JP6383258B2 - 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材 - Google Patents

樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材 Download PDF

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JP6383258B2
JP6383258B2 JP2014227040A JP2014227040A JP6383258B2 JP 6383258 B2 JP6383258 B2 JP 6383258B2 JP 2014227040 A JP2014227040 A JP 2014227040A JP 2014227040 A JP2014227040 A JP 2014227040A JP 6383258 B2 JP6383258 B2 JP 6383258B2
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propylene
resin composition
olefin copolymer
copolymer
olefin
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JP2016089090A5 (enExample
JP2016089090A (ja
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庸祐 ▲高▼橋
庸祐 ▲高▼橋
田中　正和
正和 田中
邦昭 川辺
邦昭 川辺
浩貴 金谷
浩貴 金谷
裕介 富田
裕介 富田
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Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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JP2014227040A 2014-11-07 2014-11-07 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材 Active JP6383258B2 (ja)

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JP2014227040A JP6383258B2 (ja) 2014-11-07 2014-11-07 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材

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JP2014227040A JP6383258B2 (ja) 2014-11-07 2014-11-07 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材

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JP2016089090A5 JP2016089090A5 (enExample) 2017-08-24
JP6383258B2 true JP6383258B2 (ja) 2018-08-29

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Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
JP6973411B2 (ja) * 2016-12-22 2021-11-24 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム、ボンディングシート、銅張積層板及び電磁波シールド材
TWI637405B (zh) * 2017-03-15 2018-10-01 臻鼎科技股份有限公司 低介電樹脂組合物及應用其的膠片及電路板
US11739239B2 (en) 2017-07-11 2023-08-29 Sunstar Engineering Inc. Thermally crosslinkable composition
US20210009865A1 (en) * 2018-03-07 2021-01-14 Toagosei Co., Ltd. Adhesive composition, and adhesive layer-equipped layered product using same
EP3831906A4 (en) * 2018-08-02 2022-04-06 Idemitsu Kosan Co., Ltd. POLYPROPYLENE-BASED ADHESIVE AND ITS PRODUCTION PROCESS
WO2021256416A1 (ja) * 2020-06-16 2021-12-23 東亞合成株式会社 接着剤組成物

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KR20070087670A (ko) * 2004-12-21 2007-08-28 다우 글로벌 테크놀로지스 인크. 폴리프로필렌-기재의 접착제 조성물
JP5539257B2 (ja) * 2011-04-22 2014-07-02 三井化学株式会社 オレフィン系重合体、該オレフィン系重合体の製造方法、オレフィン系重合体を用いてなる光硬化性組成物、硬化物の製造方法及び硬化物

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