JP6474492B2 - 半導体圧力センサ - Google Patents

半導体圧力センサ Download PDF

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Publication number
JP6474492B2
JP6474492B2 JP2017530286A JP2017530286A JP6474492B2 JP 6474492 B2 JP6474492 B2 JP 6474492B2 JP 2017530286 A JP2017530286 A JP 2017530286A JP 2017530286 A JP2017530286 A JP 2017530286A JP 6474492 B2 JP6474492 B2 JP 6474492B2
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JP
Japan
Prior art keywords
resistor
membrane
output node
node
pressure sensor
Prior art date
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Expired - Fee Related
Application number
JP2017530286A
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English (en)
Japanese (ja)
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JP2018504588A (ja
JP2018504588A5 (enExample
Inventor
アポロニウス・ヤコブス・ファン・デル・ウィール
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Melexis Technologies NV
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Melexis Technologies NV
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Filing date
Publication date
Priority claimed from PCT/EP2014/077230 external-priority patent/WO2015086680A1/en
Application filed by Melexis Technologies NV filed Critical Melexis Technologies NV
Publication of JP2018504588A publication Critical patent/JP2018504588A/ja
Publication of JP2018504588A5 publication Critical patent/JP2018504588A5/ja
Application granted granted Critical
Publication of JP6474492B2 publication Critical patent/JP6474492B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/02—Arrangements for preventing, or for compensating for, effects of inclination or acceleration of the measuring device; Zero-setting means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
    • G01L9/065—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices with temperature compensating means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP2017530286A 2014-12-10 2015-12-08 半導体圧力センサ Expired - Fee Related JP6474492B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EPPCT/EP2014/077230 2014-12-10
PCT/EP2014/077230 WO2015086680A1 (en) 2013-12-11 2014-12-10 Semiconductor pressure sensor
EP15171268.4A EP3032235B1 (en) 2014-12-10 2015-06-09 Semiconductor pressure sensor
EP15171268.4 2015-06-09
PCT/EP2015/079010 WO2016091896A1 (en) 2014-12-10 2015-12-08 Semiconductor pressure sensor

Publications (3)

Publication Number Publication Date
JP2018504588A JP2018504588A (ja) 2018-02-15
JP2018504588A5 JP2018504588A5 (enExample) 2018-09-27
JP6474492B2 true JP6474492B2 (ja) 2019-02-27

Family

ID=53274454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017530286A Expired - Fee Related JP6474492B2 (ja) 2014-12-10 2015-12-08 半導体圧力センサ

Country Status (5)

Country Link
EP (1) EP3032235B1 (enExample)
JP (1) JP6474492B2 (enExample)
KR (1) KR20170095218A (enExample)
CN (1) CN107003198B (enExample)
WO (1) WO2016091896A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020058091A1 (en) 2018-09-18 2020-03-26 Unilever Plc Method of chemical monitoring the fat removal from surfaces
JP2020514678A (ja) * 2017-11-28 2020-05-21 デヤン エレクトリック カンパニー リミテッド 半導体圧力センサ

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3358309B1 (en) 2017-02-06 2019-04-24 Melexis Technologies SA Method and circuit for biasing and readout of resistive sensor structure
US10704969B2 (en) 2017-11-21 2020-07-07 The Boeing Company Stress sensor
CN109374158B (zh) * 2018-12-14 2024-08-13 华景传感科技（无锡）有限公司 一种压力传感器
CN113227954B (zh) 2018-12-20 2025-01-24 深圳纽迪瑞科技开发有限公司 压力感应装置、压力感应方法及电子终端
US11189536B2 (en) 2018-12-31 2021-11-30 Micron Technology, Inc. Method and apparatus for on-chip stress detection
DE102021200720B4 (de) 2021-01-27 2023-08-03 Infineon Technologies Ag Transistorbasierter stress-sensor und verfahren zum ermitteln einer gradienten-kompensierten mechanischen spannungskomponente
EP4421468B1 (en) * 2023-02-27 2025-02-12 Melexis Technologies NV Pressure sensor resistor configuration for stress compensation
EP4567393A1 (en) * 2023-12-04 2025-06-11 TE Connectivity Solutions GmbH Piezoresistive sensor element and piezoresistive pressure sensor with minimized long-term drift

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5217780A (en) * 1975-07-04 1977-02-09 Hitachi Ltd Pressure convertor with semi-conductor elements
CA1186163A (en) 1982-01-04 1985-04-30 James B. Starr Semiconductor pressure transducer
JPS60128673A (ja) 1983-12-16 1985-07-09 Hitachi Ltd 半導体感圧装置
US4777826A (en) * 1985-06-20 1988-10-18 Rosemount Inc. Twin film strain gauge system
WO1996022515A1 (en) * 1995-01-19 1996-07-25 Honeywell Inc. Apparatus for detection of a diaphragm rupture in a pressure sensor
JPH08279621A (ja) * 1995-04-03 1996-10-22 Motorola Inc 平衡圧力センサとその方法
JP4568982B2 (ja) * 2000-10-06 2010-10-27 株式会社デンソー 物理量検出装置
JP3891037B2 (ja) * 2002-05-21 2007-03-07 株式会社デンソー 半導体圧力センサおよび半導体圧力センサ用の半導体ウェハ
JP3915715B2 (ja) * 2003-03-07 2007-05-16 株式会社デンソー 半導体圧力センサ
ATE470844T1 (de) * 2004-09-24 2010-06-15 Grundfos As Drucksensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020514678A (ja) * 2017-11-28 2020-05-21 デヤン エレクトリック カンパニー リミテッド 半導体圧力センサ
WO2020058091A1 (en) 2018-09-18 2020-03-26 Unilever Plc Method of chemical monitoring the fat removal from surfaces

Also Published As

Publication number Publication date
JP2018504588A (ja) 2018-02-15
CN107003198A (zh) 2017-08-01
CN107003198B (zh) 2020-06-26
EP3032235B1 (en) 2017-09-20
WO2016091896A1 (en) 2016-06-16
EP3032235A1 (en) 2016-06-15
KR20170095218A (ko) 2017-08-22

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