KR102443826B1 - 내습성 인광체 조성물 및 관련 방법 - Google Patents

내습성 인광체 조성물 및 관련 방법 Download PDF

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KR102443826B1
KR102443826B1 KR1020167019884A KR20167019884A KR102443826B1 KR 102443826 B1 KR102443826 B1 KR 102443826B1 KR 1020167019884 A KR1020167019884 A KR 1020167019884A KR 20167019884 A KR20167019884 A KR 20167019884A KR 102443826 B1 KR102443826 B1 KR 102443826B1
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sif
manganese
phosphor
composition
phosphor composition
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KR20160105430A (ko
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아난트 아치웃 세트루어
로버트 조셉 라이온스
프라산트 쿠마르 남말와르
라비쿠마르 하누만타
제임스 에드워드 머피
플로렌시오 가르시아
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제네럴 일렉트릭 컴퍼니
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/615—Halogenides
    • C09K11/616—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
KR1020167019884A 2013-12-30 2014-12-16 내습성 인광체 조성물 및 관련 방법 Active KR102443826B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IN6152/CHE/2013 2013-12-30
PCT/US2014/070465 WO2015102876A1 (en) 2013-12-30 2014-12-16 Moisture-resistant phosphor compositions and associate methods
IN6152CH2013 IN2013CH06152A (enExample) 2013-12-30 2014-12-16

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KR20160105430A KR20160105430A (ko) 2016-09-06
KR102443826B1 true KR102443826B1 (ko) 2022-09-16

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US (1) US10131835B2 (enExample)
EP (1) EP3090030B1 (enExample)
JP (1) JP6496738B2 (enExample)
KR (1) KR102443826B1 (enExample)
CN (1) CN105849226A (enExample)
AU (1) AU2014374223B2 (enExample)
CA (1) CA2934249C (enExample)
IN (1) IN2013CH06152A (enExample)
MX (1) MX387093B (enExample)
MY (1) MY174459A (enExample)
PH (1) PH12016500972B1 (enExample)
TW (1) TWI659087B (enExample)
WO (1) WO2015102876A1 (enExample)

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JP6549070B2 (ja) * 2015-09-10 2019-07-24 株式会社東芝 蛍光体及びその製造方法、並びに発光装置
US10883045B2 (en) 2016-05-02 2021-01-05 Current Lighting Solutions, Llc Phosphor materials including fluidization materials for light sources
KR20250057124A (ko) 2016-06-27 2025-04-28 제네럴 일렉트릭 컴퍼니 코팅된 망간 도핑 인광체
US10193030B2 (en) * 2016-08-08 2019-01-29 General Electric Company Composite materials having red emitting phosphors
CN110072970B (zh) * 2016-11-17 2022-07-05 卡任特照明解决方案有限公司 涂覆的红线发射磷光体
US11193059B2 (en) 2016-12-13 2021-12-07 Current Lighting Solutions, Llc Processes for preparing color stable red-emitting phosphor particles having small particle size
US10608148B2 (en) * 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications
CN111171815B (zh) * 2018-11-13 2021-12-17 厦门稀土材料研究所 一种氟化物发光材料的表面改性方法及其制备得到的氟化物发光材料
CN113214825B (zh) * 2021-04-26 2022-11-15 云南民族大学 一种固态照明led用多氟化物红光材料及其制备方法和应用
KR20220151076A (ko) * 2021-05-04 2022-11-14 삼성전자주식회사 발광장치 및 식물생장용 조명장치
DE112022002865T5 (de) * 2021-05-31 2024-03-14 Nichia Corporation Lichtemittierendes Material und Verfahren zu dessen Herstellung
JP2023058394A (ja) * 2021-10-13 2023-04-25 ステラケミファ株式会社 赤色蛍光体及びその製造方法

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JP2013533363A (ja) * 2010-07-27 2013-08-22 ゼネラル・エレクトリック・カンパニイ 耐湿性蛍光体及び関連する方法

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JP5250520B2 (ja) * 2009-09-25 2013-07-31 パナソニック株式会社 被覆蛍光体及びｌｅｄ発光装置
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JP2012178574A (ja) * 2010-10-15 2012-09-13 Mitsubishi Chemicals Corp 白色発光装置及び照明器具

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Publication number Publication date
JP2017503886A (ja) 2017-02-02
TWI659087B (zh) 2019-05-11
TW201536894A (zh) 2015-10-01
AU2014374223A1 (en) 2016-07-14
AU2014374223B2 (en) 2018-01-04
CA2934249A1 (en) 2015-07-09
MX387093B (es) 2025-03-19
CA2934249C (en) 2022-11-01
PH12016500972A1 (en) 2016-06-20
JP6496738B2 (ja) 2019-04-03
EP3090030B1 (en) 2018-02-21
EP3090030A1 (en) 2016-11-09
WO2015102876A1 (en) 2015-07-09
US20160376499A1 (en) 2016-12-29
US10131835B2 (en) 2018-11-20
MY174459A (en) 2020-04-20
PH12016500972B1 (en) 2016-06-20
IN2013CH06152A (enExample) 2015-07-03
CN105849226A (zh) 2016-08-10
KR20160105430A (ko) 2016-09-06
MX2016008668A (es) 2016-09-26

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