JP6463303B2 - 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 - Google Patents

弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 Download PDF

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JP6463303B2
JP6463303B2 JP2016134881A JP2016134881A JP6463303B2 JP 6463303 B2 JP6463303 B2 JP 6463303B2 JP 2016134881 A JP2016134881 A JP 2016134881A JP 2016134881 A JP2016134881 A JP 2016134881A JP 6463303 B2 JP6463303 B2 JP 6463303B2
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area
substrate
top ring
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JP2017205853A (ja
JP2017205853A5 (enExample
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鍋谷　治
治 鍋谷
誠 福島
誠 福島
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Ebara Corp
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Ebara Corp
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Priority to SG10202100910UA priority Critical patent/SG10202100910UA/en
Priority to SG10202002713PA priority patent/SG10202002713PA/en
Priority to SG10201606197XA priority patent/SG10201606197XA/en
Priority to TW105124413A priority patent/TWI724010B/zh
Priority to TW110108232A priority patent/TWI785525B/zh
Priority to KR1020160102483A priority patent/KR102134726B1/ko
Priority to US15/234,058 priority patent/US10537975B2/en
Priority to CN202010673067.7A priority patent/CN111775043B/zh
Priority to CN201610688808.2A priority patent/CN106466806B/zh
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Priority to US16/695,637 priority patent/US11472000B2/en
Priority to KR1020200084573A priority patent/KR102178517B1/ko
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2016134881A 2015-08-18 2016-07-07 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 Active JP6463303B2 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SG10202100910UA SG10202100910UA (en) 2015-08-18 2016-07-27 Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control m
SG10202002713PA SG10202002713PA (en) 2015-08-18 2016-07-27 Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
SG10201606197XA SG10201606197XA (en) 2015-08-18 2016-07-27 Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
TW110108232A TWI785525B (zh) 2015-08-18 2016-08-02 基板吸著方法、基板保持裝置、基板研磨裝置、彈性膜、基板保持裝置之基板吸著判定方法及壓力控制方法
TW105124413A TWI724010B (zh) 2015-08-18 2016-08-02 基板吸著方法、基板保持裝置、基板研磨裝置、彈性膜、基板保持裝置之基板吸著判定方法及壓力控制方法
US15/234,058 US10537975B2 (en) 2015-08-18 2016-08-11 Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
KR1020160102483A KR102134726B1 (ko) 2015-08-18 2016-08-11 기판 흡착 방법, 기판 보유 지지 장치, 기판 연마 장치, 기판 보유 지지 장치에 있어서의 기판 흡착 판정 방법 및 압력 제어 방법
CN202010673067.7A CN111775043B (zh) 2015-08-18 2016-08-18 基板保持装置及弹性膜
CN201610688808.2A CN106466806B (zh) 2015-08-18 2016-08-18 基板的吸附方法及研磨装置、基板保持装置及其基板吸附判定方法与压力控制方法
US16/695,637 US11472000B2 (en) 2015-08-18 2019-11-26 Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
KR1020200084573A KR102178517B1 (ko) 2015-08-18 2020-07-09 기판 보유 지지 장치 및 탄성막

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JP2016097291 2016-05-13
JP2016097291 2016-05-13

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JP2017205853A5 JP2017205853A5 (enExample) 2018-04-26
JP6463303B2 true JP6463303B2 (ja) 2019-01-30

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JP2018246532A Active JP6633175B2 (ja) 2016-05-13 2018-12-28 基板保持装置及び弾性膜

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019072841A (ja) * 2016-05-13 2019-05-16 株式会社荏原製作所 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法
US10537975B2 (en) 2015-08-18 2020-01-21 Ebara Corporation Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7075814B2 (ja) * 2018-05-21 2022-05-26 株式会社荏原製作所 基板保持装置、基板研磨装置、弾性部材および基板保持装置の製造方法
KR102712571B1 (ko) * 2018-08-06 2024-10-04 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 기판 연마 장치
JP7117933B2 (ja) * 2018-08-06 2022-08-15 株式会社荏原製作所 基板保持装置および基板研磨装置
EP4171874A4 (en) 2020-06-24 2024-11-27 Applied Materials, Inc. POLISHING SUPPORT HEAD WITH PIEZOELECTRIC PRESSURE CONTROL
KR102735236B1 (ko) * 2020-06-29 2024-11-28 어플라이드 머티어리얼스, 인코포레이티드 다수의 각도적 가압 가능한 구역들을 갖는 연마 캐리어 헤드
CN116711052A (zh) * 2021-02-10 2023-09-05 雅马哈发动机株式会社 加工装置
KR20250010695A (ko) * 2022-06-02 2025-01-21 미크로 기켄 가부시키가이샤 연마 헤드 및 연마 처리 장치

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3705670B2 (ja) * 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
JP2000015572A (ja) * 1998-04-29 2000-01-18 Speedfam Co Ltd キャリア及び研磨装置
JP2000033558A (ja) * 1998-07-21 2000-02-02 Speedfam-Ipec Co Ltd キャリア及び研磨装置
US5961169A (en) * 1998-07-27 1999-10-05 Strasbaugh Apparatus for sensing the presence of a wafer
JP4097356B2 (ja) * 1999-05-07 2008-06-11 東京エレクトロン株式会社 平面板チャック台、平面板研磨装置及び平面板研磨方法
JP3816297B2 (ja) * 2000-04-25 2006-08-30 株式会社荏原製作所 研磨装置
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US6923711B2 (en) * 2000-10-17 2005-08-02 Speedfam-Ipec Corporation Multizone carrier with process monitoring system for chemical-mechanical planarization tool
US6568991B2 (en) * 2001-08-28 2003-05-27 Speedfam-Ipec Corporation Method and apparatus for sensing a wafer in a carrier
JP4049579B2 (ja) * 2001-12-12 2008-02-20 株式会社荏原製作所 基板保持装置及びポリッシング装置
WO2004094105A1 (ja) * 2003-04-24 2004-11-04 Nikon Corporation 真空吸着保持装置及び保持方法と、該保持装置を用いた研磨装置及びこの研磨装置を用いたデバイス製造方法
JP4718107B2 (ja) * 2003-05-20 2011-07-06 株式会社荏原製作所 基板保持装置及び研磨装置
JP4108023B2 (ja) * 2003-09-09 2008-06-25 株式会社荏原製作所 圧力コントロールシステム及び研磨装置
JP2008137103A (ja) * 2006-11-30 2008-06-19 Ebara Corp 基板保持装置、基板研磨装置、及び基板研磨方法
JP2009117655A (ja) * 2007-11-07 2009-05-28 Tokyo Seimitsu Co Ltd ウェーハ処理装置及びウェーハ処理方法
JP5597033B2 (ja) * 2010-06-07 2014-10-01 株式会社荏原製作所 研磨装置および方法
JP5964064B2 (ja) * 2012-01-31 2016-08-03 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法
JP5875950B2 (ja) * 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
JP5856546B2 (ja) * 2012-07-11 2016-02-09 株式会社荏原製作所 研磨装置および研磨方法
JP5973841B2 (ja) * 2012-08-22 2016-08-23 日本特殊陶業株式会社 静電チャックのガス制御装置およびガス制御方法
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
JP6092086B2 (ja) * 2013-12-02 2017-03-08 株式会社荏原製作所 研磨装置
JP6463303B2 (ja) * 2016-05-13 2019-01-30 株式会社荏原製作所 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法
JP6353418B2 (ja) * 2015-08-18 2018-07-04 株式会社荏原製作所 基板吸着方法、トップリングおよび基板研磨装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10537975B2 (en) 2015-08-18 2020-01-21 Ebara Corporation Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
US11472000B2 (en) 2015-08-18 2022-10-18 Ebara Corporation Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
JP2019072841A (ja) * 2016-05-13 2019-05-16 株式会社荏原製作所 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法

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