DE112015003666T5 - Bildaufnahmeelement und Endoskopvorrichtung - Google Patents

Bildaufnahmeelement und Endoskopvorrichtung Download PDF

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Publication number
DE112015003666T5
DE112015003666T5 DE112015003666.0T DE112015003666T DE112015003666T5 DE 112015003666 T5 DE112015003666 T5 DE 112015003666T5 DE 112015003666 T DE112015003666 T DE 112015003666T DE 112015003666 T5 DE112015003666 T5 DE 112015003666T5
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DE
Germany
Prior art keywords
light
substrate
pixel
wavelength band
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112015003666.0T
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German (de)
English (en)
Inventor
Yasuhiro Fukunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of DE112015003666T5 publication Critical patent/DE112015003666T5/de
Withdrawn legal-status Critical Current

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/043—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances for fluorescence imaging
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/042—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by a proximal camera, e.g. a CCD camera
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2423—Optical details of the distal end
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2453—Optical details of the proximal end
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G02B23/2484—Arrangements in relation to a camera or imaging device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/12—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with one sensor only
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182—Colour image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182—Colour image sensors
    • H10F39/1825—Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184—Infrared image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Surgery (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Astronomy & Astrophysics (AREA)
  • General Physics & Mathematics (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biophysics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Pathology (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Endoscopes (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
  • Color Television Image Signal Generators (AREA)
  • Studio Devices (AREA)
DE112015003666.0T 2014-09-09 2015-09-08 Bildaufnahmeelement und Endoskopvorrichtung Withdrawn DE112015003666T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014183211A JP6469996B2 (ja) 2014-09-09 2014-09-09 撮像素子および内視鏡装置
JP2014-183211 2014-09-09
PCT/JP2015/075487 WO2016039345A1 (ja) 2014-09-09 2015-09-08 撮像素子および内視鏡装置

Publications (1)

Publication Number Publication Date
DE112015003666T5 true DE112015003666T5 (de) 2017-05-18

Family

ID=55459089

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112015003666.0T Withdrawn DE112015003666T5 (de) 2014-09-09 2015-09-08 Bildaufnahmeelement und Endoskopvorrichtung

Country Status (5)

Country Link
US (1) US10335019B2 (enExample)
JP (1) JP6469996B2 (enExample)
CN (1) CN107079136B (enExample)
DE (1) DE112015003666T5 (enExample)
WO (1) WO2016039345A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6660823B2 (ja) * 2016-06-24 2020-03-11 富士フイルム株式会社 内視鏡装置
JP6660824B2 (ja) * 2016-06-24 2020-03-11 富士フイルム株式会社 内視鏡装置
JP7140469B2 (ja) * 2016-07-15 2022-09-21 キヤノン株式会社 光電変換装置、および、撮像システム
JP2018081946A (ja) * 2016-11-14 2018-05-24 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP6746476B2 (ja) * 2016-11-24 2020-08-26 キヤノン株式会社 撮像装置、撮像システム、および、移動体
WO2018225122A1 (ja) * 2017-06-05 2018-12-13 オリンパス株式会社 内視鏡装置
JP6920110B2 (ja) * 2017-06-13 2021-08-18 ルネサスエレクトロニクス株式会社 固体撮像素子およびその製造方法
CN108881533B (zh) * 2018-06-06 2020-09-11 北京小米移动软件有限公司 终端设备
US10985201B2 (en) * 2018-09-28 2021-04-20 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor including silicon over germanium layer
CN119235237A (zh) 2018-11-30 2025-01-03 直观外科手术操作公司 医学成像系统和方法
CN111272715B (zh) * 2018-12-04 2023-03-14 长春长光华大智造测序设备有限公司 一种基因测序仪的荧光成像系统
JP2022026845A (ja) * 2020-07-31 2022-02-10 浜松ホトニクス株式会社 撮像装置
JP2022049487A (ja) * 2020-09-16 2022-03-29 ソニーグループ株式会社 固体撮像装置及び電子機器

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3962122B2 (ja) 1996-11-20 2007-08-22 オリンパス株式会社 内視鏡装置
JP3938675B2 (ja) * 2001-10-26 2007-06-27 オリンパス株式会社 光源装置
JP4817584B2 (ja) * 2002-05-08 2011-11-16 キヤノン株式会社 カラー撮像素子
US7129466B2 (en) 2002-05-08 2006-10-31 Canon Kabushiki Kaisha Color image pickup device and color light-receiving device
JP4507769B2 (ja) * 2004-08-31 2010-07-21 ソニー株式会社 固体撮像素子、カメラモジュール及び電子機器モジュール
JP4984634B2 (ja) * 2005-07-21 2012-07-25 ソニー株式会社 物理情報取得方法および物理情報取得装置
US8111286B2 (en) * 2006-09-28 2012-02-07 Fujifilm Corporation Image processing apparatus, endoscope, and computer readable medium
JP4772843B2 (ja) * 2008-09-17 2011-09-14 シャープ株式会社 半導体装置及びその製造方法
EP2165643B1 (en) 2008-09-17 2012-04-18 FUJIFILM Corporation Image obtaining method and image obtaining apparatus
JP5191327B2 (ja) * 2008-09-17 2013-05-08 富士フイルム株式会社 画像取得装置および画像取得装置の作動方法
KR20120114895A (ko) * 2011-04-08 2012-10-17 삼성전자주식회사 내시경 장치 및 상기 내시경 장치의 영상 획득 방법
JP2013070030A (ja) * 2011-09-06 2013-04-18 Sony Corp 撮像素子、電子機器、並びに、情報処理装置
US20130075607A1 (en) * 2011-09-22 2013-03-28 Manoj Bikumandla Image sensors having stacked photodetector arrays
US9057228B2 (en) * 2012-06-29 2015-06-16 Baker Hughes Incorporated Wellbore tools with non-hydrocarbon-based greases and methods of making such wellbore tools
WO2014010470A1 (ja) * 2012-07-12 2014-01-16 ソニー株式会社 送信装置、情報処理方法、プログラム、受信装置、およびアプリケーション連動システム
DE102012213467B4 (de) * 2012-07-31 2023-12-07 Coretronic Corporation Vorrichtung zum bereitstellen elektromagnetischer strahlung
JP6076093B2 (ja) * 2013-01-08 2017-02-08 オリンパス株式会社 撮像装置

Also Published As

Publication number Publication date
US10335019B2 (en) 2019-07-02
WO2016039345A1 (ja) 2016-03-17
US20170172393A1 (en) 2017-06-22
JP6469996B2 (ja) 2019-02-13
CN107079136A (zh) 2017-08-18
JP2016058866A (ja) 2016-04-21
CN107079136B (zh) 2019-06-21

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