JP6496738B2 - 耐湿性蛍光体組成物及び関連する方法 - Google Patents

耐湿性蛍光体組成物及び関連する方法 Download PDF

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Publication number
JP6496738B2
JP6496738B2 JP2016542720A JP2016542720A JP6496738B2 JP 6496738 B2 JP6496738 B2 JP 6496738B2 JP 2016542720 A JP2016542720 A JP 2016542720A JP 2016542720 A JP2016542720 A JP 2016542720A JP 6496738 B2 JP6496738 B2 JP 6496738B2
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sif
composition
manganese
phosphor
phosphor composition
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JP2017503886A (ja
Inventor
セットラー，アナント・アチュ
リヨンズ，ロバート・ジョセフ
ナマルワー，プラサンス・クマール
ハヌマンサ，ラヴィクマール
マーフィー，ジェームス・エドワード
ガルシア，フロレンシオ
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General Electric Co
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General Electric Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/61—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/615—Halogenides
    • C09K11/616—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/61—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2016542720A 2013-12-30 2014-12-16 耐湿性蛍光体組成物及び関連する方法 Active JP6496738B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IN6152/CHE/2013 2013-12-30
PCT/US2014/070465 WO2015102876A1 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
IN6152CH2013 IN2013CH06152A (enExample) 2013-12-30 2014-12-16

Publications (2)

Publication Number Publication Date
JP2017503886A JP2017503886A (ja) 2017-02-02
JP6496738B2 true JP6496738B2 (ja) 2019-04-03

Family

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JP2016542720A Active JP6496738B2 (ja) 2013-12-30 2014-12-16 耐湿性蛍光体組成物及び関連する方法

Country Status (13)

Country Link
US (1) US10131835B2 (enExample)
EP (1) EP3090030B1 (enExample)
JP (1) JP6496738B2 (enExample)
KR (1) KR102443826B1 (enExample)
CN (1) CN105849226A (enExample)
AU (1) AU2014374223B2 (enExample)
CA (1) CA2934249C (enExample)
IN (1) IN2013CH06152A (enExample)
MX (1) MX387093B (enExample)
MY (1) MY174459A (enExample)
PH (1) PH12016500972A1 (enExample)
TW (1) TWI659087B (enExample)
WO (1) WO2015102876A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP6549070B2 (ja) * 2015-09-10 2019-07-24 株式会社東芝 蛍光体及びその製造方法、並びに発光装置
US10883045B2 (en) * 2016-05-02 2021-01-05 Current Lighting Solutions, Llc Phosphor materials including fluidization materials for light sources
CN109328223A (zh) 2016-06-27 2019-02-12 通用电气公司 经涂布的锰掺杂的磷光体
US10193030B2 (en) * 2016-08-08 2019-01-29 General Electric Company Composite materials having red emitting phosphors
JP6799682B2 (ja) * 2016-11-17 2020-12-16 ゼネラル・エレクトリック・カンパニイ 被覆赤色線放出蛍光体
US11193059B2 (en) 2016-12-13 2021-12-07 Current Lighting Solutions, Llc Processes for preparing color stable red-emitting phosphor particles having small particle size
US10608148B2 (en) 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications
CN111171815B (zh) * 2018-11-13 2021-12-17 厦门稀土材料研究所 一种氟化物发光材料的表面改性方法及其制备得到的氟化物发光材料
CN113214825B (zh) * 2021-04-26 2022-11-15 云南民族大学 一种固态照明led用多氟化物红光材料及其制备方法和应用
US11700795B2 (en) * 2021-05-04 2023-07-18 Samsung Electronics Co., Ltd. Light emitting device and light apparatus for plant growth
JPWO2022255221A1 (enExample) * 2021-05-31 2022-12-08
US12545836B2 (en) 2021-06-21 2026-02-10 Nichia Corporation Fluoride phosphor and method of producing the same, wavelength conversion member, and light emitting device
JP2023058394A (ja) * 2021-10-13 2023-04-25 ステラケミファ株式会社 赤色蛍光体及びその製造方法

Family Cites Families (18)

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AU4714701A (en) * 1999-12-07 2001-06-18 Global Products Sales And Marketing, Llc. Long persistent phosphor incorporated within a fabric material
JP2004155617A (ja) 2002-11-07 2004-06-03 Konica Minolta Holdings Inc 無機化合物の製造方法
US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US7358542B2 (en) 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US7648649B2 (en) 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
US20070125984A1 (en) 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US20090162667A1 (en) 2007-12-20 2009-06-25 Lumination Llc Lighting device having backlighting, illumination and display applications
JP5396849B2 (ja) 2008-12-22 2014-01-22 住友金属鉱山株式会社 表面被覆層を有する硫化物蛍光体粒子とその製造方法
JP2010232381A (ja) * 2009-03-26 2010-10-14 Mitsubishi Chemicals Corp 半導体発光装置、並びに画像表示装置及び照明装置
JP5446511B2 (ja) 2009-06-30 2014-03-19 三菱化学株式会社 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
JP5250520B2 (ja) * 2009-09-25 2013-07-31 パナソニック株式会社 被覆蛍光体及びｌｅｄ発光装置
WO2011073951A2 (en) 2009-12-17 2011-06-23 Koninklijke Philips Electronics N.V. Lighting device with light source and wavelength converting element
US8377334B2 (en) 2009-12-23 2013-02-19 General Electric Company Coated phosphors, methods of making them, and articles comprising the same
US8057706B1 (en) 2010-07-27 2011-11-15 General Electric Company Moisture-resistant phosphor and associated method
JP4974310B2 (ja) * 2010-10-15 2012-07-11 三菱化学株式会社 白色発光装置及び照明器具
US8252613B1 (en) * 2011-03-23 2012-08-28 General Electric Company Color stable manganese-doped phosphors
MY167700A (en) * 2011-04-08 2018-09-21 Shinetsu Chemical Co Preparation of complex fluoride and complex fluoride phosphor
CN104114671B (zh) * 2012-02-16 2016-10-26 皇家飞利浦有限公司 用于半导体led的涂布的窄带发红光氟硅酸盐

Also Published As

Publication number Publication date
PH12016500972B1 (en) 2016-06-20
US20160376499A1 (en) 2016-12-29
TWI659087B (zh) 2019-05-11
EP3090030B1 (en) 2018-02-21
KR20160105430A (ko) 2016-09-06
JP2017503886A (ja) 2017-02-02
IN2013CH06152A (enExample) 2015-07-03
MX387093B (es) 2025-03-19
MY174459A (en) 2020-04-20
PH12016500972A1 (en) 2016-06-20
US10131835B2 (en) 2018-11-20
CA2934249A1 (en) 2015-07-09
WO2015102876A1 (en) 2015-07-09
CN105849226A (zh) 2016-08-10
MX2016008668A (es) 2016-09-26
CA2934249C (en) 2022-11-01
KR102443826B1 (ko) 2022-09-16
EP3090030A1 (en) 2016-11-09
TW201536894A (zh) 2015-10-01
AU2014374223A1 (en) 2016-07-14
AU2014374223B2 (en) 2018-01-04

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