JP6439378B2 - 基板加工装置 - Google Patents

基板加工装置 Download PDF

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Publication number
JP6439378B2
JP6439378B2 JP2014217602A JP2014217602A JP6439378B2 JP 6439378 B2 JP6439378 B2 JP 6439378B2 JP 2014217602 A JP2014217602 A JP 2014217602A JP 2014217602 A JP2014217602 A JP 2014217602A JP 6439378 B2 JP6439378 B2 JP 6439378B2
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JP
Japan
Prior art keywords
belt
brittle material
substrate
material substrate
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014217602A
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English (en)
Japanese (ja)
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JP2016083821A (ja
Inventor
直 得永
直 得永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2014217602A priority Critical patent/JP6439378B2/ja
Priority to KR1020150083706A priority patent/KR102365097B1/ko
Priority to TW104122807A priority patent/TWI652234B/zh
Priority to CN201510603077.2A priority patent/CN105541093B/zh
Publication of JP2016083821A publication Critical patent/JP2016083821A/ja
Application granted granted Critical
Publication of JP6439378B2 publication Critical patent/JP6439378B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Chemical & Material Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014217602A 2014-10-24 2014-10-24 基板加工装置 Active JP6439378B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014217602A JP6439378B2 (ja) 2014-10-24 2014-10-24 基板加工装置
KR1020150083706A KR102365097B1 (ko) 2014-10-24 2015-06-12 기판 가공 장치
TW104122807A TWI652234B (zh) 2014-10-24 2015-07-14 Substrate processing device
CN201510603077.2A CN105541093B (zh) 2014-10-24 2015-09-21 基板加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014217602A JP6439378B2 (ja) 2014-10-24 2014-10-24 基板加工装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2016027549A Division JP6439716B2 (ja) 2016-02-17 2016-02-17 基板加工装置
JP2016027550A Division JP2016137717A (ja) 2016-02-17 2016-02-17 基板加工装置

Publications (2)

Publication Number Publication Date
JP2016083821A JP2016083821A (ja) 2016-05-19
JP6439378B2 true JP6439378B2 (ja) 2018-12-19

Family

ID=55820719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014217602A Active JP6439378B2 (ja) 2014-10-24 2014-10-24 基板加工装置

Country Status (4)

Country Link
JP (1) JP6439378B2 (zh)
KR (1) KR102365097B1 (zh)
CN (1) CN105541093B (zh)
TW (1) TWI652234B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102304576B1 (ko) * 2019-08-27 2021-09-24 주식회사 탑 엔지니어링 단재 제거 유닛 및 이를 포함하는 스크라이브 장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858948A (ja) * 1981-09-30 1983-04-07 Matsushita Electric Works Ltd 加工物の搬送装置
JPH0133222Y2 (zh) * 1984-11-14 1989-10-09
JPS63185597A (ja) * 1987-01-23 1988-08-01 株式会社　タムラ製作所 ウオ−タジエツトカツテイング装置
CA2280778A1 (en) * 1997-03-05 1998-09-11 Ciba Specialty Chemicals Holding Inc. Transport apparatus for thin, board-shaped substrates
KR100748159B1 (ko) * 2001-01-17 2007-08-09 미쓰보시 다이야몬도 고교 가부시키가이샤 절단장치, 절단시스템 및 절단방법
JP3794555B2 (ja) * 2001-10-05 2006-07-05 北辰工業株式会社 弾性を有するシート状長尺物の切断装置におけるシート状長尺物の送り機構
EP1604794A4 (en) * 2002-11-22 2011-03-23 Mitsuboshi Diamond Ind Co Ltd CARRIER CUTTING SYSTEM, CARRIER MANUFACTURING DEVICE, CARRIAGE CARRIER PROCEDURE AND CARRIER CUTTING PROCESS
JP4464961B2 (ja) 2004-03-15 2010-05-19 三星ダイヤモンド工業株式会社 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法
JP4904036B2 (ja) * 2005-09-15 2012-03-28 三星ダイヤモンド工業株式会社 基板分断システム
KR100913581B1 (ko) * 2007-11-29 2009-08-26 주식회사 에스에프에이 기판 절단 시스템
JP5167160B2 (ja) * 2009-01-30 2013-03-21 三星ダイヤモンド工業株式会社 脆性材料基板の搬送・分断装置
KR101449487B1 (ko) * 2012-06-01 2014-10-14 한국미쯔보시다이아몬드공업(주) 기판 절단 장치 및 기판 절단 장치에서의 기판 반송 방법
JP5702765B2 (ja) * 2012-12-06 2015-04-15 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
CN203292158U (zh) 2013-05-31 2013-11-20 京东方科技集团股份有限公司 一种基板清洗系统

Also Published As

Publication number Publication date
KR20160048631A (ko) 2016-05-04
CN105541093B (zh) 2021-06-04
JP2016083821A (ja) 2016-05-19
TW201615573A (zh) 2016-05-01
CN105541093A (zh) 2016-05-04
KR102365097B1 (ko) 2022-02-18
TWI652234B (zh) 2019-03-01

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