KR101838853B1 - 혼합 그래파이트를 이용한 방열재 및 그의 제조방법 - Google Patents

혼합 그래파이트를 이용한 방열재 및 그의 제조방법 Download PDF

Info

Publication number
KR101838853B1
KR101838853B1 KR1020170090963A KR20170090963A KR101838853B1 KR 101838853 B1 KR101838853 B1 KR 101838853B1 KR 1020170090963 A KR1020170090963 A KR 1020170090963A KR 20170090963 A KR20170090963 A KR 20170090963A KR 101838853 B1 KR101838853 B1 KR 101838853B1
Authority
KR
South Korea
Prior art keywords
graphite
mixed
sheet
filler
expanded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170090963A
Other languages
English (en)
Korean (ko)
Other versions
KR20180013724A (ko
Inventor
카츠우로 츠카모토
히로아키 츠카모토
유조 나카무라
Original Assignee
재팬 마텍스 컴퍼니 리미티드
김광일
박상구
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2016/072224 external-priority patent/WO2017018493A1/ja
Application filed by 재팬 마텍스 컴퍼니 리미티드, 김광일, 박상구 filed Critical 재팬 마텍스 컴퍼니 리미티드
Publication of KR20180013724A publication Critical patent/KR20180013724A/ko
Application granted granted Critical
Publication of KR101838853B1 publication Critical patent/KR101838853B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/046—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/04—Inorganic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
KR1020170090963A 2016-07-28 2017-07-18 혼합 그래파이트를 이용한 방열재 및 그의 제조방법 Active KR101838853B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPPCT/JP2016/072224 2016-07-28
PCT/JP2016/072224 WO2017018493A1 (ja) 2015-07-29 2016-07-28 混合グラファイトを用いた放熱材およびその製造方法
JP2017100415A JP6465368B2 (ja) 2016-07-28 2017-05-19 混合グラファイトを用いた放熱材およびその製造方法
JPJP-P-2017-100415 2017-05-19

Publications (2)

Publication Number Publication Date
KR20180013724A KR20180013724A (ko) 2018-02-07
KR101838853B1 true KR101838853B1 (ko) 2018-04-27

Family

ID=61193229

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170090963A Active KR101838853B1 (ko) 2016-07-28 2017-07-18 혼합 그래파이트를 이용한 방열재 및 그의 제조방법

Country Status (2)

Country Link
JP (1) JP6465368B2 (enExample)
KR (1) KR101838853B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240022863A (ko) * 2022-08-12 2024-02-20 주식회사 이엔플러스 열전도성 방열 시트 및 그 제조 방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101899854B1 (ko) * 2018-04-02 2018-11-08 재단법인 철원플라즈마 산업기술연구원 수직 열전도도를 향상시킨 질화붕소 기반 방열 필러, 방열 시트 및 그 제조방법
CN112188791A (zh) * 2019-07-01 2021-01-05 河南烯力新材料科技有限公司 弹性散热结构和电子装置
KR20220070842A (ko) 2020-11-23 2022-05-31 삼성전자주식회사 방열 구조 및 이를 포함하는 전자 장치
CN112357915A (zh) * 2020-12-02 2021-02-12 武汉言诺嘉科技有限公司 高导热及缓冲性好的液晶屏用石墨烯薄膜及其制备方法
CN114854326A (zh) * 2021-02-04 2022-08-05 德莎欧洲股份公司 一种丙烯酸胶带及包含其的电子产品
JP2023056922A (ja) 2021-10-08 2023-04-20 大日本印刷株式会社 波長変換シート用フィルム、波長変換シート、バックライト、及び、表示装置
CN114573358B (zh) * 2022-01-26 2023-05-26 常州富烯科技股份有限公司 石墨烯导热膜、石墨烯导热片、制备方法及模具
KR102722204B1 (ko) * 2022-05-11 2024-10-25 (주)테라시스 바인더가 코팅된 팽창 흑연 및 질화 붕소를 포함하는 방열시트 및 이의 제조방법
US20240384146A1 (en) * 2023-05-17 2024-11-21 Japan Matex Co., Ltd. Heat dissipating laminate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168882A (ja) 2001-11-30 2003-06-13 Sony Corp 熱伝導性シート
JP2007291267A (ja) 2006-04-26 2007-11-08 Teijin Ltd 熱伝導性成形材料及びこれを用いた成形シート
JP2012104628A (ja) 2010-11-10 2012-05-31 Panasonic Corp 熱伝導シート
JP2012195467A (ja) 2011-03-17 2012-10-11 Sansha Electric Mfg Co Ltd 放熱板およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005019132A1 (ja) * 2003-08-26 2005-03-03 Matsushita Electric Industrial Co., Ltd. 高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム
JP2005252190A (ja) * 2004-03-08 2005-09-15 Kotobuki Kogyo Kk 放熱板とその製造方法
JP2006298718A (ja) * 2005-04-22 2006-11-02 Japan Matekkusu Kk 膨張黒鉛シート及びその製造方法
KR101343568B1 (ko) * 2013-05-29 2013-12-20 주식회사 그라셀 고밀도 압축가공 팽창흑연 입자를 포함하는 복합흑연 방열재 및 그 제조 방법
JP2015046557A (ja) * 2013-08-29 2015-03-12 Jnc株式会社 放熱器
JP5582553B1 (ja) * 2014-05-02 2014-09-03 清二 加川 高熱伝導率の放熱シート及びその製造方法
CN106573779B (zh) * 2014-12-02 2021-06-18 积水化学工业株式会社 导热片材及其制造方法
WO2016189850A1 (ja) * 2015-05-28 2016-12-01 日本ゼオン株式会社 絶縁性熱伝導シートおよびその製造方法
JP2017034219A (ja) * 2015-07-29 2017-02-09 ジャパンマテックス株式会社 混合グラファイトを用いた放熱材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168882A (ja) 2001-11-30 2003-06-13 Sony Corp 熱伝導性シート
JP2007291267A (ja) 2006-04-26 2007-11-08 Teijin Ltd 熱伝導性成形材料及びこれを用いた成形シート
JP2012104628A (ja) 2010-11-10 2012-05-31 Panasonic Corp 熱伝導シート
JP2012195467A (ja) 2011-03-17 2012-10-11 Sansha Electric Mfg Co Ltd 放熱板およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240022863A (ko) * 2022-08-12 2024-02-20 주식회사 이엔플러스 열전도성 방열 시트 및 그 제조 방법
KR102702214B1 (ko) 2022-08-12 2024-09-04 주식회사 이엔플러스 열전도성 방열 시트 및 그 제조 방법

Also Published As

Publication number Publication date
JP2018026527A (ja) 2018-02-15
KR20180013724A (ko) 2018-02-07
JP6465368B2 (ja) 2019-02-06

Similar Documents

Publication Publication Date Title
KR101838853B1 (ko) 혼합 그래파이트를 이용한 방열재 및 그의 제조방법
KR20180065966A (ko) 혼합 그래파이트를 사용한 방열 재료 및 그의 제조 방법
CN103958611B (zh) 各向异性导热组合物及其成型品
US20100073882A1 (en) Thermally conductive sheet, process for producing the same, and radiator utilizing thermally conductive sheet
US10494557B2 (en) Method of preparing nitrogen-doped graphene and method of producing composite heat dispatching plate thereof
TWI623721B (zh) 高熱傳導率的散熱片及其製造方法
US9631067B2 (en) Carbon fiber composite coated with silicon carbide and production method for same
US11643554B2 (en) Composite resin granules and method for producing the same, and thermally conductive resin molded body using composite resin granules and method for producing thermally conductive resin molded body
CN111837203B (zh) 绝缘片、叠层体及基板
US20130273349A1 (en) Heat-emitting graphite material comprising amorphous carbon particles and a production method therefor
KR102346997B1 (ko) 인조 그라파이트 분말 및 이를 적용한 복합 분말
JP2018026527A5 (enExample)
US20200196435A1 (en) Method of manufacturing multi-structural high-heat-dissipation part having controlled packing density of carbon material, and multi-structural high-heat-dissipation part manufactured thereby
CN110741034B (zh) 导热片
KR101993883B1 (ko) 탄소나노튜브를 갖는 실리콘 복합소재, 탄소나노튜브를 활용한 무금속 실리콘 복합소재의 제조방법
WO2018025587A1 (ja) 熱伝導シート
JP2023171393A (ja) 熱伝導シート
US20170028675A1 (en) Heat radiating material comprising mixed graphite
KR101874959B1 (ko) 방열 그래핀 시트 및 이의 제조방법
KR20220154622A (ko) 전기 절연성 및 수지 혼용성이 개선된 그래핀-세라믹 방열 소재의 제조 방법
KR20240065068A (ko) 조성물, 조성물의 제조 방법 및 시트의 제조 방법
EP4578893A1 (en) Elastomeric composition for the manufacture of heat transfer embossing dies
JP2022095514A (ja) 絶縁性熱伝導シート及びその製造方法
TW202443946A (zh) 電池隔熱片、其製造方法及包括所述電池隔熱片的電池模組

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20170718

A201 Request for examination
A302 Request for accelerated examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20171012

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20170718

Comment text: Patent Application

PA0302 Request for accelerated examination

Patent event date: 20171012

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

Patent event date: 20170718

Patent event code: PA03021R01I

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20180125

Patent event code: PE09021S01D

PG1501 Laying open of application
E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20180221

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20180308

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20180308

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20220215

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20230113

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20240119

Start annual number: 7

End annual number: 7