JP6465368B2 - 混合グラファイトを用いた放熱材およびその製造方法 - Google Patents
混合グラファイトを用いた放熱材およびその製造方法 Download PDFInfo
- Publication number
- JP6465368B2 JP6465368B2 JP2017100415A JP2017100415A JP6465368B2 JP 6465368 B2 JP6465368 B2 JP 6465368B2 JP 2017100415 A JP2017100415 A JP 2017100415A JP 2017100415 A JP2017100415 A JP 2017100415A JP 6465368 B2 JP6465368 B2 JP 6465368B2
- Authority
- JP
- Japan
- Prior art keywords
- graphite
- mixed
- expanded graphite
- filler
- expanded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 216
- 229910002804 graphite Inorganic materials 0.000 title claims description 199
- 239000010439 graphite Substances 0.000 title claims description 199
- 239000000463 material Substances 0.000 title claims description 53
- 230000017525 heat dissipation Effects 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000000945 filler Substances 0.000 claims description 52
- 239000002245 particle Substances 0.000 claims description 38
- 229910021383 artificial graphite Inorganic materials 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 22
- 238000002156 mixing Methods 0.000 claims description 19
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- 229910021382 natural graphite Inorganic materials 0.000 claims description 17
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 15
- 239000004917 carbon fiber Substances 0.000 claims description 15
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052582 BN Inorganic materials 0.000 claims description 14
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 239000011231 conductive filler Substances 0.000 claims description 11
- 238000005187 foaming Methods 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 6
- 238000010298 pulverizing process Methods 0.000 claims description 6
- 230000003472 neutralizing effect Effects 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 16
- 239000000203 mixture Substances 0.000 description 8
- 239000000835 fiber Substances 0.000 description 7
- 239000003973 paint Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/046—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/04—Inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017100415A JP6465368B2 (ja) | 2016-07-28 | 2017-05-19 | 混合グラファイトを用いた放熱材およびその製造方法 |
| KR1020170090963A KR101838853B1 (ko) | 2016-07-28 | 2017-07-18 | 혼합 그래파이트를 이용한 방열재 및 그의 제조방법 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017530929A JPWO2017018493A1 (ja) | 2015-07-29 | 2016-07-28 | 混合グラファイトを用いた放熱材およびその製造方法 |
| JP2017530929 | 2016-07-28 | ||
| JP2017100415A JP6465368B2 (ja) | 2016-07-28 | 2017-05-19 | 混合グラファイトを用いた放熱材およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018026527A JP2018026527A (ja) | 2018-02-15 |
| JP2018026527A5 JP2018026527A5 (enExample) | 2018-08-23 |
| JP6465368B2 true JP6465368B2 (ja) | 2019-02-06 |
Family
ID=61193229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017100415A Active JP6465368B2 (ja) | 2016-07-28 | 2017-05-19 | 混合グラファイトを用いた放熱材およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6465368B2 (enExample) |
| KR (1) | KR101838853B1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210003051A (ko) * | 2019-07-01 | 2021-01-11 | 씨트론 어드밴스드 머티리얼 씨오 엘티디 | 탄성 열-방출 구조 및 전자 장치 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101899854B1 (ko) * | 2018-04-02 | 2018-11-08 | 재단법인 철원플라즈마 산업기술연구원 | 수직 열전도도를 향상시킨 질화붕소 기반 방열 필러, 방열 시트 및 그 제조방법 |
| KR20220070842A (ko) | 2020-11-23 | 2022-05-31 | 삼성전자주식회사 | 방열 구조 및 이를 포함하는 전자 장치 |
| CN112357915A (zh) * | 2020-12-02 | 2021-02-12 | 武汉言诺嘉科技有限公司 | 高导热及缓冲性好的液晶屏用石墨烯薄膜及其制备方法 |
| CN114854326A (zh) * | 2021-02-04 | 2022-08-05 | 德莎欧洲股份公司 | 一种丙烯酸胶带及包含其的电子产品 |
| JP2023056922A (ja) | 2021-10-08 | 2023-04-20 | 大日本印刷株式会社 | 波長変換シート用フィルム、波長変換シート、バックライト、及び、表示装置 |
| CN114573358B (zh) * | 2022-01-26 | 2023-05-26 | 常州富烯科技股份有限公司 | 石墨烯导热膜、石墨烯导热片、制备方法及模具 |
| KR102722204B1 (ko) * | 2022-05-11 | 2024-10-25 | (주)테라시스 | 바인더가 코팅된 팽창 흑연 및 질화 붕소를 포함하는 방열시트 및 이의 제조방법 |
| KR102702214B1 (ko) * | 2022-08-12 | 2024-09-04 | 주식회사 이엔플러스 | 열전도성 방열 시트 및 그 제조 방법 |
| US20240384146A1 (en) * | 2023-05-17 | 2024-11-21 | Japan Matex Co., Ltd. | Heat dissipating laminate |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003168882A (ja) * | 2001-11-30 | 2003-06-13 | Sony Corp | 熱伝導性シート |
| WO2005019132A1 (ja) * | 2003-08-26 | 2005-03-03 | Matsushita Electric Industrial Co., Ltd. | 高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム |
| JP2005252190A (ja) * | 2004-03-08 | 2005-09-15 | Kotobuki Kogyo Kk | 放熱板とその製造方法 |
| JP2006298718A (ja) * | 2005-04-22 | 2006-11-02 | Japan Matekkusu Kk | 膨張黒鉛シート及びその製造方法 |
| JP2007291267A (ja) | 2006-04-26 | 2007-11-08 | Teijin Ltd | 熱伝導性成形材料及びこれを用いた成形シート |
| JP2012104628A (ja) | 2010-11-10 | 2012-05-31 | Panasonic Corp | 熱伝導シート |
| JP2012195467A (ja) * | 2011-03-17 | 2012-10-11 | Sansha Electric Mfg Co Ltd | 放熱板およびその製造方法 |
| KR101343568B1 (ko) * | 2013-05-29 | 2013-12-20 | 주식회사 그라셀 | 고밀도 압축가공 팽창흑연 입자를 포함하는 복합흑연 방열재 및 그 제조 방법 |
| JP2015046557A (ja) * | 2013-08-29 | 2015-03-12 | Jnc株式会社 | 放熱器 |
| JP5582553B1 (ja) * | 2014-05-02 | 2014-09-03 | 清二 加川 | 高熱伝導率の放熱シート及びその製造方法 |
| CN106573779B (zh) * | 2014-12-02 | 2021-06-18 | 积水化学工业株式会社 | 导热片材及其制造方法 |
| WO2016189850A1 (ja) * | 2015-05-28 | 2016-12-01 | 日本ゼオン株式会社 | 絶縁性熱伝導シートおよびその製造方法 |
| JP2017034219A (ja) * | 2015-07-29 | 2017-02-09 | ジャパンマテックス株式会社 | 混合グラファイトを用いた放熱材 |
-
2017
- 2017-05-19 JP JP2017100415A patent/JP6465368B2/ja active Active
- 2017-07-18 KR KR1020170090963A patent/KR101838853B1/ko active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210003051A (ko) * | 2019-07-01 | 2021-01-11 | 씨트론 어드밴스드 머티리얼 씨오 엘티디 | 탄성 열-방출 구조 및 전자 장치 |
| KR102417851B1 (ko) | 2019-07-01 | 2022-07-05 | 씨트론 어드밴스드 머티리얼 씨오 엘티디 | 탄성 열-방출 구조 및 전자 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018026527A (ja) | 2018-02-15 |
| KR20180013724A (ko) | 2018-02-07 |
| KR101838853B1 (ko) | 2018-04-27 |
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