JP6420966B2 - 配線基板及びその製造方法と電子部品装置 - Google Patents

配線基板及びその製造方法と電子部品装置 Download PDF

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Publication number
JP6420966B2
JP6420966B2 JP2014094003A JP2014094003A JP6420966B2 JP 6420966 B2 JP6420966 B2 JP 6420966B2 JP 2014094003 A JP2014094003 A JP 2014094003A JP 2014094003 A JP2014094003 A JP 2014094003A JP 6420966 B2 JP6420966 B2 JP 6420966B2
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Japan
Prior art keywords
wiring board
heat
heat dissipation
metal terminal
metal
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Application number
JP2014094003A
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English (en)
Japanese (ja)
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JP2015211196A (ja
JP2015211196A5 (enExample
Inventor
小林　和貴
和貴 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014094003A priority Critical patent/JP6420966B2/ja
Priority to US14/698,276 priority patent/US9655238B2/en
Publication of JP2015211196A publication Critical patent/JP2015211196A/ja
Publication of JP2015211196A5 publication Critical patent/JP2015211196A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2014094003A 2014-04-30 2014-04-30 配線基板及びその製造方法と電子部品装置 Active JP6420966B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014094003A JP6420966B2 (ja) 2014-04-30 2014-04-30 配線基板及びその製造方法と電子部品装置
US14/698,276 US9655238B2 (en) 2014-04-30 2015-04-28 Wiring board, method for manufacturing wiring board, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014094003A JP6420966B2 (ja) 2014-04-30 2014-04-30 配線基板及びその製造方法と電子部品装置

Publications (3)

Publication Number Publication Date
JP2015211196A JP2015211196A (ja) 2015-11-24
JP2015211196A5 JP2015211196A5 (enExample) 2017-02-09
JP6420966B2 true JP6420966B2 (ja) 2018-11-07

Family

ID=54356270

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JP2014094003A Active JP6420966B2 (ja) 2014-04-30 2014-04-30 配線基板及びその製造方法と電子部品装置

Country Status (2)

Country Link
US (1) US9655238B2 (enExample)
JP (1) JP6420966B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018129418A (ja) * 2017-02-09 2018-08-16 オムロンオートモーティブエレクトロニクス株式会社 回路基板、電子装置
JP7231809B2 (ja) * 2018-06-05 2023-03-02 日亜化学工業株式会社 発光装置
TWI672711B (zh) * 2019-01-10 2019-09-21 健策精密工業股份有限公司 絕緣金屬基板及其製造方法
US20230268247A1 (en) * 2022-02-23 2023-08-24 Skyworks Solutions, Inc. Heat transfer from non-groundable electronic components

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160289A (ja) * 1991-12-10 1993-06-25 Fujitsu Ltd 半導体チップの実装構造
JPH062734A (ja) 1992-06-17 1994-01-11 Bridgestone Corp 液体封入式防振装置
JPH08125287A (ja) 1994-10-28 1996-05-17 Toshiba Corp マルチチップモジュール用配線基板の製造方法
JP2003283144A (ja) * 2002-03-27 2003-10-03 Minolta Co Ltd 回路基板の放熱構造
US7851904B2 (en) 2006-12-06 2010-12-14 Panasonic Corporation Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
JP2008166711A (ja) 2006-12-06 2008-07-17 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法並びに半導体装置の実装構造
JP2010267954A (ja) * 2009-04-15 2010-11-25 Panasonic Corp 電子機器
JP2010272689A (ja) * 2009-05-21 2010-12-02 Renesas Electronics Corp 電界効果トランジスタ
JP2012009828A (ja) * 2010-05-26 2012-01-12 Jtekt Corp 多層回路基板
US8698186B2 (en) * 2011-07-19 2014-04-15 Cofan Usa, Inc. Circuit board with thermo-conductive pillar
JP6230777B2 (ja) * 2012-01-30 2017-11-15 新光電気工業株式会社 配線基板、配線基板の製造方法、及び発光装置
WO2014132951A1 (ja) * 2013-02-26 2014-09-04 タツタ電線株式会社 フレキシブルプリント配線板用補強部材、フレキシブルプリント配線板、及び、シールドプリント配線板
JP6335619B2 (ja) * 2014-01-14 2018-05-30 新光電気工業株式会社 配線基板及び半導体パッケージ
JP6279921B2 (ja) * 2014-02-12 2018-02-14 新光電気工業株式会社 配線基板及び半導体パッケージ

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JP2015211196A (ja) 2015-11-24
US20150319841A1 (en) 2015-11-05

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