JP6511105B2 - 切割方法、その切割方法に使用する超音波ワイヤ切割装置及びウェハー製造方法 - Google Patents

切割方法、その切割方法に使用する超音波ワイヤ切割装置及びウェハー製造方法 Download PDF

Info

Publication number
JP6511105B2
JP6511105B2 JP2017166567A JP2017166567A JP6511105B2 JP 6511105 B2 JP6511105 B2 JP 6511105B2 JP 2017166567 A JP2017166567 A JP 2017166567A JP 2017166567 A JP2017166567 A JP 2017166567A JP 6511105 B2 JP6511105 B2 JP 6511105B2
Authority
JP
Japan
Prior art keywords
cutting
liquid
wire
cut
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017166567A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018043341A (ja
Inventor
農晏 ▲黄▼
農晏 ▲黄▼
志鴻 ▲ちゃん▼
志鴻 ▲ちゃん▼
政羨 陳
政羨 陳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AUO Crystal Corp
Original Assignee
AUO Crystal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AUO Crystal Corp filed Critical AUO Crystal Corp
Publication of JP2018043341A publication Critical patent/JP2018043341A/ja
Application granted granted Critical
Publication of JP6511105B2 publication Critical patent/JP6511105B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2017166567A 2016-09-13 2017-08-31 切割方法、その切割方法に使用する超音波ワイヤ切割装置及びウェハー製造方法 Active JP6511105B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105129735 2016-09-13
TW105129735A TWI641461B (zh) 2016-09-13 2016-09-13 Ultrasonic auxiliary wire cutting cutting method and device thereof, and wafer manufacturing method

Publications (2)

Publication Number Publication Date
JP2018043341A JP2018043341A (ja) 2018-03-22
JP6511105B2 true JP6511105B2 (ja) 2019-05-15

Family

ID=59811151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017166567A Active JP6511105B2 (ja) 2016-09-13 2017-08-31 切割方法、その切割方法に使用する超音波ワイヤ切割装置及びウェハー製造方法

Country Status (4)

Country Link
EP (1) EP3292968A1 (zh)
JP (1) JP6511105B2 (zh)
CN (1) CN107813434A (zh)
TW (1) TWI641461B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114589601B (zh) * 2022-03-18 2023-09-05 浙江晶盛机电股份有限公司 磨粒赋能线切割装置及方法
CN114851413A (zh) * 2022-03-25 2022-08-05 河南科技大学 一种接片槽、金刚线切片机及大尺寸硅棒的切割方法
CN115609770A (zh) * 2022-10-11 2023-01-17 上海理工大学 一种超声空化辅助线锯切割加工装置及方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01216759A (ja) * 1988-02-24 1989-08-30 Osaka Titanium Co Ltd スライス加工法および装置
JPH03111104A (ja) * 1989-04-21 1991-05-10 M Setetsuku Kk インゴットの切断方法
JP3534213B2 (ja) * 1995-09-30 2004-06-07 コマツ電子金属株式会社 半導体ウェハの製造方法
JP2000308955A (ja) * 1999-04-26 2000-11-07 Super Silicon Kenkyusho:Kk ワイヤソーを用いたスライシング用スラリー
JP5430294B2 (ja) * 2009-01-29 2014-02-26 京セラ株式会社 基板の製造方法
GB2468874A (en) * 2009-03-24 2010-09-29 Rec Wafer Norway As Apparatus for cutting wafers using wires and abrasive slurry
CN102101324A (zh) * 2009-12-17 2011-06-22 绿能科技股份有限公司 硅晶锭的超音波切割设备
CN102922610B (zh) * 2011-08-10 2016-01-27 浙江昱辉阳光能源有限公司 一种金刚线多线切割方法、设备和系统
CN103085179A (zh) * 2011-11-06 2013-05-08 赵钧永 超声波线切割方法及专用设备
TWI499480B (zh) * 2012-09-10 2015-09-11 Auo Crystal Corp 晶錠切削冷卻裝置及其冷卻方法
CN202964937U (zh) * 2012-12-11 2013-06-05 江苏协鑫硅材料科技发展有限公司 一种切割硅锭的装置
CN104009116A (zh) * 2014-05-12 2014-08-27 奥特斯维能源（太仓）有限公司 金刚线切割多晶硅片的电池的制作方法
JP2016101611A (ja) * 2014-11-27 2016-06-02 京セラ株式会社 基板の製造方法
CN105619628B (zh) * 2016-02-18 2017-11-17 安徽旭能电力股份有限公司 一种双面玻璃晶体硅片加工切割装置

Also Published As

Publication number Publication date
TW201808563A (zh) 2018-03-16
JP2018043341A (ja) 2018-03-22
TWI641461B (zh) 2018-11-21
EP3292968A1 (en) 2018-03-14
CN107813434A (zh) 2018-03-20

Similar Documents

Publication Publication Date Title
JP6511105B2 (ja) 切割方法、その切割方法に使用する超音波ワイヤ切割装置及びウェハー製造方法
CN104701219B (zh) 晶片加工装置
JP6460111B2 (ja) 圧電共振器の製造方法および圧電共振器
KR20060045801A (ko) 미세 가공 방법 및 시스템
JP6507358B1 (ja) 流水式超音波洗浄機及びそのノズル、超音波洗浄方法
JP2009226582A (ja) 半導体装置の製造方法
JP2003318147A (ja) ウェーハ洗浄システム
JP5430294B2 (ja) 基板の製造方法
US2967381A (en) Means for cutting
US7089947B2 (en) Apparatus and method for cleaning a semiconductor wafer
CN105523519A (zh) Mems器件及其形成方法
JP2008236671A (ja) 薄膜圧電共振器及びその製造方法
JP3839154B2 (ja) 超音波振動発生装置及び超音波洗浄装置
KR20150092200A (ko) 웨이퍼 세척 장치 및 방법들
JP6052915B2 (ja) 接合微小電気機械アセンブリ
TWM535142U (zh) 切割裝置
JP2010000591A (ja) カッター刃ホーン、カッター刃ホルダー、超音波カッター用超音波振動部、及び超音波カッター
CN220593661U (zh) 工作台振动切割装置及切割机
JP2011041993A (ja) 超音波切断用ホーン
KR101031374B1 (ko) 스파이크 펄스 방지용 초음파 세정 장치
JP2016155197A (ja) ワイヤーソー及び切断方法
JP2008124659A (ja) 薄膜圧電共振器の製造方法及び薄膜圧電共振器
CN112039477B (zh) 一种薄膜体声波谐振器及其制造方法
JP2018193787A (ja) ドレン材切断装置およびドレン材切断方法
KR102161381B1 (ko) 타공 블레이드

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180710

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181001

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20181025

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20190218

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20190308

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190329

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190405

R150 Certificate of patent or registration of utility model

Ref document number: 6511105

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250