JP6441860B2 - 磁気トンネル接合装置の製造技術と対応装置 - Google Patents
磁気トンネル接合装置の製造技術と対応装置 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 238000005516 engineering process Methods 0.000 title description 3
- 229910052751 metal Inorganic materials 0.000 claims description 71
- 239000002184 metal Substances 0.000 claims description 71
- 230000005294 ferromagnetic effect Effects 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 45
- 125000006850 spacer group Chemical group 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 24
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- 239000000126 substance Substances 0.000 claims description 3
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- 239000010410 layer Substances 0.000 description 171
- 239000011241 protective layer Substances 0.000 description 14
- 239000003989 dielectric material Substances 0.000 description 8
- 230000005415 magnetization Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000013459 approach Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- -1 FeB Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910019236 CoFeB Inorganic materials 0.000 description 2
- 229910005335 FePt Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
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- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910002441 CoNi Inorganic materials 0.000 description 1
- 229910002546 FeCo Inorganic materials 0.000 description 1
- 229910015187 FePd Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
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- 230000003247 decreasing effect Effects 0.000 description 1
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- 238000001312 dry etching Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
Description
102 底部電極
104 上部電極
104a 上部電極の上面
106 磁気トンネル接合(MTJ)
108 下強磁性電極
110 上強磁性電極
112 トンネルバリア層
116 下地金属層
118 金属間誘電体(IMD)層
120 中央底部電極部分
120a 中央部分の上面
122 IMD-保護層
124 階段領域
126 周辺底部電極部分
126a 周辺部分の上面
128 側壁スペーサ
200 集積回路
202a MRAMセル
202b MRAMセル
204 相互接続構造
206 基板
208 シャロートレンチアイソレーション(STI)領域
210 ワードライントランジスタ
212 ワードライントランジスタ
214 ワードラインゲート電極
216 ワードラインゲート電極
218 ワードラインゲート電極
220 ワードラインゲート電極
222 ワードライン側壁スペーサ
224 ソース/ドレイン領域
226 IMD層
228 IMD層
230 IMD層
230’ IMD層
232 金属配線層
234 金属配線層
236 金属配線層
238 金属線
240 金属線
241 金属線
242 金属線
244 コンタクト
246 ビア
248 ビア
250 誘電体保護層
252 誘電体保護層
254 底部電極
254’ 底部電極層
256 上部電極
256' 上部電極層
258 磁気トンネル接合(MTJ)
258' 磁気トンネル接合(MTJ)堆疊
260 側壁スペーサ
260’ 側壁スペーサ層
261 底部電極の中央部分
261a 中央部分の上面
262 階段領域
264 周辺領域
264a 周辺領域の上面
266 下強磁性電極
266’ 下強磁性層
268 上強磁性電極
268’ 上強磁性層
270 トンネルバリア層
270’ トンネルバリア層
272 キャッピング層
272’ キャッピング層
274 上部ピン強磁性層
274’ 上強磁性電極層
276 底部ピン強磁性層
276’ 下強磁性電極層
278 金属層
278’ 金属層
500 半導体構造の製造方法
502〜520 方法500の工程
600 断面図
700 断面図
702 第一マスク
704 第一エッチング
706 開口
800 断面図
900 断面図
902 マスク
1000 断面図
1002 第二エッチング
1100 断面図
1200 断面図
1300 断面図
1302 第三エッチング
1400 断面図
1500 断面図
1600 断面図
Claims (2)
- 磁気抵抗メモリ(MRAM)セルの製造方法であって、
誘電層を半導体基板の上方に形成する工程と、
開口を前記誘電層に形成するとともに、金属層で前記開口を充填して金属線を構築する工程と、
前記誘電層の上面に設置されて、前記金属線の上面の少なくとも一部を露出させておく開口があるエッチング停止層を形成する工程と、
前記エッチング停止層が積層される周辺部分、および前記開口を通してビアまたは前記金属線の上面まで下方に延伸している中央部分を含む、共形の底部電極層を、前記エッチング停止層および前記金属層の上方に形成する工程と、
磁気トンネル接合を、前記共形の底部電極層の前記中央部分の上方に形成する工程とを有しており、
前記磁気トンネル接合を形成する工程は、
下強磁性層を、前記共形の底部電極層の上方に形成する工程と、
トンネルバリア層を、前記下強磁性層の上方に形成する工程と、
上強磁性層を、前記トンネルバリア層の上方に形成する工程と、
上部電極層を、前記上強磁性層の上方に形成する工程とを含み、
マスク層を前記上部電極層の上方に形成し、前記マスク層をパターン化して、前記共形の底部電極層の前記中央部分の上方に設置される外側マスク側壁を有するマスクを形成する工程と、
前記マスクによりエッチングを実行して、前記上強磁性層および前記下強磁性層の一部を除去し、前記トンネルバリア層の一部を除去して、前記共形の底部電極層の前記周辺部分の上面を露出させる工程と、
前記上強磁性層、前記下強磁性層および前記トンネルバリア層の各々の側壁に沿って、かつ、前記共形の底部電極層の前記周辺部分の前記露出した上面に延伸する共形の側壁スペーサ層を形成する工程と、
エッチバックプロセスを実行して、前記共形の側壁スペーサ層の一部を除去して、側壁スペーサを形成するとともに、前記共形の底部電極層の一部を除去して、底部電極を形成する工程と
を有することを特徴とする方法。 - 前記共形の底部電極層に化学機械平坦化プロセスを実行せずに、前記磁気トンネル接合を、前記共形の底部電極層の上方に形成すること
を特徴とする請求項1記載の方法。
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US14/801,988 | 2015-07-17 | ||
US14/801,988 US9666790B2 (en) | 2015-07-17 | 2015-07-17 | Manufacturing techniques and corresponding devices for magnetic tunnel junction devices |
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JP2018219116A Active JP6807911B2 (ja) | 2015-07-17 | 2018-11-22 | 磁気トンネル接合装置の製造技術と対応装置 |
JP2020157701A Active JP7046135B2 (ja) | 2015-07-17 | 2020-09-18 | 磁気トンネル接合装置の製造技術と対応装置 |
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JP2020157701A Active JP7046135B2 (ja) | 2015-07-17 | 2020-09-18 | 磁気トンネル接合装置の製造技術と対応装置 |
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US (4) | US9666790B2 (ja) |
JP (3) | JP6441860B2 (ja) |
KR (1) | KR101831490B1 (ja) |
CN (1) | CN106356448B (ja) |
DE (1) | DE102015112860A1 (ja) |
TW (1) | TWI567964B (ja) |
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