JP6362416B2 - 保持装置、リソグラフィ装置、および物品の製造方法 - Google Patents

保持装置、リソグラフィ装置、および物品の製造方法 Download PDF

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Publication number
JP6362416B2
JP6362416B2 JP2014106683A JP2014106683A JP6362416B2 JP 6362416 B2 JP6362416 B2 JP 6362416B2 JP 2014106683 A JP2014106683 A JP 2014106683A JP 2014106683 A JP2014106683 A JP 2014106683A JP 6362416 B2 JP6362416 B2 JP 6362416B2
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pressure
space
holding device
pipe
chuck
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JP2015222778A5 (enExample
JP2015222778A (ja
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加寿夫 曽根
加寿夫 曽根
弘志 今成
弘志 今成
雄己 内田
雄己 内田
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Canon Inc
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Canon Inc
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2014106683A 2014-05-23 2014-05-23 保持装置、リソグラフィ装置、および物品の製造方法 Active JP6362416B2 (ja)

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JP2014106683A JP6362416B2 (ja) 2014-05-23 2014-05-23 保持装置、リソグラフィ装置、および物品の製造方法

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JP2014106683A JP6362416B2 (ja) 2014-05-23 2014-05-23 保持装置、リソグラフィ装置、および物品の製造方法

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JP2015222778A JP2015222778A (ja) 2015-12-10
JP2015222778A5 JP2015222778A5 (enExample) 2017-06-29
JP6362416B2 true JP6362416B2 (ja) 2018-07-25

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6838880B2 (ja) * 2016-07-15 2021-03-03 キヤノン株式会社 基板保持装置、リソグラフィ装置、及び物品の製造方法
JP7414513B2 (ja) * 2019-12-20 2024-01-16 キヤノン株式会社 弁装置、保持装置、リソグラフィ装置、および物品の製造方法
JP7495819B2 (ja) * 2020-06-05 2024-06-05 キヤノン株式会社 保持装置、リソグラフィ装置及び物品の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283512A (ja) * 1992-03-31 1993-10-29 Oki Electric Ind Co Ltd ウエハ用真空チャックとこれを用いた半導体装置の製造方法
JPH1187470A (ja) * 1997-09-11 1999-03-30 Sony Corp 半導体チップの保持搬送装置
JP2000082737A (ja) * 1998-09-04 2000-03-21 Canon Inc 基板チャック、露光装置およびデバイス製造方法ならびに基板搬送システムおよび基板搬送方法
US20060135047A1 (en) * 2004-12-22 2006-06-22 Alexei Sheydayi Method and apparatus for clamping a substrate in a high pressure processing system
US8994923B2 (en) * 2008-09-22 2015-03-31 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
JP2010128079A (ja) * 2008-11-26 2010-06-10 Hitachi High-Technologies Corp プロキシミティ露光装置、プロキシミティ露光装置の基板支持方法、及び表示用パネル基板の製造方法
JP5820672B2 (ja) * 2011-09-13 2015-11-24 株式会社イズミコーポレーション 真空チャック装置

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