JP6507358B1 - 流水式超音波洗浄機及びそのノズル、超音波洗浄方法 - Google Patents
流水式超音波洗浄機及びそのノズル、超音波洗浄方法 Download PDFInfo
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- JP6507358B1 JP6507358B1 JP2018553160A JP2018553160A JP6507358B1 JP 6507358 B1 JP6507358 B1 JP 6507358B1 JP 2018553160 A JP2018553160 A JP 2018553160A JP 2018553160 A JP2018553160 A JP 2018553160A JP 6507358 B1 JP6507358 B1 JP 6507358B1
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- Prior art keywords
- ultrasonic
- vibrator
- hollow portion
- nozzle
- cleaning
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0217—Use of a detergent in high pressure cleaners; arrangements for supplying the same
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
Abstract
Description
2…被洗浄物としてのシリコンウェハ
11、11A、11B、11C…流水式超音波洗浄機ノズル
12…ノズル本体
14…空洞部
15…吐出口
17…流路
18…内部空間
31…超音波振動子
31b…(超音波振動子の)前端面としての下端面
41、41A、41B、41C…振動体
42、42A、42B、42C…振動体主部
46…隙間
51…洗浄液供給装置
61…超音波発振器
W1…洗浄液
Claims (9)
- 超音波を重畳させた洗浄液を流水として吐出することで被洗浄物を超音波洗浄する流水式超音波洗浄機ノズルであって、
前記洗浄液が流れる流路の一部をなす先細り形状の空洞部を有し、前記空洞部内の前記洗浄液を吐出する吐出口を前記空洞部の先端に有するノズル本体と、
前記空洞部の基端側に配置された板状の超音波振動子と、
耐薬品性を有する非金属無機材料からなり、前記超音波振動子の前端面に密着固定され、前記空洞部の内部空間の半分以上の容積を占有する振動体と
を備え、
前記振動体の外表面と前記空洞部の内壁面との隙間を介して、前記洗浄液が流れるように構成されている
ことを特徴とする流水式超音波洗浄機ノズル。 - 前記振動体は先端側に行くほど細くなる形状をなす中実体であり、前記振動体の基端面は前記超音波振動子の前記前端面の略全体に対して密着固定されていることを特徴とする請求項1に記載の流水式超音波洗浄機ノズル。
- 前記振動体は、錐体の形状をなす振動体主部を有することを特徴とする請求項2に記載の流水式超音波洗浄機ノズル。
- 前記振動体は、石英製であることを特徴とする請求項1乃至3のいずれか1項に記載の流水式超音波洗浄機ノズル。
- 前記振動体の前記基端面は、前記超音波振動子の前記前端面に対して耐熱性接着剤を介して接着されていることを特徴とする請求項1乃至4のいずれか1項に記載の流水式超音波洗浄機ノズル。
- 前記隙間の大きさは略一定であることを特徴とする請求項1乃至5のいずれか1項に記載の流水式超音波洗浄機ノズル。
- 前記振動体は、前記空洞部の内部空間の60%以上95%以下の容積を占有することを特徴とする請求項1乃至6のいずれか1項に記載の流水式超音波洗浄機ノズル。
- 請求項1乃至7のいずれか1項に記載のノズルと、前記ノズルの前記空洞部内に前記洗浄液を供給する洗浄液供給装置と、前記ノズルの前記超音波振動子を駆動させる超音波発振器とを備えたことを特徴とする流水式超音波洗浄機。
- 請求項8に記載の流水式超音波洗浄機を用いて被洗浄物を洗浄する方法であって、前記被洗浄物が半導体ウェハまたは半導体製造用ツールであり、前記洗浄液が前記半導体ウェハまたは半導体製造用ツールを洗浄するための発泡性の薬液であることを特徴とする超音波洗浄方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/027811 WO2020021648A1 (ja) | 2018-07-25 | 2018-07-25 | 流水式超音波洗浄機及びそのノズル、超音波洗浄方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6507358B1 true JP6507358B1 (ja) | 2019-05-08 |
JPWO2020021648A1 JPWO2020021648A1 (ja) | 2020-08-06 |
Family
ID=66429800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018553160A Active JP6507358B1 (ja) | 2018-07-25 | 2018-07-25 | 流水式超音波洗浄機及びそのノズル、超音波洗浄方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6507358B1 (ja) |
KR (1) | KR20200012835A (ja) |
CN (1) | CN110730693A (ja) |
WO (1) | WO2020021648A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022078147A (ja) * | 2020-09-28 | 2022-05-24 | 株式会社カイジョー | 超音波シャワー洗浄装置 |
KR20230075323A (ko) | 2020-09-28 | 2023-05-31 | 가부시끼가이샤가이죠 | 초음파 샤워 세정 장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113891820A (zh) | 2020-03-19 | 2022-01-04 | 株式会社村田制作所 | 振动装置和振动控制方法 |
KR102446082B1 (ko) * | 2020-08-12 | 2022-09-23 | 한국기계연구원 | 초음파를 이용한 유체 분사 모듈 |
JP7088461B1 (ja) * | 2021-04-16 | 2022-06-21 | 守 笹川 | 超音波洗浄装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03181378A (ja) * | 1989-12-11 | 1991-08-07 | Matsushita Electric Ind Co Ltd | 洗浄装置 |
JP2000334403A (ja) * | 1999-05-31 | 2000-12-05 | Honda Electronic Co Ltd | 超音波洗浄装置 |
JP2003340386A (ja) * | 2002-05-23 | 2003-12-02 | Toshiba Corp | 超音波洗浄装置及び超音波洗浄方法 |
JP2004148179A (ja) * | 2002-10-30 | 2004-05-27 | Honda Electronic Co Ltd | 超音波洗浄装置 |
JP2004275721A (ja) * | 2003-02-25 | 2004-10-07 | Matsushita Electric Works Ltd | 超音波生体洗浄装置 |
JP2008080293A (ja) * | 2006-09-28 | 2008-04-10 | Hitachi Plant Technologies Ltd | 洗浄装置 |
JP2012043830A (ja) * | 2010-08-12 | 2012-03-01 | Fujitsu Ltd | 洗浄装置および洗浄方法 |
JP5786166B2 (ja) * | 2011-07-19 | 2015-09-30 | 学校法人昭和大学 | 流水式超音波口腔洗浄装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5786166A (en) | 1980-11-17 | 1982-05-29 | Sony Corp | Tape tension detector |
CN100443036C (zh) * | 2003-02-25 | 2008-12-17 | 松下电工株式会社 | 超声波洗涤装置 |
JP2010238744A (ja) * | 2009-03-30 | 2010-10-21 | Toshiba Corp | 超音波洗浄ユニット、超音波洗浄装置 |
-
2018
- 2018-07-25 KR KR1020197031862A patent/KR20200012835A/ko not_active Application Discontinuation
- 2018-07-25 WO PCT/JP2018/027811 patent/WO2020021648A1/ja active Application Filing
- 2018-07-25 JP JP2018553160A patent/JP6507358B1/ja active Active
- 2018-07-25 CN CN201880027560.2A patent/CN110730693A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03181378A (ja) * | 1989-12-11 | 1991-08-07 | Matsushita Electric Ind Co Ltd | 洗浄装置 |
JP2000334403A (ja) * | 1999-05-31 | 2000-12-05 | Honda Electronic Co Ltd | 超音波洗浄装置 |
JP2003340386A (ja) * | 2002-05-23 | 2003-12-02 | Toshiba Corp | 超音波洗浄装置及び超音波洗浄方法 |
JP2004148179A (ja) * | 2002-10-30 | 2004-05-27 | Honda Electronic Co Ltd | 超音波洗浄装置 |
JP2004275721A (ja) * | 2003-02-25 | 2004-10-07 | Matsushita Electric Works Ltd | 超音波生体洗浄装置 |
JP2008080293A (ja) * | 2006-09-28 | 2008-04-10 | Hitachi Plant Technologies Ltd | 洗浄装置 |
JP2012043830A (ja) * | 2010-08-12 | 2012-03-01 | Fujitsu Ltd | 洗浄装置および洗浄方法 |
JP5786166B2 (ja) * | 2011-07-19 | 2015-09-30 | 学校法人昭和大学 | 流水式超音波口腔洗浄装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022078147A (ja) * | 2020-09-28 | 2022-05-24 | 株式会社カイジョー | 超音波シャワー洗浄装置 |
JP7282472B2 (ja) | 2020-09-28 | 2023-05-29 | 株式会社カイジョー | 超音波シャワー洗浄装置 |
KR20230075323A (ko) | 2020-09-28 | 2023-05-31 | 가부시끼가이샤가이죠 | 초음파 샤워 세정 장치 |
Also Published As
Publication number | Publication date |
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JPWO2020021648A1 (ja) | 2020-08-06 |
WO2020021648A1 (ja) | 2020-01-30 |
KR20200012835A (ko) | 2020-02-05 |
CN110730693A (zh) | 2020-01-24 |
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