JP6520341B2 - 基板ブレイク装置 - Google Patents

基板ブレイク装置 Download PDF

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Publication number
JP6520341B2
JP6520341B2 JP2015084696A JP2015084696A JP6520341B2 JP 6520341 B2 JP6520341 B2 JP 6520341B2 JP 2015084696 A JP2015084696 A JP 2015084696A JP 2015084696 A JP2015084696 A JP 2015084696A JP 6520341 B2 JP6520341 B2 JP 6520341B2
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JP
Japan
Prior art keywords
substrate
breaking
air bearing
unit
bearing table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015084696A
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English (en)
Japanese (ja)
Other versions
JP2016043689A (ja
Inventor
▲ウォン▼▲ヨン▼ 朱
▲ウォン▼▲ヨン▼ 朱
成雲 張
成雲 張
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of JP2016043689A publication Critical patent/JP2016043689A/ja
Application granted granted Critical
Publication of JP6520341B2 publication Critical patent/JP6520341B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015084696A 2014-08-21 2015-04-17 基板ブレイク装置 Expired - Fee Related JP6520341B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0108865 2014-08-21
KR1020140108865A KR101659454B1 (ko) 2014-08-21 2014-08-21 기판 브레이크 장치

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019016619A Division JP2019081373A (ja) 2014-08-21 2019-02-01 基板ブレイク装置

Publications (2)

Publication Number Publication Date
JP2016043689A JP2016043689A (ja) 2016-04-04
JP6520341B2 true JP6520341B2 (ja) 2019-05-29

Family

ID=55416044

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015084696A Expired - Fee Related JP6520341B2 (ja) 2014-08-21 2015-04-17 基板ブレイク装置
JP2019016619A Pending JP2019081373A (ja) 2014-08-21 2019-02-01 基板ブレイク装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019016619A Pending JP2019081373A (ja) 2014-08-21 2019-02-01 基板ブレイク装置

Country Status (4)

Country Link
JP (2) JP6520341B2 (zh)
KR (1) KR101659454B1 (zh)
CN (1) CN105382944B (zh)
TW (1) TWI674046B (zh)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57109918A (en) * 1980-12-26 1982-07-08 Toshiba Corp Cutting device of glass substrate
AT391858B (de) * 1988-04-25 1990-12-10 Lisec Peter Vorrichtung zum brechen von einseitig geritzten glastafeln
JP2766123B2 (ja) * 1992-05-27 1998-06-18 鹿児島日本電気株式会社 ガラス基板のプレス式切断方法
JP2001162615A (ja) 1999-12-13 2001-06-19 Sumitomo Kinzoku Kozan Siporex Kk コーナーパネル用穿孔装置
JP3900916B2 (ja) * 2001-12-07 2007-04-04 株式会社村田製作所 セラミックブロック体のカット方法およびカット装置
EP1630140A4 (en) * 2003-04-28 2006-10-25 Mitsuboshi Diamond Ind Co Ltd SYSTEM AND METHOD FOR SEPARATING FRAGILE PLATES
JP2005001264A (ja) * 2003-06-12 2005-01-06 Sharp Corp 分断装置および分断方法
JP4619024B2 (ja) * 2004-03-19 2011-01-26 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
KR20060006862A (ko) * 2006-01-05 2006-01-19 장형규 이동 통신 단말기를 이용한 복약 시간 고지 시스템 및 방법
KR100748305B1 (ko) * 2006-03-02 2007-08-09 삼성에스디아이 주식회사 절단된 기판의 이송방법
KR100786126B1 (ko) * 2007-08-14 2007-12-18 주식회사 아바코 비접촉 방식에 의한 피절단물의 평탄도를 유지하는스크라이브 헤드 장치 및 그 스크라이브 방법
KR100956355B1 (ko) * 2008-06-10 2010-05-07 세메스 주식회사 스크라이빙 장치
JP5256554B2 (ja) * 2008-07-18 2013-08-07 株式会社シライテック 液晶パネルの割断装置
JP5249979B2 (ja) * 2010-03-18 2013-07-31 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
JP5187366B2 (ja) * 2010-08-31 2013-04-24 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP5182339B2 (ja) * 2010-08-31 2013-04-17 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP6039363B2 (ja) * 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
JP6043150B2 (ja) * 2012-10-29 2016-12-14 三星ダイヤモンド工業株式会社 積層脆性材料基板のブレイク装置および積層脆性材料基板のブレイク方法
JP2014101244A (ja) * 2012-11-19 2014-06-05 Dainippon Printing Co Ltd ガラス基板切断装置

Also Published As

Publication number Publication date
JP2019081373A (ja) 2019-05-30
JP2016043689A (ja) 2016-04-04
CN105382944B (zh) 2019-08-09
CN105382944A (zh) 2016-03-09
TWI674046B (zh) 2019-10-01
TW201608945A (zh) 2016-03-01
KR20160023076A (ko) 2016-03-03
KR101659454B1 (ko) 2016-09-23

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