JP6415021B2 - 耐久性を高めたフォトニック結晶センサパッケージング - Google Patents
耐久性を高めたフォトニック結晶センサパッケージング Download PDFInfo
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- JP6415021B2 JP6415021B2 JP2013097472A JP2013097472A JP6415021B2 JP 6415021 B2 JP6415021 B2 JP 6415021B2 JP 2013097472 A JP2013097472 A JP 2013097472A JP 2013097472 A JP2013097472 A JP 2013097472A JP 6415021 B2 JP6415021 B2 JP 6415021B2
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- 239000004038 photonic crystal Substances 0.000 title claims description 33
- 238000004806 packaging method and process Methods 0.000 title description 29
- 239000000835 fiber Substances 0.000 claims description 192
- 238000000034 method Methods 0.000 claims description 113
- 210000004894 snout Anatomy 0.000 claims description 82
- 229910000679 solder Inorganic materials 0.000 claims description 82
- 238000007789 sealing Methods 0.000 claims description 48
- 230000008569 process Effects 0.000 claims description 39
- 238000005476 soldering Methods 0.000 claims description 26
- 239000004593 Epoxy Substances 0.000 claims description 23
- 229910020658 PbSn Inorganic materials 0.000 claims description 5
- 101150071746 Pbsn gene Proteins 0.000 claims description 5
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 5
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 5
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
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- 241000143973 Libytheinae Species 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- ZPUCINDJVBIVPJ-LJISPDSOSA-N cocaine Chemical compound O([C@H]1C[C@@H]2CC[C@@H](N2C)[C@H]1C(=O)OC)C(=O)C1=CC=CC=C1 ZPUCINDJVBIVPJ-LJISPDSOSA-N 0.000 description 1
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/268—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light using optical fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1225—Basic optical elements, e.g. light-guiding paths comprising photonic band-gap structures or photonic lattices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/241—Light guide terminations
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- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/366—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures allowing for adjustment or alignment in all dimensions, i.e. 3D microoptics arrangements, e.g. free space optics on the microbench, microhinges or spring latches, with associated microactuating elements for fine adjustment or alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/284—Electromagnetic waves
- G01F23/292—Light, e.g. infrared or ultraviolet
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3616—Holders, macro size fixtures for mechanically holding or positioning fibres, e.g. on an optical bench
- G02B6/3624—Fibre head, e.g. fibre probe termination
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Optical Transform (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Description
別の変形例による方法では、三軸ステージツールは、センサチップ130に対して繊維160の端部を位置合わせするために使用される。また別の変形例による方法では、はんだガラスを用いた局部熱的加熱を使用してセラミック管140の端部にセンサチップ130をはんだ付けする。
また別の変形例による方法では、局部熱的加熱及びドーナツ形状のはんだプリフォーム180を使用して、セラミック管140の内表面にセラミックフェルール150の外表面をはんだ付けする。
130 センサチップ
140 コバール管、セラミック管
150 金属フェルール、セラミックフェルール
160 繊維
170 センサチップアセンブリ
180 はんだプリフォーム
200、210 能動的位置合わせの図
205 パッケージ全体
220 センサチップ
230 繊維
240 パッケージ本体
245 プレコーティング層
250 前方スノート
255 エポキシ
260 後方スノート
265 繊維とパッケージとの結合部分
270 繊維受台
280 蓋
290 フェルール
292 繊維外被
295 繊維ブーツ
297 内部空洞
Claims (10)
- フォトニック結晶センサであるセンサチップ(220)のハーメチックシール方法であって、
パッケージ本体(240)の前方スノート(250)の端部にセンサチップ(220)をシールすることと、
フェルールの内部に繊維(230)をはんだ付けすることにより、フェルールと繊維(230)をアセンブルすることと、
パッケージ本体(240)の後方スノート(260)の開口を通してパッケージ本体(240)に繊維(230)を有するフェルールを挿入することと、
センサチップ(220)に対して繊維(230)の端部を位置合わせすることと、
パッケージ本体(240)の内部に位置する繊維受台(270)上に繊維(230)を有するフェルールをロックすることと、
パッケージ本体(240)の後方スノート(260)の端部に繊維(230)をシールすることと、
センサチップ(220)に位置合わさせされた繊維(230)の端部とは反対側の端部に繊維外被(292)を適用することであって、繊維外被(292)の一部がパッケージ本体(240)の後方スノート(260)の内部に位置していることと、
後方スノート(260)の内部空洞をシールすることと、
後方スノート(260)の端部と繊維外被(292)の少なくとも一部とに繊維ブーツ(295)を取り付けることと、
パッケージ本体(240)、センサチップ(220)、繊維(230)、繊維受台(270)、繊維外被(292)、及び繊維ブーツ(295)をガス抜きすることと、
パッケージ本体(240)の頂部側に蓋をシールすることと
を含む方法。 - 前方スノート(250)にセンサチップ(220)をシールすることが、はんだのリフローの表面張力を利用して、はんだが冷却されて固化するときに前方スノート(250)の中心軸に合わせてセンサチップ(220)を自動的にセンタリングするセルフアラインメントプロセスにより達成される、請求項1に記載の方法。
- 少なくとも部分的に繊維(230)を金属化することをさらに含む、請求項1又は2に記載の方法。
- 前方スノート(250)の端部に対してセンサチップ(220)をシールすることが、高温はんだを使用すること、及び前方スノート(250)の端部の外周の大きさと形状とに一致するパターンを用いてセンサチップ(220)を金属化することにより達成される、請求項1ないし3のいずれか一項に記載の方法。
- 高温はんだが鉛すず(PbSn)はんだ及び金すず(AuSn)はんだの少なくとも一方である、請求項4に記載の方法。
- ミリタリーグレードのエポキシからなる保護層を前方スノート(250)の外表面に適用することにより、センサチップ(220)の側壁を保護し、前方スノート(250)に対するセンサチップ(220)のシールを強化すること
をさらに含み、
高温はんだを使用して、繊維受台(270)上に繊維(230)を有するフェルールをロックし、且つはんだプリフォームを使用して、後方スノート(260)の端部に繊維をシールする、
請求項1に記載の方法。 - ハーメチックシールされた、フォトニック結晶センサであるセンサチップ(220)を有するパッケージであって、
センサチップ(220)にシールされた前方スノート(250)の端部を有するパッケージ本体(240)と、
繊維(230)と、
フェルールであって、当該フェルールの内部に繊維(230)をはんだ付けすることにより、繊維(230)とアセンブルされ、パッケージ本体(240)の後方スノート(260)の開口を通してパッケージ本体(240)に挿入された、フェルールと、
センサチップ(220)に対して位置合わせされた繊維(230)の端部であって、繊維(230)を有するフェルールがパッケージ本体(240)内部に位置する繊維受台(270)上にロックされており、且つ繊維(230)がパッケージ本体(240)の後方スノート(260)の端部にシールされている繊維(230)の端部と、
センサチップ(220)に対して位置合わさせされた繊維(230)の端部とは反対側の端部に適用された繊維外被(292)であって、部分的にパッケージ本体(240)の後方スノート(260)の内部に位置している繊維外被(292)と、
後方スノート(260)でシールされた内部空洞と、
後方スノート(260)の端部及び繊維外被(292)の少なくとも一部に取り付けられた繊維ブーツ(295)であって、パッケージ本体(240)、センサチップ(220)、繊維(230)、繊維受台(270)、繊維外被(292)、及び繊維ブーツ(295)のガス抜きが済んでいる繊維ブーツ(295)と、
パッケージ本体(240)の頂部側にシールされた蓋と
を備えるパッケージ。 - はんだのリフローの表面張力を利用して、はんだが冷却されて固化するときに前方スノート(250)の中心軸に合わせてセンサチップ(220)を自動的にセンタリングするセルフアラインメントプロセスにより、前方スノート(250)の端部がセンサチップ(220)でシールされている、請求項7に記載のパッケージ。
- 繊維(230)が少なくとも部分的に金属化され、
センサチップ(220)による前方スノート(250)の端部のシールが、高温はんだを使用することにより、及び前方スノート(250)の端部の外周の大きさと形状とに一致するセンサチップ(220)上の金属化パターンにより、達成されており、且つ
高温はんだが鉛すず(PbSn)はんだ及び金すず(AuSn)はんだの少なくとも一方である、
請求項7に記載のパッケージ。 - センサチップ(220)の側壁を保護し、センサチップ(220)に対する前方スノート(250)のシールを強化するために、前方スノート(250)の外表面に適用されたミリタリーグレードのエポキシからなる保護層
をさらに備えている、請求項7ないし9のいずれか一項に記載のパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/467,358 | 2012-05-09 | ||
US13/467,358 US9500808B2 (en) | 2012-05-09 | 2012-05-09 | Ruggedized photonic crystal sensor packaging |
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Publication Number | Publication Date |
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JP2013235000A JP2013235000A (ja) | 2013-11-21 |
JP6415021B2 true JP6415021B2 (ja) | 2018-10-31 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9103968B2 (en) | 2013-02-12 | 2015-08-11 | The Boeing Company | Multifunctional optical sensor unit |
US10209447B2 (en) * | 2015-09-11 | 2019-02-19 | Ii-Vi Incorporated | Micro splice protector |
RU2629133C1 (ru) * | 2016-09-27 | 2017-08-24 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский национальный исследовательский государственный университет имени Н.Г. Чернышевского" | Способ селективной запайки внешних оболочек фотонно-кристаллических волноводов с полой сердцевиной |
US10435170B2 (en) * | 2016-12-08 | 2019-10-08 | The Boeing Company | Systems and methods for installation of sensors for fuel quantity indicating systems |
EP3336485B1 (en) | 2016-12-15 | 2020-09-23 | Safran Landing Systems UK Limited | Aircraft assembly including deflection sensor |
JP6935206B2 (ja) * | 2017-02-14 | 2021-09-15 | 古河電気工業株式会社 | 光素子用パッケージ及び光素子モジュール |
RU192006U1 (ru) * | 2019-05-24 | 2019-08-30 | Леонид Романович Боев | Микроэлектромеханическое устройство |
EP3967998A4 (en) * | 2019-06-25 | 2023-01-18 | Nagano Keiki Co., Ltd. | OPTICAL SENSOR AND DEVICE FOR MEASURING PHYSICAL QUANTITY |
Family Cites Families (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3093792A (en) * | 1960-03-16 | 1963-06-11 | Bendix Corp | Ion air density sensor for atmospheric pressure and altitude measurements |
US3423594A (en) * | 1964-03-03 | 1969-01-21 | Anthony G Galopin | Photoelectric semiconductor device with optical fiber means coupling input signals to base |
US3585454A (en) * | 1969-04-01 | 1971-06-15 | Westinghouse Electric Corp | Improved case member for a light activated semiconductor device |
US4131905A (en) * | 1977-05-26 | 1978-12-26 | Electric Power Research Institute, Inc. | Light-triggered thyristor and package therefore |
US4129042A (en) | 1977-11-18 | 1978-12-12 | Signetics Corporation | Semiconductor transducer packaged assembly |
US4217179A (en) * | 1978-07-17 | 1980-08-12 | National Research Development Corporation | Determination of lithium, sensor therefor and method of making said sensor |
FR2448727A1 (fr) * | 1979-02-08 | 1980-09-05 | Thomson Csf | Tete de couplage opto-electronique |
US4399541A (en) * | 1981-02-17 | 1983-08-16 | Northern Telecom Limited | Light emitting device package having combined heater/cooler |
US4615031A (en) * | 1982-07-27 | 1986-09-30 | International Standard Electric Corporation | Injection laser packages |
JPS5994891A (ja) * | 1982-11-24 | 1984-05-31 | Hitachi Ltd | 半導体レ−ザ装置 |
DE3244882A1 (de) * | 1982-12-03 | 1984-06-07 | Siemens AG, 1000 Berlin und 8000 München | Sende- oder empfangsvorrichtung mit einer mittels eines traegers gehalterten diode |
US4488773A (en) * | 1982-12-23 | 1984-12-18 | United Technologies Corporation | Optical fiber position sensor |
DE3338315A1 (de) | 1983-10-21 | 1985-05-02 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Optoelektrische koppelanordnung |
JPS6123379A (ja) | 1984-07-11 | 1986-01-31 | Hitachi Ltd | 光電子装置 |
JPS61235731A (ja) * | 1985-04-11 | 1986-10-21 | Sharp Corp | 感圧素子 |
JPH0632341B2 (ja) | 1985-05-22 | 1994-04-27 | 株式会社日立製作所 | 光フアイバ付半導体発光装置 |
US4752109A (en) * | 1986-09-02 | 1988-06-21 | Amp Incorporated | Optoelectronics package for a semiconductor laser |
US5068865A (en) * | 1988-06-09 | 1991-11-26 | Nec Corporation | Semiconductor laser module |
US5011256A (en) * | 1988-10-28 | 1991-04-30 | E. I. Du Pont De Nemours And Company | Package for an opto-electronic component |
SU1598700A1 (ru) * | 1988-10-31 | 1996-10-10 | С.А. Алавердян | Способ изготовления герметичного узла сопряжения оптического кабеля с корпусом устройства |
US5123671A (en) * | 1989-03-13 | 1992-06-23 | Monroe Auto Equipment Company | Method and apparatus for controlling shock absorbers |
JPH0317605A (ja) * | 1989-06-15 | 1991-01-25 | Honda Motor Co Ltd | 光ファイバ伝送モジュール |
JPH0356831A (ja) * | 1989-07-25 | 1991-03-12 | Fujitsu Ltd | 冷却型赤外線検知装置 |
US5112456A (en) * | 1989-12-12 | 1992-05-12 | Trustees Of The University Of Pennsylvania | Electrochemical sensors and methods for their use |
US4979787A (en) * | 1990-01-12 | 1990-12-25 | Pco, Inc. | Optical-electronic interface module |
JP2695995B2 (ja) * | 1991-01-14 | 1998-01-14 | 株式会社東芝 | 光半導体装置 |
JPH0575011A (ja) * | 1991-09-18 | 1993-03-26 | Nec Corp | 半導体装置 |
JPH05167301A (ja) * | 1991-12-16 | 1993-07-02 | Mitsubishi Materials Corp | パッケージ構造体 |
US5336389A (en) * | 1992-06-08 | 1994-08-09 | Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Energy, Mines And Resources | Long lasting alkali and alkaline earth metal sensor |
IL107659A0 (en) * | 1993-11-18 | 1994-07-31 | State Of Israel Ministy Of Def | A hand-held infra red imaging probe |
US5586207A (en) * | 1993-11-29 | 1996-12-17 | Northern Telecom Limited | Methods and assemblies for packaging opto-electronic devices and for coupling optical fibers to the packaged devices |
CA2138893C (en) | 1993-12-28 | 1999-12-07 | Hirotoshi Nagata | Package structure for optical element and fibers and composite structure thereof |
US5434940A (en) * | 1994-03-24 | 1995-07-18 | The Whitaker Corporation | Active fiber needle |
US5568585A (en) * | 1995-03-13 | 1996-10-22 | The United States Of America As Represented By The Department Of Energy | Low-temperature hermetic sealing of optical fiber components |
US5571394A (en) * | 1995-05-08 | 1996-11-05 | General Electric Company | Monolithic sensor switch for detecting presence of stoichiometric H2 /O2 ratio in boiling water reactor circuit |
US5685636A (en) * | 1995-08-23 | 1997-11-11 | Science And Engineering Associates, Inc. | Eye safe laser security device |
US5870511A (en) * | 1997-01-27 | 1999-02-09 | Sentec Corporation | Fiber optic temperature sensor |
JPH1010372A (ja) * | 1996-06-20 | 1998-01-16 | Alps Electric Co Ltd | Ldモジュール |
US6351996B1 (en) | 1998-11-12 | 2002-03-05 | Maxim Integrated Products, Inc. | Hermetic packaging for semiconductor pressure sensors |
EP1089406A4 (en) * | 1999-04-20 | 2005-11-02 | Furukawa Electric Co Ltd | LASER MODULE WITH SEMICONDUCTOR |
US6213651B1 (en) * | 1999-05-26 | 2001-04-10 | E20 Communications, Inc. | Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers |
US6181760B1 (en) * | 1999-07-20 | 2001-01-30 | General Electric Company | Electrochemical corrosion potential sensor with increased lifetime |
US6398931B1 (en) * | 2000-01-31 | 2002-06-04 | Phoenix Electrode Company | Combination ion-selective electrode with a replaceable sensing membrane |
US6330829B1 (en) * | 2000-03-16 | 2001-12-18 | Kulite Semiconductor Products Inc. | Oil-filled pressure transducer |
AU2001259451A1 (en) * | 2000-05-04 | 2001-11-12 | Schott Donnelly Llc | Chromogenic glazing |
US6827250B2 (en) * | 2001-06-28 | 2004-12-07 | Microchips, Inc. | Methods for hermetically sealing microchip reservoir devices |
US6834154B2 (en) * | 2001-07-24 | 2004-12-21 | 3M Innovative Properties Co. | Tooling fixture for packaged optical micro-mechanical devices |
US6771859B2 (en) * | 2001-07-24 | 2004-08-03 | 3M Innovative Properties Company | Self-aligning optical micro-mechanical device package |
JP2003197797A (ja) * | 2001-12-25 | 2003-07-11 | Herutsu Kk | 圧電素子の気密封止方法 |
JP2003329888A (ja) * | 2002-05-14 | 2003-11-19 | Fdk Corp | 光ファイバーの取付構造及び光学装置 |
US8169684B2 (en) * | 2002-09-30 | 2012-05-01 | Gentex Corporation | Vehicular rearview mirror elements and assemblies incorporating these elements |
US7376312B2 (en) * | 2002-11-05 | 2008-05-20 | Rohm Co., Ltd. | Optical module and method for manufacturing the same |
JP2004179258A (ja) * | 2002-11-25 | 2004-06-24 | Hamamatsu Photonics Kk | 紫外線センサ |
US6922518B2 (en) * | 2002-12-13 | 2005-07-26 | Lighthouse Capital Partners | Methods and apparatus for sealed fiber optic feedthroughs |
US6773171B2 (en) * | 2003-01-14 | 2004-08-10 | Intel Corporation | Optoelectronic housings and methods of assembling optoelectronic packages |
US7149374B2 (en) * | 2003-05-28 | 2006-12-12 | The United States Of America As Represented By The Secretary Of The Navy | Fiber optic pressure sensor |
JP4256212B2 (ja) * | 2003-06-17 | 2009-04-22 | 浜松ホトニクス株式会社 | 光検出管 |
US7218657B2 (en) * | 2003-07-09 | 2007-05-15 | Sumitomo Electric Industries, Ltd. | Optical transmitting module having a can type package and providing a temperature sensor therein |
EP1517166B1 (en) * | 2003-09-15 | 2015-10-21 | Nuvotronics, LLC | Device package and methods for the fabrication and testing thereof |
US6900509B2 (en) * | 2003-09-19 | 2005-05-31 | Agilent Technologies, Inc. | Optical receiver package |
JP2005165200A (ja) | 2003-12-05 | 2005-06-23 | Seiko Instruments Inc | 光デバイスとその製造方法 |
US7173713B2 (en) * | 2004-03-04 | 2007-02-06 | Virginia Tech Intellectual Properties, Inc. | Optical fiber sensors for harsh environments |
US20050195402A1 (en) * | 2004-03-04 | 2005-09-08 | Russell May | Crystalline optical fiber sensors for harsh environments |
GB0408073D0 (en) * | 2004-04-08 | 2004-05-12 | Council Cent Lab Res Councils | Optical sensor |
JP2005309153A (ja) * | 2004-04-22 | 2005-11-04 | Murata Mfg Co Ltd | 光モジュールのパッケージ構造 |
EP1598686A3 (en) | 2004-05-17 | 2005-12-07 | JDS Uniphase Corporation | RF absorbing strain relief bushing |
JP2006064680A (ja) * | 2004-08-24 | 2006-03-09 | Photonic Science Technology Inc | 光ファイバ振動センサ |
DE102004051468A1 (de) | 2004-10-22 | 2006-04-27 | Robert Bosch Gmbh | Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung |
US7703613B2 (en) * | 2005-02-09 | 2010-04-27 | Haslem Keith R | Adjustable height inlet/outlet liquid level management tools and systems |
US8559770B2 (en) * | 2005-03-02 | 2013-10-15 | Fiso Technologies Inc. | Fabry-perot optical sensor and method of manufacturing the same |
WO2007019676A1 (en) * | 2005-08-12 | 2007-02-22 | Fiso Technologies Inc. | Single piece fabry-perot optical sensor and method of manufacturing the same |
US7561277B2 (en) * | 2006-05-19 | 2009-07-14 | New Jersey Institute Of Technology | MEMS fiber optic microphone |
US20080099861A1 (en) * | 2006-10-19 | 2008-05-01 | S3C, Inc., A California Corporation | Sensor device package having thermally compliant die pad |
US7559701B2 (en) * | 2007-03-19 | 2009-07-14 | General Electric Company | High-temperature pressure sensor and method of assembly |
WO2009025662A1 (en) * | 2007-08-17 | 2009-02-26 | Em4, Inc. | Reducing heating from non-coupled light in power transmitting optical fibers |
BRPI0815682A2 (pt) | 2007-08-22 | 2017-05-23 | The Res Found Of State Univ Of New York | dispositivo para isolamento de respiração de paciente, sistema para compartimento de venilador, e, métodos para compartilhar um único ventilador por pelo menos dois pacientes e para melhorar o desempenho de um ventilador. |
EP2178646A1 (en) | 2007-08-23 | 2010-04-28 | Cynvenio Biosystems, LLC | Trapping magnetic sorting system for target species |
US7499605B1 (en) * | 2007-09-14 | 2009-03-03 | General Electric Company | Fiber Bragg grating for high temperature sensing |
US7574075B2 (en) * | 2007-09-14 | 2009-08-11 | General Electric Company | Fiber Bragg grating and fabrication method |
US7877009B2 (en) * | 2007-12-20 | 2011-01-25 | 3M Innovative Properties Company | Method and system for electrochemical impedance spectroscopy |
US7697798B2 (en) * | 2008-02-11 | 2010-04-13 | The United States Of America As Represented By The Secretary Of The Navy | Fiber optic pressure sensors and catheters |
AT505077B1 (de) * | 2008-06-06 | 2010-01-15 | Avl List Gmbh | Messeinrichtung |
US8643127B2 (en) * | 2008-08-21 | 2014-02-04 | S3C, Inc. | Sensor device packaging |
JP5470784B2 (ja) * | 2008-09-12 | 2014-04-16 | オムロン株式会社 | 受光装置およびセンサ装置 |
WO2011014537A1 (en) * | 2009-07-29 | 2011-02-03 | General Mills Marketing, Inc. | Hffs packaging method and apparatus for refrigerated dough |
US9482927B2 (en) | 2009-10-26 | 2016-11-01 | The Boeing Company | Optical sensor interrogation system |
US8342756B2 (en) * | 2009-12-22 | 2013-01-01 | Jds Uniphase Corporation | Hermetic seal between a package and an optical fiber |
US8215850B2 (en) * | 2009-12-29 | 2012-07-10 | Prasad Yalamanchili | Optical module with fiber feedthrough |
US8369671B2 (en) * | 2010-02-26 | 2013-02-05 | General Electric Company | Hermetically sealed fiber sensing cable |
DE102010019813A1 (de) * | 2010-05-06 | 2011-11-10 | Siemens Aktiengesellschaft | Faseroptischer Vibrationssensor |
US8494312B2 (en) | 2010-08-18 | 2013-07-23 | The Boeing Company | Magnetically actuated photonic crystal sensor |
CN102436045A (zh) * | 2011-12-29 | 2012-05-02 | 武汉电信器件有限公司 | 一种光电子器件的光导纤维的安装固定结构 |
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RU2633675C2 (ru) | 2017-10-16 |
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EP2662676B1 (en) | 2021-06-02 |
US10338328B2 (en) | 2019-07-02 |
US9500808B2 (en) | 2016-11-22 |
RU2013120383A (ru) | 2014-11-20 |
EP2662676A3 (en) | 2014-01-01 |
US10061093B2 (en) | 2018-08-28 |
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