JP6385760B2 - 倣い装置 - Google Patents

倣い装置 Download PDF

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Publication number
JP6385760B2
JP6385760B2 JP2014177387A JP2014177387A JP6385760B2 JP 6385760 B2 JP6385760 B2 JP 6385760B2 JP 2014177387 A JP2014177387 A JP 2014177387A JP 2014177387 A JP2014177387 A JP 2014177387A JP 6385760 B2 JP6385760 B2 JP 6385760B2
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JP
Japan
Prior art keywords
copying
spherical surface
base
copying member
porous material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014177387A
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English (en)
Japanese (ja)
Other versions
JP2016051857A5 (enExample
JP2016051857A (ja
Inventor
伊藤　秀和
秀和 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Corp
Original Assignee
CKD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD Corp filed Critical CKD Corp
Priority to JP2014177387A priority Critical patent/JP6385760B2/ja
Priority to TW103143619A priority patent/TWI598205B/zh
Priority to CN201410811991.1A priority patent/CN105364634B/zh
Priority to KR1020140193361A priority patent/KR101717463B1/ko
Publication of JP2016051857A publication Critical patent/JP2016051857A/ja
Publication of JP2016051857A5 publication Critical patent/JP2016051857A5/ja
Application granted granted Critical
Publication of JP6385760B2 publication Critical patent/JP6385760B2/ja
Active legal-status Critical Current
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Automatic Assembly (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Manipulator (AREA)
  • Toys (AREA)
JP2014177387A 2014-09-01 2014-09-01 倣い装置 Active JP6385760B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014177387A JP6385760B2 (ja) 2014-09-01 2014-09-01 倣い装置
TW103143619A TWI598205B (zh) 2014-09-01 2014-12-15 仿形裝置
CN201410811991.1A CN105364634B (zh) 2014-09-01 2014-12-19 仿形装置
KR1020140193361A KR101717463B1 (ko) 2014-09-01 2014-12-30 모방 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014177387A JP6385760B2 (ja) 2014-09-01 2014-09-01 倣い装置

Publications (3)

Publication Number Publication Date
JP2016051857A JP2016051857A (ja) 2016-04-11
JP2016051857A5 JP2016051857A5 (enExample) 2017-10-05
JP6385760B2 true JP6385760B2 (ja) 2018-09-05

Family

ID=55367517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014177387A Active JP6385760B2 (ja) 2014-09-01 2014-09-01 倣い装置

Country Status (4)

Country Link
JP (1) JP6385760B2 (enExample)
KR (1) KR101717463B1 (enExample)
CN (1) CN105364634B (enExample)
TW (1) TWI598205B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107116385B (zh) * 2017-06-19 2023-08-08 苏州赛腾精密电子股份有限公司 一种手机壳公模治具
JP7107675B2 (ja) * 2017-12-14 2022-07-27 三星電子株式会社 半導体実装装置および半導体実装方法
JP7325705B2 (ja) * 2019-04-25 2023-08-15 Smc株式会社 倣い装置
JP7722291B2 (ja) * 2021-10-12 2025-08-13 株式会社デンソー フローティング当接装置
JP2025034151A (ja) * 2023-08-30 2025-03-13 Ckd株式会社 傾き調整装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306979A (ja) * 1999-04-19 2000-11-02 Ckd Corp 倣い装置
JP4098949B2 (ja) * 1999-08-25 2008-06-11 シーケーディ株式会社 倣い装置
JP4081226B2 (ja) * 1999-08-25 2008-04-23 シーケーディ株式会社 回り止め装置、同装置に対する加圧流体の供給方法、及び倣い装置
JP4547652B2 (ja) * 2000-04-03 2010-09-22 Ｓｍｃ株式会社 自動調芯押付け装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP4081247B2 (ja) * 2001-05-31 2008-04-23 シーケーディ株式会社 倣い装置及び倣い装置における倣い状態保持方法
EP1777035A3 (en) * 2004-11-09 2007-05-16 Seiko Epson Corporation Elastic polishing tool and lens polishing method using this tool
TWI380944B (zh) * 2004-11-24 2013-01-01 Ckd Corp A floating unit having a tilting function, and a floating device
CN100484713C (zh) * 2006-09-30 2009-05-06 中国地质大学（武汉） 光学二次非球面凹面零件仿形加工方法及装置
JP5053949B2 (ja) * 2008-07-23 2012-10-24 Ｃｋｄ株式会社 倣い装置

Also Published As

Publication number Publication date
CN105364634B (zh) 2017-11-24
CN105364634A (zh) 2016-03-02
JP2016051857A (ja) 2016-04-11
KR20160026617A (ko) 2016-03-09
TWI598205B (zh) 2017-09-11
KR101717463B1 (ko) 2017-03-17
TW201609339A (zh) 2016-03-16

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