223195A 2013-12-02 2014-10-31 撮像素子、撮像装置及び携帯電話機 Active JP6532213B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014223195A JP6532213B2 (ja) 2013-12-02 2014-10-31 撮像素子、撮像装置及び携帯電話機
US14/555,045 US9426396B2 (en) 2013-12-02 2014-11-26 Image sensor, image capturing apparatus, and cellular phone for reduced power consumption when performing thinning readout
KR1020140167121A KR101745313B1 (ko) 2013-12-02 2014-11-27 촬상 소자, 촬상장치 및 휴대전화기
CN201410721278.8A CN104683711B (zh) 2013-12-02 2014-12-02 图像传感器、摄像装置及蜂窝电话

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013249626 2013-12-02
JP2013249626 2013-12-02
JP2014223195A JP6532213B2 (ja) 2013-12-02 2014-10-31 撮像素子、撮像装置及び携帯電話機

Publications (3)

Publication Number Publication Date
JP2015130648A JP2015130648A (ja) 2015-07-16
JP2015130648A5 JP2015130648A5 (enExample) 2017-12-14
JP6532213B2 true JP6532213B2 (ja) 2019-06-19

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JP2014223195A Active JP6532213B2 (ja) 2013-12-02 2014-10-31 撮像素子、撮像装置及び携帯電話機

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US (1) US9426396B2 (enExample)
JP (1) JP6532213B2 (enExample)
KR (1) KR101745313B1 (enExample)
CN (1) CN104683711B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102154802B1 (ko) * 2014-02-11 2020-09-11 삼성전자주식회사 전자 장치의 촬영 방법 및 그 전자 장치
KR101684107B1 (ko) 2015-05-07 2016-12-20 현대자동차주식회사 전자 장치 및 전자 장치의 운전자 판단 방법
JP6677594B2 (ja) * 2016-06-30 2020-04-08 キヤノン株式会社 光電変換装置
WO2018088119A1 (ja) * 2016-11-09 2018-05-17 富士フイルム株式会社 撮像装置、撮像方法、及び、撮像プログラム
JP7148269B2 (ja) * 2018-05-02 2022-10-05 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および撮像装置
JP7175703B2 (ja) * 2018-10-17 2022-11-21 キヤノン株式会社 撮像装置及びその制御方法、プログラム、記憶媒体
JP7604201B2 (ja) * 2020-12-03 2024-12-23 キヤノン株式会社 光電変換装置、光電変換システム、移動体、半導体基板、光電変換装置の駆動方法
JP2022119377A (ja) * 2021-02-04 2022-08-17 キヤノン株式会社 光電変換装置、光電変換システム、移動体、半導体基板
CN117278876A (zh) * 2022-06-15 2023-12-22 思特威(上海)电子科技股份有限公司 一种基于堆栈式工艺的图像传感器
WO2025182269A1 (ja) * 2024-02-29 2025-09-04 富士フイルム株式会社 撮像装置、制御方法及び制御プログラム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09247689A (ja) 1996-03-11 1997-09-19 Olympus Optical Co Ltd カラー撮像装置
JP3548410B2 (ja) * 1997-12-25 2004-07-28 キヤノン株式会社 固体撮像装置および固体撮像装置の信号読み出し方法
JP5178994B2 (ja) * 2005-05-26 2013-04-10 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および撮像装置
US7629631B2 (en) * 2005-06-21 2009-12-08 Hamza Yilmaz High voltage semiconductor devices with JFET regions containing dielectrically isolated junctions
JP4475665B2 (ja) * 2006-03-31 2010-06-09 キヤノン株式会社 固体撮像装置
JP2008172493A (ja) * 2007-01-11 2008-07-24 Matsushita Electric Ind Co Ltd フロントエンド信号処理方法およびフロントエンド信号処理装置
JP2008263546A (ja) * 2007-04-13 2008-10-30 Konica Minolta Holdings Inc 固体撮像装置、固体撮像装置の駆動方法、及びこれを用いた撮像システム
JP5495711B2 (ja) * 2009-10-26 2014-05-21 キヤノン株式会社 撮像装置及び撮像システム、それらの制御方法及びそのプログラム
JP5792987B2 (ja) * 2011-04-21 2015-10-14 キヤノン株式会社 撮像装置
JP2013042001A (ja) * 2011-08-17 2013-02-28 Panasonic Corp 固体撮像装置
JP5682638B2 (ja) * 2013-01-15 2015-03-11 株式会社ニコン 撮像素子

Also Published As

Publication number Publication date
US9426396B2 (en) 2016-08-23
CN104683711A (zh) 2015-06-03
KR101745313B1 (ko) 2017-06-12
CN104683711B (zh) 2018-05-15
JP2015130648A (ja) 2015-07-16
KR20150063928A (ko) 2015-06-10
US20150156432A1 (en) 2015-06-04

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