AU2014374223B2 - Moisture-resistant phosphor compositions and associate methods - Google Patents

Moisture-resistant phosphor compositions and associate methods Download PDF

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Publication number
AU2014374223B2
AU2014374223B2 AU2014374223A AU2014374223A AU2014374223B2 AU 2014374223 B2 AU2014374223 B2 AU 2014374223B2 AU 2014374223 A AU2014374223 A AU 2014374223A AU 2014374223 A AU2014374223 A AU 2014374223A AU 2014374223 B2 AU2014374223 B2 AU 2014374223B2
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Australia
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composition
sif
manganese
formula
phosphor
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AU2014374223A1 (en
Inventor
Florencio GARCIA
Ravikumar Hanumantha
Robert Joseph Lyons
James Edward Murphy
Prasanth Kumar Nammalwar
Anant Achyut Setlur
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Current Lighting Solutions LLC
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Current Lighting Solutions LLC
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/615—Halogenides
    • C09K11/616—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
AU2014374223A 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods Active AU2014374223B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IN6152/CHE/2013 2013-12-30
PCT/US2014/070465 WO2015102876A1 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
IN6152CH2013 IN2013CH06152A (enExample) 2013-12-30 2014-12-16

Publications (2)

Publication Number Publication Date
AU2014374223A1 AU2014374223A1 (en) 2016-07-14
AU2014374223B2 true AU2014374223B2 (en) 2018-01-04

Family

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Family Applications (1)

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AU2014374223A Active AU2014374223B2 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods

Country Status (13)

Country Link
US (1) US10131835B2 (enExample)
EP (1) EP3090030B1 (enExample)
JP (1) JP6496738B2 (enExample)
KR (1) KR102443826B1 (enExample)
CN (1) CN105849226A (enExample)
AU (1) AU2014374223B2 (enExample)
CA (1) CA2934249C (enExample)
IN (1) IN2013CH06152A (enExample)
MX (1) MX387093B (enExample)
MY (1) MY174459A (enExample)
PH (1) PH12016500972B1 (enExample)
TW (1) TWI659087B (enExample)
WO (1) WO2015102876A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6549070B2 (ja) * 2015-09-10 2019-07-24 株式会社東芝 蛍光体及びその製造方法、並びに発光装置
US10883045B2 (en) 2016-05-02 2021-01-05 Current Lighting Solutions, Llc Phosphor materials including fluidization materials for light sources
KR20250057124A (ko) 2016-06-27 2025-04-28 제네럴 일렉트릭 컴퍼니 코팅된 망간 도핑 인광체
US10193030B2 (en) * 2016-08-08 2019-01-29 General Electric Company Composite materials having red emitting phosphors
CN110072970B (zh) * 2016-11-17 2022-07-05 卡任特照明解决方案有限公司 涂覆的红线发射磷光体
US11193059B2 (en) 2016-12-13 2021-12-07 Current Lighting Solutions, Llc Processes for preparing color stable red-emitting phosphor particles having small particle size
US10608148B2 (en) * 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications
CN111171815B (zh) * 2018-11-13 2021-12-17 厦门稀土材料研究所 一种氟化物发光材料的表面改性方法及其制备得到的氟化物发光材料
CN113214825B (zh) * 2021-04-26 2022-11-15 云南民族大学 一种固态照明led用多氟化物红光材料及其制备方法和应用
KR20220151076A (ko) * 2021-05-04 2022-11-14 삼성전자주식회사 발광장치 및 식물생장용 조명장치
DE112022002865T5 (de) * 2021-05-31 2024-03-14 Nichia Corporation Lichtemittierendes Material und Verfahren zu dessen Herstellung
JP2023058394A (ja) * 2021-10-13 2023-04-25 ステラケミファ株式会社 赤色蛍光体及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8252613B1 (en) * 2011-03-23 2012-08-28 General Electric Company Color stable manganese-doped phosphors

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4714701A (en) * 1999-12-07 2001-06-18 Global Products Sales And Marketing, Llc. Long persistent phosphor incorporated within a fabric material
JP2004155617A (ja) * 2002-11-07 2004-06-03 Konica Minolta Holdings Inc 無機化合物の製造方法
US7358542B2 (en) 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US7648649B2 (en) 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US20070125984A1 (en) 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US20090162667A1 (en) 2007-12-20 2009-06-25 Lumination Llc Lighting device having backlighting, illumination and display applications
JP5396849B2 (ja) 2008-12-22 2014-01-22 住友金属鉱山株式会社 表面被覆層を有する硫化物蛍光体粒子とその製造方法
JP2010232381A (ja) * 2009-03-26 2010-10-14 Mitsubishi Chemicals Corp 半導体発光装置、並びに画像表示装置及び照明装置
JP5446511B2 (ja) 2009-06-30 2014-03-19 三菱化学株式会社 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
JP5250520B2 (ja) * 2009-09-25 2013-07-31 パナソニック株式会社 被覆蛍光体及びｌｅｄ発光装置
JP5795771B2 (ja) 2009-12-17 2015-10-14 コーニンクレッカ フィリップス エヌ ヴェ 光源および波長変換構成要素を含む照明デバイス
US8377334B2 (en) 2009-12-23 2013-02-19 General Electric Company Coated phosphors, methods of making them, and articles comprising the same
US8057706B1 (en) 2010-07-27 2011-11-15 General Electric Company Moisture-resistant phosphor and associated method
JP4974310B2 (ja) 2010-10-15 2012-07-11 三菱化学株式会社 白色発光装置及び照明器具
MY161542A (en) 2011-04-08 2017-04-28 Shinetsu Chemical Co Preparation of complex fluoride and complex fluoride phosphor
EP2814905B1 (en) * 2012-02-16 2016-04-20 Koninklijke Philips N.V. Coated narrow band red-emitting fluorosilicates for semiconductor leds

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8252613B1 (en) * 2011-03-23 2012-08-28 General Electric Company Color stable manganese-doped phosphors

Also Published As

Publication number Publication date
JP2017503886A (ja) 2017-02-02
KR102443826B1 (ko) 2022-09-16
TWI659087B (zh) 2019-05-11
TW201536894A (zh) 2015-10-01
AU2014374223A1 (en) 2016-07-14
CA2934249A1 (en) 2015-07-09
MX387093B (es) 2025-03-19
CA2934249C (en) 2022-11-01
PH12016500972A1 (en) 2016-06-20
JP6496738B2 (ja) 2019-04-03
EP3090030B1 (en) 2018-02-21
EP3090030A1 (en) 2016-11-09
WO2015102876A1 (en) 2015-07-09
US20160376499A1 (en) 2016-12-29
US10131835B2 (en) 2018-11-20
MY174459A (en) 2020-04-20
PH12016500972B1 (en) 2016-06-20
IN2013CH06152A (enExample) 2015-07-03
CN105849226A (zh) 2016-08-10
KR20160105430A (ko) 2016-09-06
MX2016008668A (es) 2016-09-26

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