JP6379542B2 - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
JP6379542B2
JP6379542B2 JP2014051577A JP2014051577A JP6379542B2 JP 6379542 B2 JP6379542 B2 JP 6379542B2 JP 2014051577 A JP2014051577 A JP 2014051577A JP 2014051577 A JP2014051577 A JP 2014051577A JP 6379542 B2 JP6379542 B2 JP 6379542B2
Authority
JP
Japan
Prior art keywords
emitting device
light emitting
electrode
wiring
mounting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014051577A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015176713A5 (enExample
JP2015176713A (ja
Inventor
祐太 岡
祐太 岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2014051577A priority Critical patent/JP6379542B2/ja
Priority to US14/657,474 priority patent/US9660162B2/en
Publication of JP2015176713A publication Critical patent/JP2015176713A/ja
Publication of JP2015176713A5 publication Critical patent/JP2015176713A5/ja
Application granted granted Critical
Publication of JP6379542B2 publication Critical patent/JP6379542B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2014051577A 2014-03-14 2014-03-14 照明装置 Active JP6379542B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014051577A JP6379542B2 (ja) 2014-03-14 2014-03-14 照明装置
US14/657,474 US9660162B2 (en) 2014-03-14 2015-03-13 Illumination device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014051577A JP6379542B2 (ja) 2014-03-14 2014-03-14 照明装置

Publications (3)

Publication Number Publication Date
JP2015176713A JP2015176713A (ja) 2015-10-05
JP2015176713A5 JP2015176713A5 (enExample) 2017-03-02
JP6379542B2 true JP6379542B2 (ja) 2018-08-29

Family

ID=54069896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014051577A Active JP6379542B2 (ja) 2014-03-14 2014-03-14 照明装置

Country Status (2)

Country Link
US (1) US9660162B2 (enExample)
JP (1) JP6379542B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102472353B1 (ko) * 2016-04-01 2022-11-30 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자, 어레이 기판, 패널, 및 이를 포함하는 표시장치
JP6933794B2 (ja) * 2016-12-01 2021-09-08 富士通株式会社 光モジュール及び光モジュールの製造方法
JP6956552B2 (ja) * 2017-07-19 2021-11-02 株式会社小糸製作所 車載用電子回路実装基板
US10796212B2 (en) * 2018-10-02 2020-10-06 Xerox Corporation Orientation-agnostic method to interface to printed memory label
CN110139501B (zh) * 2019-05-30 2020-06-19 苏州维信电子有限公司 防止麦克风功能不良的生产工艺
WO2022264543A1 (ja) * 2021-06-17 2022-12-22 株式会社村田製作所 実装部品および実装基板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516415A (en) * 1978-07-21 1980-02-05 Hitachi Ltd Diode
JP3627822B2 (ja) * 1994-08-18 2005-03-09 ローム株式会社 半導体発光素子、およびその製造方法
JPH10209496A (ja) 1997-01-24 1998-08-07 Rohm Co Ltd 半導体発光素子
JP2002076602A (ja) 2000-08-23 2002-03-15 Yazaki Corp 表示基板のチップ実装方法
JP2003110245A (ja) * 2001-09-28 2003-04-11 Ibiden Co Ltd 光学素子実装用基板の製造方法、光学素子実装用基板及び光学素子
JP4092570B2 (ja) * 2003-07-23 2008-05-28 セイコーエプソン株式会社 光素子およびその製造方法、光モジュール、ならびに光モジュールの駆動方法
JP4632690B2 (ja) * 2004-05-11 2011-02-16 スタンレー電気株式会社 半導体発光装置とその製造方法
JP2006128202A (ja) 2004-10-26 2006-05-18 Kyocera Corp 発光素子およびそれを用いた照明装置
JP2006332492A (ja) 2005-05-30 2006-12-07 Calsonic Kansei Corp プリント基板
JP2008270728A (ja) 2007-03-27 2008-11-06 Kyocera Corp 発光装置および照明装置
JP2010153561A (ja) * 2008-12-25 2010-07-08 Nichia Corp 発光装置
KR20120082190A (ko) * 2011-01-13 2012-07-23 삼성엘이디 주식회사 발광소자 패키지
WO2013010389A1 (zh) * 2011-07-15 2013-01-24 中国科学院半导体研究所 发光二极管封装结构及其制造方法
JP5662277B2 (ja) * 2011-08-08 2015-01-28 株式会社東芝 半導体発光装置及び発光モジュール
JP2013153068A (ja) * 2012-01-25 2013-08-08 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法
JP6293995B2 (ja) * 2012-03-23 2018-03-14 新光電気工業株式会社 発光素子搭載用パッケージ及びその製造方法、並びに発光素子パッケージ
WO2013161208A1 (ja) * 2012-04-27 2013-10-31 パナソニック株式会社 発光素子

Also Published As

Publication number Publication date
US9660162B2 (en) 2017-05-23
US20150263250A1 (en) 2015-09-17
JP2015176713A (ja) 2015-10-05

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