CN105849226A - 耐水分的磷光体组合物及相关方法 - Google Patents

耐水分的磷光体组合物及相关方法 Download PDF

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Publication number
CN105849226A
CN105849226A CN201480071866.XA CN201480071866A CN105849226A CN 105849226 A CN105849226 A CN 105849226A CN 201480071866 A CN201480071866 A CN 201480071866A CN 105849226 A CN105849226 A CN 105849226A
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China
Prior art keywords
sif
manganese
compositions
combinations
phosphor
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Pending
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CN201480071866.XA
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English (en)
Chinese (zh)
Inventor
A.A.塞特卢尔
R.J.里昂
P.K.纳马尔瓦
R.哈努曼塔
J.E.墨菲
F.加西亚
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General Electric Co
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General Electric Co
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Publication of CN105849226A publication Critical patent/CN105849226A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/615—Halogenides
    • C09K11/616—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
CN201480071866.XA 2013-12-30 2014-12-16 耐水分的磷光体组合物及相关方法 Pending CN105849226A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IN6152/CHE/2013 2013-12-30
IN6152CH2013 IN2013CH06152A (enExample) 2013-12-30 2014-12-16
PCT/US2014/070465 WO2015102876A1 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods

Publications (1)

Publication Number Publication Date
CN105849226A true CN105849226A (zh) 2016-08-10

Family

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Application Number Title Priority Date Filing Date
CN201480071866.XA Pending CN105849226A (zh) 2013-12-30 2014-12-16 耐水分的磷光体组合物及相关方法

Country Status (13)

Country Link
US (1) US10131835B2 (enExample)
EP (1) EP3090030B1 (enExample)
JP (1) JP6496738B2 (enExample)
KR (1) KR102443826B1 (enExample)
CN (1) CN105849226A (enExample)
AU (1) AU2014374223B2 (enExample)
CA (1) CA2934249C (enExample)
IN (1) IN2013CH06152A (enExample)
MX (1) MX387093B (enExample)
MY (1) MY174459A (enExample)
PH (1) PH12016500972A1 (enExample)
TW (1) TWI659087B (enExample)
WO (1) WO2015102876A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110072970A (zh) * 2016-11-17 2019-07-30 卡任特照明解决方案有限公司 涂覆的红线发射磷光体
CN111171815A (zh) * 2018-11-13 2020-05-19 厦门稀土材料研究所 一种氟化物发光材料的表面改性方法及其制备得到的氟化物发光材料
CN113214825A (zh) * 2021-04-26 2021-08-06 云南民族大学 一种固态照明led用多氟化物红光材料及其制备方法和应用
CN118076709A (zh) * 2021-10-13 2024-05-24 斯泰拉化工公司 红色荧光物质及其制造方法

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JP6549070B2 (ja) * 2015-09-10 2019-07-24 株式会社東芝 蛍光体及びその製造方法、並びに発光装置
US10883045B2 (en) * 2016-05-02 2021-01-05 Current Lighting Solutions, Llc Phosphor materials including fluidization materials for light sources
MY190456A (en) 2016-06-27 2022-04-21 Gen Electric Coated manganese doped phosphors
US10193030B2 (en) * 2016-08-08 2019-01-29 General Electric Company Composite materials having red emitting phosphors
US11193059B2 (en) 2016-12-13 2021-12-07 Current Lighting Solutions, Llc Processes for preparing color stable red-emitting phosphor particles having small particle size
US10608148B2 (en) 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications
KR20220151076A (ko) * 2021-05-04 2022-11-14 삼성전자주식회사 발광장치 및 식물생장용 조명장치
DE112022002865T5 (de) * 2021-05-31 2024-03-14 Nichia Corporation Lichtemittierendes Material und Verfahren zu dessen Herstellung

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CN1414886A (zh) * 1999-12-07 2003-04-30 环球产品营销有限责任公司 结合在织物材料中的长余辉磷光体
CN103003388A (zh) * 2010-07-27 2013-03-27 通用电气公司 抗湿磷光体和相关方法
WO2013121355A1 (en) * 2012-02-16 2013-08-22 Koninklijke Philips N.V. Coated narrow band red-emitting fluorosilicates for semiconductor leds
CN103429701A (zh) * 2011-03-23 2013-12-04 通用电气公司 颜色稳定的锰掺杂的磷光体

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JP2004155617A (ja) * 2002-11-07 2004-06-03 Konica Minolta Holdings Inc 無機化合物の製造方法
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US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US20070125984A1 (en) 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
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JP5396849B2 (ja) 2008-12-22 2014-01-22 住友金属鉱山株式会社 表面被覆層を有する硫化物蛍光体粒子とその製造方法
JP2010232381A (ja) * 2009-03-26 2010-10-14 Mitsubishi Chemicals Corp 半導体発光装置、並びに画像表示装置及び照明装置
JP5446511B2 (ja) * 2009-06-30 2014-03-19 三菱化学株式会社 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
JP5250520B2 (ja) * 2009-09-25 2013-07-31 パナソニック株式会社 被覆蛍光体及びｌｅｄ発光装置
KR20120115322A (ko) * 2009-12-17 2012-10-17 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 광원 및 파장 변환 요소를 구비한 조명 장치
US8377334B2 (en) 2009-12-23 2013-02-19 General Electric Company Coated phosphors, methods of making them, and articles comprising the same
EP2629341B8 (en) * 2010-10-15 2020-04-08 Mitsubishi Chemical Corporation White light emitting device and lighting device
MY167700A (en) * 2011-04-08 2018-09-21 Shinetsu Chemical Co Preparation of complex fluoride and complex fluoride phosphor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1414886A (zh) * 1999-12-07 2003-04-30 环球产品营销有限责任公司 结合在织物材料中的长余辉磷光体
CN103003388A (zh) * 2010-07-27 2013-03-27 通用电气公司 抗湿磷光体和相关方法
CN103429701A (zh) * 2011-03-23 2013-12-04 通用电气公司 颜色稳定的锰掺杂的磷光体
WO2013121355A1 (en) * 2012-02-16 2013-08-22 Koninklijke Philips N.V. Coated narrow band red-emitting fluorosilicates for semiconductor leds

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110072970A (zh) * 2016-11-17 2019-07-30 卡任特照明解决方案有限公司 涂覆的红线发射磷光体
CN110072970B (zh) * 2016-11-17 2022-07-05 卡任特照明解决方案有限公司 涂覆的红线发射磷光体
CN111171815A (zh) * 2018-11-13 2020-05-19 厦门稀土材料研究所 一种氟化物发光材料的表面改性方法及其制备得到的氟化物发光材料
CN113214825A (zh) * 2021-04-26 2021-08-06 云南民族大学 一种固态照明led用多氟化物红光材料及其制备方法和应用
CN118076709A (zh) * 2021-10-13 2024-05-24 斯泰拉化工公司 红色荧光物质及其制造方法

Also Published As

Publication number Publication date
US20160376499A1 (en) 2016-12-29
AU2014374223B2 (en) 2018-01-04
JP2017503886A (ja) 2017-02-02
JP6496738B2 (ja) 2019-04-03
IN2013CH06152A (enExample) 2015-07-03
PH12016500972B1 (en) 2016-06-20
CA2934249C (en) 2022-11-01
PH12016500972A1 (en) 2016-06-20
EP3090030B1 (en) 2018-02-21
MY174459A (en) 2020-04-20
KR102443826B1 (ko) 2022-09-16
WO2015102876A1 (en) 2015-07-09
MX2016008668A (es) 2016-09-26
CA2934249A1 (en) 2015-07-09
MX387093B (es) 2025-03-19
TW201536894A (zh) 2015-10-01
TWI659087B (zh) 2019-05-11
EP3090030A1 (en) 2016-11-09
KR20160105430A (ko) 2016-09-06
US10131835B2 (en) 2018-11-20
AU2014374223A1 (en) 2016-07-14

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