JP6469996B2 - 撮像素子および内視鏡装置 - Google Patents

撮像素子および内視鏡装置 Download PDF

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Publication number
JP6469996B2
JP6469996B2 JP2014183211A JP2014183211A JP6469996B2 JP 6469996 B2 JP6469996 B2 JP 6469996B2 JP 2014183211 A JP2014183211 A JP 2014183211A JP 2014183211 A JP2014183211 A JP 2014183211A JP 6469996 B2 JP6469996 B2 JP 6469996B2
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Japan
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light
substrate
band
pixel
wavelength band
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JP2014183211A
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English (en)
Japanese (ja)
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JP2016058866A (ja
JP2016058866A5 (enExample
Inventor
福永　康弘
康弘 福永
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Olympus Corp
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Olympus Corp
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Priority to JP2014183211A priority Critical patent/JP6469996B2/ja
Priority to PCT/JP2015/075487 priority patent/WO2016039345A1/ja
Priority to DE112015003666.0T priority patent/DE112015003666T5/de
Priority to CN201580047380.7A priority patent/CN107079136B/zh
Publication of JP2016058866A publication Critical patent/JP2016058866A/ja
Priority to US15/450,520 priority patent/US10335019B2/en
Publication of JP2016058866A5 publication Critical patent/JP2016058866A5/ja
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/043—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances for fluorescence imaging
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/042—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by a proximal camera, e.g. a CCD camera
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2423—Optical details of the distal end
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2453—Optical details of the proximal end
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G02B23/2484—Arrangements in relation to a camera or imaging device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/12—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with one sensor only
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182—Colour image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182—Colour image sensors
    • H10F39/1825—Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184—Infrared image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Surgery (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Astronomy & Astrophysics (AREA)
  • General Physics & Mathematics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Veterinary Medicine (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Radiology & Medical Imaging (AREA)
  • Pathology (AREA)
  • Biophysics (AREA)
  • Endoscopes (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
  • Color Television Image Signal Generators (AREA)
  • Studio Devices (AREA)
JP2014183211A 2014-09-09 2014-09-09 撮像素子および内視鏡装置 Expired - Fee Related JP6469996B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014183211A JP6469996B2 (ja) 2014-09-09 2014-09-09 撮像素子および内視鏡装置
PCT/JP2015/075487 WO2016039345A1 (ja) 2014-09-09 2015-09-08 撮像素子および内視鏡装置
DE112015003666.0T DE112015003666T5 (de) 2014-09-09 2015-09-08 Bildaufnahmeelement und Endoskopvorrichtung
CN201580047380.7A CN107079136B (zh) 2014-09-09 2015-09-08 摄像元件和内窥镜装置
US15/450,520 US10335019B2 (en) 2014-09-09 2017-03-06 Image pickup element and endoscope device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014183211A JP6469996B2 (ja) 2014-09-09 2014-09-09 撮像素子および内視鏡装置

Publications (3)

Publication Number Publication Date
JP2016058866A JP2016058866A (ja) 2016-04-21
JP2016058866A5 JP2016058866A5 (enExample) 2017-10-19
JP6469996B2 true JP6469996B2 (ja) 2019-02-13

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JP2014183211A Expired - Fee Related JP6469996B2 (ja) 2014-09-09 2014-09-09 撮像素子および内視鏡装置

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US (1) US10335019B2 (enExample)
JP (1) JP6469996B2 (enExample)
CN (1) CN107079136B (enExample)
DE (1) DE112015003666T5 (enExample)
WO (1) WO2016039345A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6660824B2 (ja) * 2016-06-24 2020-03-11 富士フイルム株式会社 内視鏡装置
JP6660823B2 (ja) * 2016-06-24 2020-03-11 富士フイルム株式会社 内視鏡装置
JP7140469B2 (ja) * 2016-07-15 2022-09-21 キヤノン株式会社 光電変換装置、および、撮像システム
JP2018081946A (ja) * 2016-11-14 2018-05-24 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP6746476B2 (ja) * 2016-11-24 2020-08-26 キヤノン株式会社 撮像装置、撮像システム、および、移動体
WO2018225122A1 (ja) * 2017-06-05 2018-12-13 オリンパス株式会社 内視鏡装置
JP6920110B2 (ja) * 2017-06-13 2021-08-18 ルネサスエレクトロニクス株式会社 固体撮像素子およびその製造方法
CN108881533B (zh) * 2018-06-06 2020-09-11 北京小米移动软件有限公司 终端设备
US10985201B2 (en) * 2018-09-28 2021-04-20 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor including silicon over germanium layer
CN119235237A (zh) 2018-11-30 2025-01-03 直观外科手术操作公司 医学成像系统和方法
CN111272715B (zh) * 2018-12-04 2023-03-14 长春长光华大智造测序设备有限公司 一种基因测序仪的荧光成像系统
JP2022026845A (ja) * 2020-07-31 2022-02-10 浜松ホトニクス株式会社 撮像装置
JP2022049487A (ja) * 2020-09-16 2022-03-29 ソニーグループ株式会社 固体撮像装置及び電子機器

Family Cites Families (17)

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JP3962122B2 (ja) 1996-11-20 2007-08-22 オリンパス株式会社 内視鏡装置
JP3938675B2 (ja) * 2001-10-26 2007-06-27 オリンパス株式会社 光源装置
JP4817584B2 (ja) * 2002-05-08 2011-11-16 キヤノン株式会社 カラー撮像素子
US7129466B2 (en) 2002-05-08 2006-10-31 Canon Kabushiki Kaisha Color image pickup device and color light-receiving device
JP4507769B2 (ja) * 2004-08-31 2010-07-21 ソニー株式会社 固体撮像素子、カメラモジュール及び電子機器モジュール
JP4984634B2 (ja) * 2005-07-21 2012-07-25 ソニー株式会社 物理情報取得方法および物理情報取得装置
US8111286B2 (en) * 2006-09-28 2012-02-07 Fujifilm Corporation Image processing apparatus, endoscope, and computer readable medium
JP5191327B2 (ja) * 2008-09-17 2013-05-08 富士フイルム株式会社 画像取得装置および画像取得装置の作動方法
JP4772843B2 (ja) * 2008-09-17 2011-09-14 シャープ株式会社 半導体装置及びその製造方法
ATE553692T1 (de) 2008-09-17 2012-05-15 Fujifilm Corp Bilderfassungsverfahren und bilderfassungsvorrichtung
KR20120114895A (ko) * 2011-04-08 2012-10-17 삼성전자주식회사 내시경 장치 및 상기 내시경 장치의 영상 획득 방법
JP2013070030A (ja) * 2011-09-06 2013-04-18 Sony Corp 撮像素子、電子機器、並びに、情報処理装置
US20130075607A1 (en) * 2011-09-22 2013-03-28 Manoj Bikumandla Image sensors having stacked photodetector arrays
US9057228B2 (en) * 2012-06-29 2015-06-16 Baker Hughes Incorporated Wellbore tools with non-hydrocarbon-based greases and methods of making such wellbore tools
JPWO2014010470A1 (ja) * 2012-07-12 2016-06-23 ソニー株式会社 送信装置、情報処理方法、プログラム、受信装置、およびアプリケーション連動システム
DE102012213467B4 (de) * 2012-07-31 2023-12-07 Coretronic Corporation Vorrichtung zum bereitstellen elektromagnetischer strahlung
JP6076093B2 (ja) 2013-01-08 2017-02-08 オリンパス株式会社 撮像装置

Also Published As

Publication number Publication date
CN107079136A (zh) 2017-08-18
US20170172393A1 (en) 2017-06-22
CN107079136B (zh) 2019-06-21
WO2016039345A1 (ja) 2016-03-17
JP2016058866A (ja) 2016-04-21
US10335019B2 (en) 2019-07-02
DE112015003666T5 (de) 2017-05-18

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