JP6404918B2 - 基材表面を前処理する方法、基材表面をコーティングする方法および基材を部材に接合する方法 - Google Patents

基材表面を前処理する方法、基材表面をコーティングする方法および基材を部材に接合する方法 Download PDF

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JP6404918B2
JP6404918B2 JP2016523265A JP2016523265A JP6404918B2 JP 6404918 B2 JP6404918 B2 JP 6404918B2 JP 2016523265 A JP2016523265 A JP 2016523265A JP 2016523265 A JP2016523265 A JP 2016523265A JP 6404918 B2 JP6404918 B2 JP 6404918B2
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substrate
particles
adhesive
metal
deposited
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JP2016540886A5 (enrdf_load_stackoverflow
JP2016540886A (ja
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ヴィルケン ラルフ
ヴィルケン ラルフ
ポップ マティーアス
ポップ マティーアス
アイド イェルク
アイド イェルク
スチェパノフ セルゲイ
スチェパノフ セルゲイ
デーゲンハルト ヨスト
デーゲンハルト ヨスト
Original Assignee
フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ
フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/48—Generating plasma using an arc
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32614—Consumable cathodes for arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32825—Working under atmospheric pressure or higher
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder or liquid
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/228—Presence of unspecified polymer in the pretreated surface to be joined
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2240/00—Testing
    • H05H2240/10—Testing at atmospheric pressure

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2016523265A 2013-10-15 2014-10-15 基材表面を前処理する方法、基材表面をコーティングする方法および基材を部材に接合する方法 Active JP6404918B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE201310017107 DE102013017107A1 (de) 2013-10-15 2013-10-15 Verfahren zur Vorbehandlung einer Substratoberfläche, Verfahren zur Beschichtung der Substratoberfläche und Verfahren zum Verbinden eines Substrats mit einem Element
DE102013017107.5 2013-10-15
PCT/EP2014/072116 WO2015055717A1 (de) 2013-10-15 2014-10-15 Verfahren zur vorbehandlung einer substratoberfläche, verfahren zur beschichtung der substratoberfläche und verfahren zum verbinden eines substrats mit einem element

Publications (3)

Publication Number Publication Date
JP2016540886A JP2016540886A (ja) 2016-12-28
JP2016540886A5 JP2016540886A5 (enrdf_load_stackoverflow) 2018-01-25
JP6404918B2 true JP6404918B2 (ja) 2018-10-17

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JP2016523265A Active JP6404918B2 (ja) 2013-10-15 2014-10-15 基材表面を前処理する方法、基材表面をコーティングする方法および基材を部材に接合する方法

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JP (1) JP6404918B2 (enrdf_load_stackoverflow)
DE (1) DE102013017107A1 (enrdf_load_stackoverflow)
WO (1) WO2015055717A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018110951A1 (de) 2017-11-03 2019-05-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zum klebtechnischen Verbinden von Elektroblechen und Elektrobleche hergestellt nach einem entsprechenden Verfahren
EP3840541A1 (en) * 2019-12-20 2021-06-23 Molecular Plasma Group SA Improved shield for atmospheric pressure plasma jet coating deposition on a substrate
CN113864302B (zh) * 2021-11-02 2023-01-17 无锡斯贝尔磁性材料有限公司 一种磁芯粘结的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000303039A (ja) * 1999-04-23 2000-10-31 Konica Corp 支持体および支持体の製造方法
DE10223865B4 (de) * 2002-05-29 2007-08-16 Plasmatreat Gmbh Verfahren zur Plasmabeschichtung von Werkstücken
JP4905129B2 (ja) * 2004-02-26 2012-03-28 コニカミノルタホールディングス株式会社 ナノ粒子付着基板の製造方法
DE102004033728B4 (de) * 2004-07-13 2009-07-23 Plasmatreat Gmbh Verfahren zum Bearbeiten und Verkleben von Werkstücken aus einem Metall oder einer Metalllegierung mit einer hydratisierten Oxid- und/oder Hydroxidschicht
JP2006312660A (ja) * 2005-05-06 2006-11-16 Sekisui Chem Co Ltd フォトマスク保護用粘着テープ
DE102006015591B3 (de) * 2006-03-31 2007-11-29 Technische Universität Clausthal Organischer Werkstoff mit katalytisch beschichteter Oberfläche und Verfahren zu dessen Herstellung
DE102009048397A1 (de) 2009-10-06 2011-04-07 Plasmatreat Gmbh Atmosphärendruckplasmaverfahren zur Herstellung oberflächenmodifizierter Partikel und von Beschichtungen

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WO2015055717A1 (de) 2015-04-23
DE102013017107A1 (de) 2015-04-16
JP2016540886A (ja) 2016-12-28

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