JP6501588B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/4234—Gate electrodes for transistors with charge trapping gate insulator
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/4234—Gate electrodes for transistors with charge trapping gate insulator
- H01L29/42344—Gate electrodes for transistors with charge trapping gate insulator with at least one additional gate, e.g. program gate, erase gate or select gate
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- H01—ELECTRIC ELEMENTS
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/6653—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using the removal of at least part of spacer, e.g. disposable spacer
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
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- H10B—ELECTRONIC MEMORY DEVICES
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
Description
本実施の形態の半導体装置の製造方法を、図1〜図13を参照して説明する。
異方性エッチングを行うことにより、シリコン膜SF1の一部および絶縁膜IF1の一部をそれぞれ除去する。これにより、半導体基板SBの主面の一部を露出させる。
次に、不揮発性メモリの動作例について、図15を参照して説明する。
以下に、図14に示す比較例の半導体装置の問題点を説明し、本実施の形態の効果について説明する。図14は、比較例の動作を説明する半導体装置の断面図である。
DF、DF1、DF2 拡散領域
DM、DMG ダミーメモリゲート電極
GI ゲート絶縁膜
MG メモリゲート電極
N1 窒化シリコン膜
ON1、ON2 ONO膜
OX1 第1酸化シリコン膜
OX2 犠牲酸化シリコン膜
OX3 第2酸化シリコン膜
PR1〜PR4 フォトレジスト膜
SB 半導体基板
WL ウエル
Claims (13)
- (a)半導体基板を用意する工程、
(b)前記半導体基板の主面上にゲート絶縁膜および制御ゲート電極を順に形成する工程、
(c)前記制御ゲート電極を覆うように、前記半導体基板上に、内部に電荷保持部を含む第1絶縁膜を形成する工程、
(d)前記制御ゲート電極の両側の側壁のそれぞれに、前記第1絶縁膜を介してサイドウォール状の第1犠牲膜を形成する工程、
(e)前記制御ゲート電極の一方の前記側壁に隣接する前記第1犠牲膜をマスクとして用いて、前記半導体基板の前記主面に所定の導電型の不純物イオンを注入することで、第1半導体領域を形成する工程、
(f)前記(e)工程の後、前記第1犠牲膜を除去する工程、
(g)前記(f)工程の後、前記制御ゲート電極の一方の前記側壁であって前記第1半導体領域側の前記側壁と隣り合う位置にメモリゲート電極を形成する工程、
(h)前記メモリゲート電極から露出する前記第1絶縁膜を除去する工程、
(i)前記制御ゲート電極の横の、前記メモリゲート電極とは反対側の前記半導体基板の前記主面に対してイオン注入を行うことで、前記導電型の第2半導体領域を形成する工程、
(j)前記メモリゲート電極と前記第1半導体領域との間の前記半導体基板の前記主面に対し、前記メモリゲート電極を保護膜として用いてイオン注入を行うことで、前記導電型の第3半導体領域を形成する工程、
(k)前記制御ゲート電極の横の前記メモリゲート電極とは反対側の前記半導体基板の前記主面に、前記導電型の第4半導体領域を形成する工程、
を有し、
前記第2、第3半導体領域は、前記第1、第4半導体領域よりも不純物濃度が小さく、
前記第1、第2、第3、第4半導体領域、前記制御ゲート電極および前記メモリゲート電極は、不揮発性メモリのメモリセルを構成する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記制御ゲート電極のゲート長方向において、前記第1犠牲膜の幅は、前記メモリゲート電極のゲート長よりも大きい、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(c)工程では、前記半導体基板上に順に形成する第2絶縁膜、電荷蓄積膜、および第2犠牲膜を含む前記第1絶縁膜を形成し、
前記(f)工程では、前記第1犠牲膜および前記第2犠牲膜を除去し、
前記(f)工程の後、前記(g)工程の前に、前記電荷蓄積膜を覆う第3絶縁膜を形成する、半導体装置の製造方法。 - 請求項3記載の半導体装置の製造方法において、
前記(k)工程の後、前記電荷蓄積膜よりも、前記第3絶縁膜の方が、不純物濃度が小さい、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(k)工程の後、前記第1絶縁膜内におけるヒ素の濃度に対するリンの濃度の大きさに比べて、前記メモリゲート電極内におけるヒ素の濃度に対するリンの濃度の大きさは、小さい、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第2、第3半導体領域は、前記第1、第4半導体領域よりも形成深さが小さい、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(i)工程および前記(j)工程では、前記半導体基板の主面に対してイオン注入を行うことで、前記第2、第3半導体領域を形成し、
前記(e)工程および前記(k)工程では、前記(i)工程および前記(j)工程において行うイオン注入よりも高いエネルギーでイオン注入を行うことで、前記第1、第4半導体領域のそれぞれを形成する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
(k1)前記(j)工程の後、前記(k)工程の前に、前記制御ゲート電極の前記側壁であって、前記メモリゲート電極とは反対側の前記側壁に隣接するサイドウォール状の第4絶縁膜を形成する工程、
をさらに有し、
前記(k)工程では、前記第4絶縁膜を保護膜として用いてイオン注入を行うことで、前記第4半導体領域を形成する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(k)工程では、前記メモリゲート電極を保護膜により覆った状態で、前記第4半導体領域を形成する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(k)工程の後、前記第1半導体領域より前記メモリゲート電極の方が、不純物濃度が小さい、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(e)工程では、前記第1犠牲膜から露出する前記第1絶縁膜の位置は、前記(h)工程において前記メモリゲート電極の直下に位置する前記第1絶縁膜から離間している、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(g)工程では、前記メモリゲート電極を非結晶の状態で形成する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(g)工程で形成する前記メモリゲート電極は、真性半導体である、半導体装置の製造方法。
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JP2015070432A JP6501588B2 (ja) | 2015-03-30 | 2015-03-30 | 半導体装置の製造方法 |
US15/017,612 US9472655B1 (en) | 2015-03-30 | 2016-02-06 | Method for producing a semiconductor device |
TW105104607A TW201707150A (zh) | 2015-03-30 | 2016-02-17 | 半導體裝置的製造方法 |
CN201610131660.2A CN106024852B (zh) | 2015-03-30 | 2016-03-08 | 用于制造半导体器件的方法 |
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KR100669345B1 (ko) * | 2005-10-28 | 2007-01-16 | 삼성전자주식회사 | 비휘발성 메모리 장치 및 그 형성 방법 |
JP5191633B2 (ja) * | 2006-04-04 | 2013-05-08 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP4928825B2 (ja) * | 2006-05-10 | 2012-05-09 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2007311695A (ja) * | 2006-05-22 | 2007-11-29 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2009302269A (ja) * | 2008-06-13 | 2009-12-24 | Renesas Technology Corp | 半導体装置の製造方法および半導体装置 |
JP5707224B2 (ja) * | 2011-05-20 | 2015-04-22 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP5779068B2 (ja) * | 2011-10-03 | 2015-09-16 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP5985293B2 (ja) * | 2011-10-04 | 2016-09-06 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
JP2015015384A (ja) * | 2013-07-05 | 2015-01-22 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP6310802B2 (ja) * | 2014-07-28 | 2018-04-11 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2016039329A (ja) * | 2014-08-08 | 2016-03-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP6407644B2 (ja) * | 2014-09-24 | 2018-10-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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CN106024852B (zh) | 2021-08-10 |
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CN106024852A (zh) | 2016-10-12 |
US20160293738A1 (en) | 2016-10-06 |
TW201707150A (zh) | 2017-02-16 |
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