JP6356718B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 12
- 239000003990 capacitor Substances 0.000 claims description 25
- 230000001934 delay Effects 0.000 claims description 3
- 230000005669 field effect Effects 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
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- H—ELECTRICITY
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- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
- H03K17/0812—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit
- H03K17/08122—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit in field-effect transistor switches
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/16—Modifications for eliminating interference voltages or currents
- H03K17/161—Modifications for eliminating interference voltages or currents in field-effect transistor switches
- H03K17/162—Modifications for eliminating interference voltages or currents in field-effect transistor switches without feedback from the output circuit to the control circuit
- H03K17/163—Soft switching
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
図1は、第1の実施形態による高電圧スイッチング回路1(以下、スイッチング回路1)の構成の一例を示す図である。スイッチング回路1は、ノーマリオン素子Q1と、ノーマリオフ素子Q2と、ダイオードD1と、キャパシタC1と、ドライバIV1、IV2と、を備えている。スイッチング回路1は、第1電圧源としての高電圧源Vhと第2電圧源としての低電圧源GNDとの間に介在している。スイッチング回路1は、制御信号としてのドライブ信号DRVを受けて、ドライブ信号DRVに従って高電圧源Vhと低電圧源GNDとの間を電気的に接続または切断する。これにより、スイッチング回路1は、高電圧源Vhから負荷2への電力供給をスイッチングする。負荷2は、スイッチング回路1と高電圧源Vhとの間に電気的に接続されており、高電圧源Vhからの電力の供給を受けて動作する任意の電子機器である。
スイッチング回路1がオン状態である場合、ドライブ信号DRVは、論理ロウであり、第1ドライバIV1は、高電圧源VDDの電圧(以下、単に、電圧VDDという)を出力し、キャパシタC1を介してノーマリオン素子Q1のゲートを電圧VDDへ上昇させようとする。このとき、ダイオードD1は、順方向バイアスを受けて、ノーマリオン素子Q1のゲートから低電圧源GNDへ電荷を逃がす。これにより、ノーマリオン素子Q1のゲート電圧は、低電圧源GNDの電圧(以下、単に、電圧GNDという)に接近し、電圧GNDにダイオードD1の順方向降下電圧Vfを加算した電圧(Vf+GND)となる。ノーマリオン素子Q1の閾値電圧は、電圧GNDよりも低電圧に設定される。これにより、ノーマリオン素子Q1は、電圧GNDに近い電圧(Vf+GND)であっても導通状態となる。
スイッチング回路1がオフ状態である場合、ドライブ信号DRVは、論理ハイであり、第1ドライバIV1は、電圧GNDを出力し、キャパシタC1を介してノーマリオン素子Q1のゲートを電圧GNDへ低下させようとする。このとき、ダイオードD1は、逆方向バイアスを受けるが、低電圧源GNDからの電荷がノーマリオン素子Q1のゲートへ流れることを阻止する。これにより、ノーマリオン素子Q1のゲート電圧は、第1ドライバIV1の電圧降下分だけ、ノーマリオン素子Q1のゲート電圧を電圧(Vf+GND)から降下させることになる。従って、ノーマリオン素子Q1のゲート電圧は、電圧GND未満の低レベル電圧Vlになる。例えば、電圧VDDが約8Vであり、電圧(Vf+GND)が約0.6Vである場合、ノーマリオン素子Q1のゲート電圧は、電圧(Vf+GND)から約8Vだけ低下させた電圧(約−7.4V)なる。即ち、この場合、低レベル電圧Vlは、約−7.4Vの負電圧となる。ノーマリオン素子Q1の閾値電圧を電圧GNDと低レベル電圧Vlとの間に設定すれば、ノーマリオン素子Q1のゲート電圧が低レベル電圧Vlになったときにノーマリオン素子Q1は非導通状態となる。
スイッチング回路1がオン状態からオフ状態になる場合、第1および第2ドライバIV1、IV2は、それぞれノーマリオン素子Q1のゲート電圧およびノーマリオフ素子Q2のゲート電圧をほぼ同時に立ち下げ、それにより、ノーマリオン素子Q1およびノーマリオフ素子Q2をほぼ同時に非導通状態にする。
スイッチング回路1がオフ状態からオン状態になる場合、第1および第2ドライバIV1、IV2は、それぞれノーマリオン素子Q1のゲート電圧およびノーマリオフ素子Q2のゲート電圧をほぼ同時に立ち上げる。それにより、ノーマリオン素子Q1およびノーマリオフ素子Q2がほぼ同時に導通状態になる(ターンオンする)。あるいは、ノーマリオフ素子Q2がノーマリオン素子Q1よりも若干先にターンオンする。
図3は、第2の実施形態による高電圧スイッチング回路11(以下、スイッチング回路11)の構成の一例を示す図である。スイッチング回路11は、遅延回路DLYと、第3ドライバIV3とをさらに備えている。第2の実施形態のその他の構成は、第1の実施形態のその他の構成と同様でよい。
Claims (5)
- 第1電圧源と第2電圧源との間に直列に接続された第1および第2トランジスタであって、該第2トランジスタの閾値電圧が該第1トランジスタの閾値電圧よりも高い第1および第2トランジスタと、
前記第1トランジスタのゲートと前記第2電圧源との間に電気的に接続されたダイオードと、
前記第1トランジスタのゲートに一端が電気的に接続された第1キャパシタと、
前記第1キャパシタの他端に電気的に接続された第1ドライバと、
前記第2トランジスタのゲートに電気的に接続された第2ドライバと、
前記第2ドライバの入力に電気的に接続された遅延回路とを備え、
前記遅延回路は、前記第2トランジスタをオン状態からオフ状態にする制御信号を遅延させ、
前記遅延回路の遅延時間は、前記制御信号の周期よりも長い、半導体装置。 - 前記第1トランジスタは、該第1トランジスタのゲートに電圧が印加されていないときに導通状態であるノーマリオン素子であり、
前記第2トランジスタは、該第2トランジスタのゲートに電圧が印加されていないときに非導通状態であるノーマリオフ素子である、請求項1に記載の半導体装置。 - 前記第1トランジスタは、GaN系HEMT(High Electron Mobility Transistor)である、請求項1または請求項2に記載の半導体装置。
- 前記第2トランジスタは、MISFET(Metal Insulator Semiconductor Field Effect Transistor)である、請求項1から請求項3のいずれか一項に記載の半導体装置。
- 前記ダイオードのアノードは、前記第1トランジスタのゲートに電気的に接続され、
前記ダイオードのカソードは、前記第2電圧源に電気的に接続されている、請求項1から請求項4のいずれか一項に記載の半導体装置。
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JP2016050079A JP6356718B2 (ja) | 2016-03-14 | 2016-03-14 | 半導体装置 |
US15/233,724 US9912332B2 (en) | 2016-03-14 | 2016-08-10 | Semiconductor device |
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JP6779932B2 (ja) * | 2018-03-20 | 2020-11-04 | 株式会社東芝 | 半導体装置 |
TWI723470B (zh) | 2018-07-31 | 2021-04-01 | 台灣積體電路製造股份有限公司 | 驅動電路、積體電路、及操作驅動電路的方法 |
JP7337618B2 (ja) * | 2019-09-17 | 2023-09-04 | 株式会社東芝 | 半導体装置 |
JP7242487B2 (ja) * | 2019-09-17 | 2023-03-20 | 株式会社東芝 | 半導体装置 |
JP7378372B2 (ja) * | 2020-09-18 | 2023-11-13 | 株式会社東芝 | 半導体装置 |
CN114844493B (zh) * | 2022-05-20 | 2023-07-25 | 湖南炬神电子有限公司 | 一种双驱动级联器件的延时驱动电路 |
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US4692643A (en) * | 1983-10-28 | 1987-09-08 | Hitachi, Ltd. | Semiconductor switching device having plural MOSFET's, GTO's or the like connected in series |
JPH11233285A (ja) * | 1998-02-18 | 1999-08-27 | Aibis:Kk | 調光制御装置 |
US6597210B2 (en) * | 2001-10-03 | 2003-07-22 | Bruce W. Carsten | Apparatus and method for control and driving BJT used as controlled rectifier |
CN100403549C (zh) * | 2002-12-19 | 2008-07-16 | 松下电器产业株式会社 | 半导体器件及保持电路 |
JP4077337B2 (ja) | 2003-02-27 | 2008-04-16 | 株式会社東芝 | パルス発生回路及びそれを用いたハイサイドドライバ回路 |
CH700419A2 (de) * | 2009-02-05 | 2010-08-13 | Eth Zuerich | Jfet-serieschaltung. |
JP5350074B2 (ja) | 2009-05-22 | 2013-11-27 | 旭化成エレクトロニクス株式会社 | 同期整流型dc−dcコンバータ |
US8569842B2 (en) * | 2011-01-07 | 2013-10-29 | Infineon Technologies Austria Ag | Semiconductor device arrangement with a first semiconductor device and with a plurality of second semiconductor devices |
US8455948B2 (en) * | 2011-01-07 | 2013-06-04 | Infineon Technologies Austria Ag | Transistor arrangement with a first transistor and with a plurality of second transistors |
JP2013013044A (ja) | 2011-05-31 | 2013-01-17 | Sanken Electric Co Ltd | ゲートドライブ回路 |
JP5959901B2 (ja) * | 2012-04-05 | 2016-08-02 | 株式会社日立製作所 | 半導体駆動回路および電力変換装置 |
JP5979998B2 (ja) * | 2012-06-18 | 2016-08-31 | ルネサスエレクトロニクス株式会社 | 半導体装置及びそれを用いたシステム |
US9035690B2 (en) * | 2012-08-30 | 2015-05-19 | Infineon Technologies Dresden Gmbh | Circuit arrangement with a first semiconductor device and with a plurality of second semiconductor devices |
JP5996465B2 (ja) | 2013-03-21 | 2016-09-21 | 株式会社東芝 | 半導体装置 |
JP6251387B2 (ja) * | 2014-05-16 | 2017-12-20 | シャープ株式会社 | 複合型半導体装置 |
US9190993B1 (en) * | 2015-01-08 | 2015-11-17 | United Silicon Carbide, Inc. | High voltage switch |
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