JP6472093B2 - 紫外線発光素子及びそれを用いた電気機器 - Google Patents
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- 229910002704 AlGaN Inorganic materials 0.000 claims description 195
- 230000004888 barrier function Effects 0.000 claims description 66
- 239000000203 mixture Substances 0.000 claims description 44
- 229910052594 sapphire Inorganic materials 0.000 claims description 33
- 239000010980 sapphire Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 30
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- 229910002601 GaN Inorganic materials 0.000 description 4
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- VCZQFJFZMMALHB-UHFFFAOYSA-N tetraethylsilane Chemical compound CC[Si](CC)(CC)CC VCZQFJFZMMALHB-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34346—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser characterised by the materials of the barrier layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0213—Sapphire, quartz or diamond based substrates
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
- H01S5/2013—MQW barrier reflection layers
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
Description
Claims (23)
- サファイア基板と、n型AlGaN層と、発光層と、キャップ層と、電子障壁層と、p型GaN層からなるp型コンタクト層と、を備え、
前記発光層は、多重量子井戸構造を有し、
前記多重量子井戸構造は、各々が第1のAlGaN層からなる複数の障壁層と、各々が第2のAlGaN層からなる複数の井戸層と、を備え、
前記電子障壁層は、前記障壁層よりもAlの組成比が大きい第1のp型AlGaN層と、前記複数の井戸層よりもAlの組成比が大きく且つ前記第1のp型AlGaN層よりもAlの組成比の小さい第2のp型AlGaN層と、を備え、
前記第1のp型AlGaN層及び前記第2のp型AlGaN層は、Mgを含有させてあり、
前記キャップ層は、前記多重量子井戸構造における前記複数の井戸層のうち前記第1のp型AlGaN層に最も近い井戸層と、前記第1のp型AlGaN層と、の間に介在し、
前記キャップ層は、前記複数の井戸層よりもAlの組成比が大きく且つ前記第1のp型AlGaN層よりもAlの組成比が小さい第3のAlGaN層であり、
前記キャップ層の厚さは、1nm以上7nm以下であり、
前記n型AlGaN層と前記発光層と前記キャップ層と前記電子障壁層と前記p型コンタクト層とを備える多層構造は、前記サファイア基板側から、前記n型AlGaN層、前記発光層、前記キャップ層、前記電子障壁層、前記p型コンタクト層の順に並んでおり、
前記サファイア基板と前記n型AlGaN層との間に介在するバッファ層を備え、前記バッファ層は、Al x Ga 1-x N層(0<x≦1)により構成されている、
ことを特徴とする紫外線発光素子。 - 前記第3のAlGaN層は、アンドープのAlGaN層である、
ことを特徴とする請求項1記載の紫外線発光素子。 - 前記電子障壁層は、前記第1のp型AlGaN層と前記第2のp型AlGaN層とが、前記発光層の厚さ方向において交互に並んでいる、
ことを特徴とする請求項1又は2記載の紫外線発光素子。 - 前記電子障壁層は、前記第1のp型AlGaN層及び前記第2のp型AlGaN層それぞれを少なくとも2つ、備える、
ことを特徴とする請求項3記載の紫外線発光素子。 - 前記電子障壁層は、前記第1のp型AlGaN層及び前記第2のp型AlGaN層が2つずつであり、2つの前記第1のp型AlGaN層の厚さの合計が、7nm以上24nm以下である、
ことを特徴とする請求項4記載の紫外線発光素子。 - 前記電子障壁層は、前記第1のp型AlGaN層と前記第2のp型AlGaN層と前記第1のp型AlGaN層との積層構造を有し、2つの前記第1のp型AlGaN層の平均の厚さを前記第2のp型AlGaN層の厚さで除した値が、1.75より大きく14より小さい、
ことを特徴とする請求項3乃至5のいずれか一項に記載の紫外線発光素子。 - 前記電子障壁層は、前記第1のp型AlGaN層と前記第2のp型AlGaN層と前記第1のp型AlGaN層との積層構造を有し、前記キャップ層に最も近い前記第1のp型AlGaN層の厚さが、他の前記第1のp型AlGaN層の厚さよりも大きく、かつ、7nm以上12nm以下である、
ことを特徴とする請求項3乃至6のいずれか一項に記載の紫外線発光素子。 - 前記AlxGa1-xN層(0<x≦1)の(10−12)面に対するX線回折のωスキャンによるX線ロッキングカーブの半値幅が400arcsec以下である、
ことを特徴とする請求項1乃至7のいずれか一項に記載の紫外線発光素子。 - 前記バッファ層のバンドギャップエネルギが前記複数の井戸層のバンドギャップエネルギよりも大きい、
ことを特徴とする請求項1記載の紫外線発光素子。 - 前記バッファ層は、AlN層である、
ことを特徴とする請求項1又は9記載の紫外線発光素子。 - 前記バッファ層の厚さは、3μm以上6μm以下である、
ことを特徴とする請求項1乃至10のいずれか一項に記載の紫外線発光素子。 - 前記バッファ層の内部に空隙が存在する、
ことを特徴とする請求項11記載の紫外線発光素子。 - 前記空隙は、前記バッファ層の厚さ方向において前記サファイア基板と前記バッファ層との界面から2μmまでの範囲に存在する、
ことを特徴とする請求項12記載の紫外線発光素子。 - 前記n型AlGaN層のAlの組成比が0.50以上0.70以下である、
ことを特徴とする請求項1乃至13のいずれか一項に記載の紫外線発光素子。 - 前記n型AlGaN層のドナー不純物がSiであり、前記n型AlGaN層のSiのドーピング濃度が5×1018cm-3以上5×1019cm-3以下である、
ことを特徴とする請求項14記載の紫外線発光素子。 - 前記n型AlGaN層の厚さは、1μm以上3μm以下である、
ことを特徴とする請求項14又は15記載の紫外線発光素子。 - 前記障壁層の厚さは、2nm以上20nm以下である、
ことを特徴とする請求項1乃至16のいずれか一項に記載の紫外線発光素子。 - 前記障壁層は、Siがドーピングされており、Siの濃度が、5×1017cm-3以上5×1018cm-3以下である、
ことを特徴とする請求項17記載の紫外線発光素子。 - 前記複数の井戸層の厚さは、0.5nm以上3nm以下である、
ことを特徴とする請求項1乃至18のいずれか一項に記載の紫外線発光素子。 - 前記p型コンタクト層の厚さは、10nm以上500nm以下である、
ことを特徴とする請求項1乃至19のいずれか一項に記載の紫外線発光素子。 - 前記p型コンタクト層のアクセプタ不純物がMgであり、前記p型コンタクト層のMgのドーピング濃度が1×1020cm-3以上5×1020cm-3以下である、
ことを特徴とする請求項20記載の紫外線発光素子。 - 前記複数の井戸層の発光ピーク波長が260nm〜285nmの紫外波長域にある、
ことを特徴とする請求項1乃至21のいずれか一項に記載の紫外線発光素子。 - 請求項1乃至22のいずれか一項に記載の紫外線発光素子と、機器本体と、を備える、
ことを特徴とする電気機器。
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CN105514233B (zh) * | 2015-11-30 | 2017-12-15 | 华灿光电股份有限公司 | 高发光效率发光二极管外延片及其制备方法 |
JP6573076B2 (ja) * | 2016-02-01 | 2019-09-11 | パナソニック株式会社 | 紫外線発光素子 |
WO2017134713A1 (ja) * | 2016-02-01 | 2017-08-10 | パナソニック株式会社 | 紫外線発光素子 |
US10340416B2 (en) * | 2016-02-26 | 2019-07-02 | Riken | Crystal substrate, ultraviolet light-emitting device, and manufacturing methods therefor |
TWI584498B (zh) * | 2016-05-19 | 2017-05-21 | 隆達電子股份有限公司 | 發光二極體磊晶結構 |
WO2017222341A1 (ko) * | 2016-06-24 | 2017-12-28 | 엘지이노텍 주식회사 | 반도체 소자 및 이를 포함하는 반도체 소자 패키지 |
KR102552889B1 (ko) * | 2016-08-31 | 2023-07-10 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자, 반도체 소자 패키지, 및 반도체 소자 제조방법 |
US10644199B2 (en) * | 2016-09-14 | 2020-05-05 | Stanley Electric Co., Ltd. | Group III nitride stacked body, and semiconductor device having the stacked body |
CN107394019B (zh) * | 2017-07-31 | 2019-07-12 | 安徽三安光电有限公司 | 一种半导体发光元件及其制备方法 |
US11557693B2 (en) * | 2017-07-31 | 2023-01-17 | Xiamen San'an Optoelectronics Co., Ltd. | Semiconductor light emitting device |
US10978612B2 (en) * | 2017-07-31 | 2021-04-13 | Xiamen San'an Optoelectronics Co., Ltd | Semiconductor light emitting device |
EP4071835A1 (en) * | 2017-11-07 | 2022-10-12 | Gallium Enterprises Pty Ltd | Buried activated p-(al,in)gan layers |
JP6727186B2 (ja) * | 2017-12-28 | 2020-07-22 | 日機装株式会社 | 窒化物半導体素子の製造方法 |
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CN110112273B (zh) * | 2019-05-10 | 2020-06-30 | 马鞍山杰生半导体有限公司 | 一种深紫外led外延结构及其制备方法和深紫外led |
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JP3761589B2 (ja) | 1993-03-26 | 2006-03-29 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JP2002314203A (ja) * | 2001-04-12 | 2002-10-25 | Pioneer Electronic Corp | 3族窒化物半導体レーザ及びその製造方法 |
JP2002324913A (ja) * | 2001-04-25 | 2002-11-08 | Ricoh Co Ltd | Iii族窒化物半導体およびその作製方法および半導体装置およびその作製方法 |
JP5384783B2 (ja) | 2005-02-18 | 2014-01-08 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 半導体発光素子のための逆分極発光領域 |
JP2006261358A (ja) * | 2005-03-17 | 2006-09-28 | Fujitsu Ltd | 半導体発光素子 |
US8044430B2 (en) * | 2006-01-18 | 2011-10-25 | Panasonic Corporation | Nitride semiconductor light-emitting device comprising multiple semiconductor layers having substantially uniform N-type dopant concentration |
JP5227870B2 (ja) | 2009-03-30 | 2013-07-03 | 日本碍子株式会社 | エピタキシャル基板、半導体素子構造、およびエピタキシャル基板の作製方法 |
JP5589380B2 (ja) | 2009-12-28 | 2014-09-17 | 日亜化学工業株式会社 | 窒化物半導体素子 |
JP2011187591A (ja) * | 2010-03-08 | 2011-09-22 | Uv Craftory Co Ltd | 窒化物半導体紫外線発光素子 |
JP5400001B2 (ja) | 2010-08-23 | 2014-01-29 | 日本電信電話株式会社 | Iii族窒化物半導体の深紫外発光素子構造 |
WO2012061166A1 (en) * | 2010-10-25 | 2012-05-10 | Binoptics Corporation | Long semiconductor laser cavity in a compact chip |
JP2013214700A (ja) | 2012-03-07 | 2013-10-17 | Toshiba Corp | 半導体発光素子 |
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