JP6430889B2 - 真空処理装置およびその運転方法 - Google Patents

真空処理装置およびその運転方法 Download PDF

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JP6430889B2
JP6430889B2 JP2015097909A JP2015097909A JP6430889B2 JP 6430889 B2 JP6430889 B2 JP 6430889B2 JP 2015097909 A JP2015097909 A JP 2015097909A JP 2015097909 A JP2015097909 A JP 2015097909A JP 6430889 B2 JP6430889 B2 JP 6430889B2
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processing
vacuum
wafer
processed
chamber
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JP2016213393A5 (enExample
JP2016213393A (ja
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佳和 西郷
佳和 西郷
芳郎 末光
芳郎 末光
武士 椿
武士 椿
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Hitachi High Tech Corp
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015097909A 2015-05-13 2015-05-13 真空処理装置およびその運転方法 Active JP6430889B2 (ja)

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JP2016213393A JP2016213393A (ja) 2016-12-15
JP2016213393A5 JP2016213393A5 (enExample) 2018-02-15
JP6430889B2 true JP6430889B2 (ja) 2018-11-28

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JP7242890B2 (ja) * 2020-09-25 2023-03-20 株式会社日立ハイテク 真空処理装置の運転方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206345A (ja) * 2008-02-28 2009-09-10 Hitachi High-Technologies Corp 真空処理装置
JP2013143413A (ja) * 2012-01-10 2013-07-22 Hitachi High-Technologies Corp 真空処理装置
JP2013143513A (ja) * 2012-01-12 2013-07-22 Hitachi High-Technologies Corp 真空処理装置

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