JP6417486B2 - 蒸着マスクおよび有機半導体素子の製造方法 - Google Patents
蒸着マスクおよび有機半導体素子の製造方法 Download PDFInfo
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- JP6417486B2 JP6417486B2 JP2017557726A JP2017557726A JP6417486B2 JP 6417486 B2 JP6417486 B2 JP 6417486B2 JP 2017557726 A JP2017557726 A JP 2017557726A JP 2017557726 A JP2017557726 A JP 2017557726A JP 6417486 B2 JP6417486 B2 JP 6417486B2
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- 238000007740 vapor deposition Methods 0.000 title claims description 152
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 239000004065 semiconductor Substances 0.000 title claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 132
- 239000002184 metal Substances 0.000 claims description 132
- 239000011347 resin Substances 0.000 claims description 130
- 229920005989 resin Polymers 0.000 claims description 130
- 239000000463 material Substances 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 35
- 238000000151 deposition Methods 0.000 claims description 15
- 230000003746 surface roughness Effects 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 220
- 239000000758 substrate Substances 0.000 description 73
- 238000005401 electroluminescence Methods 0.000 description 37
- 239000011521 glass Substances 0.000 description 18
- 238000007788 roughening Methods 0.000 description 13
- 230000008021 deposition Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000011282 treatment Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 238000005019 vapor deposition process Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
図1および図2を参照しながら、本発明の実施形態による蒸着マスク100を説明する。図1および図2は、それぞれ蒸着マスク100を模式的に示す断面図および平面図である。図1は、図2中の1A−1A線に沿った断面を示している。
本願明細書において、「粗面領域」は、実質的に平坦でないと見なせる程度の凹凸形状を有する領域を指す。具体的には、粗面領域は、表面粗さ(算術平均粗さ)Raが50nm以上の領域である。
図9(a)〜(e)を参照しながら、蒸着マスク100の製造方法の例を説明する。図9(a)〜(e)は、蒸着マスク100の製造工程を示す工程断面図である。
本発明の実施形態による蒸着マスク100は、有機半導体素子の製造方法における蒸着工程に好適に用いられる。
2、4 凹部
10 樹脂層
11 第1主面
11a 第1主面の非露出部分
11b 第1主面の露出部分
12 第2主面
13 開口部
20 金属層
20’ 金属板(支持基板)
21 第3主面
22 第4主面
23 スリット
30 ガラス基板(支持基板)
100 蒸着マスク
200 有機EL表示装置
210 TFT基板
211 平坦化膜
212R、212G、212B 下部電極(陽極)
213 バンク
214R、214G、214B 有機EL層
215 上部電極
216 保護層
217 透明樹脂層
220 封止基板
Pr 赤画素
Pg 緑画素
Pb 青画素
Claims (5)
- 第1主面および第2主面を有し、複数の開口部を含む樹脂層と、
第3主面および第4主面を有し、前記第4主面が前記樹脂層側に位置するように、前記樹脂層の前記第1主面上に設けられた金属層であって、前記複数の開口部を露出させる形状を有する金属層と、を備え、
前記樹脂層の前記第1主面の、前記金属層に接している部分および前記金属層に接していない部分と、前記金属層の前記第3主面とは、それぞれ凹凸形状を有する粗面領域を含み、
前記樹脂層の前記第1主面の、前記金属層に接している部分および前記金属層に接していない部分と、前記金属層の前記第3主面とのそれぞれの前記粗面領域は、0.1μm以上の表面粗さRaを有する蒸着マスク。 - 前記金属層の前記第4主面は、凹凸形状を有する粗面領域を含む請求項1に記載の蒸着マスク。
- 前記樹脂層の前記第1主面の前記金属層に接している部分の前記粗面領域における凹凸形状と、前記金属層の前記第4主面の前記粗面領域における凹凸形状とは、互いに相補的である請求項2に記載の蒸着マスク。
- 前記樹脂層の前記第2主面は、凹凸形状を有する粗面領域を含まない請求項1から3のいずれかに記載の蒸着マスク。
- 請求項1から4のいずれかに記載の蒸着マスクを用いて、ワーク上に有機半導体材料を蒸着する工程を包含する、有機半導体素子の製造方法。
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JP2015253888 | 2015-12-25 | ||
JP2015253888 | 2015-12-25 | ||
PCT/JP2016/071765 WO2017110123A1 (ja) | 2015-12-25 | 2016-07-25 | 蒸着マスク、蒸着マスクの製造方法および有機半導体素子の製造方法 |
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JP2018190294A Division JP6496071B2 (ja) | 2015-12-25 | 2018-10-05 | 蒸着マスクおよび有機半導体素子の製造方法 |
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JP6417486B2 true JP6417486B2 (ja) | 2018-11-07 |
JPWO2017110123A1 JPWO2017110123A1 (ja) | 2018-11-08 |
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JP2018190294A Active JP6496071B2 (ja) | 2015-12-25 | 2018-10-05 | 蒸着マスクおよび有機半導体素子の製造方法 |
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US (1) | US10858726B2 (ja) |
JP (2) | JP6417486B2 (ja) |
CN (1) | CN108884555B (ja) |
TW (1) | TW201735418A (ja) |
WO (1) | WO2017110123A1 (ja) |
Families Citing this family (10)
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CN110382731B (zh) * | 2017-03-31 | 2022-06-17 | 大日本印刷株式会社 | 蒸镀掩模、带框体的蒸镀掩模、蒸镀掩模准备体、蒸镀图案形成方法及有机半导体元件的制造方法 |
US10957882B2 (en) | 2018-03-05 | 2021-03-23 | Sakai Display Products Corporation | Vapor deposition mask, production method therefor, and production method for organic EL display device |
JP7013320B2 (ja) * | 2018-05-11 | 2022-01-31 | 大日本印刷株式会社 | 蒸着マスク及び蒸着方法 |
JP7187883B2 (ja) | 2018-08-09 | 2022-12-13 | 大日本印刷株式会社 | 蒸着マスクの製造方法 |
EP3674436B1 (en) * | 2018-12-25 | 2024-03-13 | Dai Nippon Printing Co., Ltd. | Deposition mask |
US11773477B2 (en) | 2018-12-25 | 2023-10-03 | Dai Nippon Printing Co., Ltd. | Deposition mask |
JP6839729B2 (ja) * | 2019-06-13 | 2021-03-10 | 堺ディスプレイプロダクト株式会社 | 蒸着マスク、その製造方法及び有機el表示装置の製造方法 |
JP6888128B1 (ja) * | 2020-01-30 | 2021-06-16 | 凸版印刷株式会社 | 蒸着マスク |
JP7015483B2 (ja) * | 2020-09-09 | 2022-02-15 | 大日本印刷株式会社 | 蒸着マスクの製造方法 |
KR20230020035A (ko) * | 2021-08-02 | 2023-02-10 | 삼성디스플레이 주식회사 | 증착용 마스크 |
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JP2013209710A (ja) * | 2012-03-30 | 2013-10-10 | V Technology Co Ltd | 蒸着マスク、蒸着マスクの製造方法及び有機el表示装置の製造方法 |
JP2014065928A (ja) * | 2012-09-24 | 2014-04-17 | Dainippon Printing Co Ltd | 蒸着マスクの製造方法 |
JP2015148002A (ja) * | 2014-02-07 | 2015-08-20 | 大日本印刷株式会社 | 蒸着マスク、蒸着マスク準備体、及び有機半導体素子の製造方法 |
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US6099939A (en) * | 1995-04-13 | 2000-08-08 | International Business Machines Corporation | Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology |
CN103797149B (zh) | 2011-09-16 | 2017-05-24 | 株式会社V技术 | 蒸镀掩膜、蒸镀掩膜的制造方法及薄膜图案形成方法 |
JP5935179B2 (ja) | 2011-12-13 | 2016-06-15 | 株式会社ブイ・テクノロジー | 蒸着マスク及び蒸着マスクの製造方法 |
JP5288073B2 (ja) * | 2012-01-12 | 2013-09-11 | 大日本印刷株式会社 | 蒸着マスクの製造方法、及び有機半導体素子の製造方法 |
JP6142637B2 (ja) * | 2013-04-15 | 2017-06-07 | 株式会社デンソー | 車両の接触防止システム |
JP6078818B2 (ja) | 2013-07-02 | 2017-02-15 | 株式会社ブイ・テクノロジー | 成膜マスク及び成膜マスクの製造方法 |
JP6594615B2 (ja) * | 2014-10-06 | 2019-10-23 | 株式会社ジャパンディスプレイ | 蒸着用マスク及びそれを用いた有機el表示装置の製造方法、並びに、蒸着用マスクの製造方法 |
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- 2016-07-25 CN CN201680075966.9A patent/CN108884555B/zh active Active
- 2016-07-25 JP JP2017557726A patent/JP6417486B2/ja active Active
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- 2016-07-28 TW TW105123876A patent/TW201735418A/zh unknown
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JP2013209710A (ja) * | 2012-03-30 | 2013-10-10 | V Technology Co Ltd | 蒸着マスク、蒸着マスクの製造方法及び有機el表示装置の製造方法 |
JP2014065928A (ja) * | 2012-09-24 | 2014-04-17 | Dainippon Printing Co Ltd | 蒸着マスクの製造方法 |
JP2015148002A (ja) * | 2014-02-07 | 2015-08-20 | 大日本印刷株式会社 | 蒸着マスク、蒸着マスク準備体、及び有機半導体素子の製造方法 |
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JPWO2017110123A1 (ja) | 2018-11-08 |
WO2017110123A1 (ja) | 2017-06-29 |
US10858726B2 (en) | 2020-12-08 |
US20200165714A1 (en) | 2020-05-28 |
JP2019014974A (ja) | 2019-01-31 |
CN108884555A (zh) | 2018-11-23 |
JP6496071B2 (ja) | 2019-04-03 |
CN108884555B (zh) | 2021-02-09 |
TW201735418A (zh) | 2017-10-01 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |