JP6355893B2 - フラックス塗布装置およびフラックス塗布方法 - Google Patents

フラックス塗布装置およびフラックス塗布方法 Download PDF

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Publication number
JP6355893B2
JP6355893B2 JP2013072980A JP2013072980A JP6355893B2 JP 6355893 B2 JP6355893 B2 JP 6355893B2 JP 2013072980 A JP2013072980 A JP 2013072980A JP 2013072980 A JP2013072980 A JP 2013072980A JP 6355893 B2 JP6355893 B2 JP 6355893B2
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Japan
Prior art keywords
flux
flow rate
application
unit
substrate
Prior art date
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JP2013072980A
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English (en)
Japanese (ja)
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JP2014197630A (ja
JP2014197630A5 (enExample
Inventor
和憲 大清水
和憲 大清水
昇 橋本
昇 橋本
直人 向井
直人 向井
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Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP2013072980A priority Critical patent/JP6355893B2/ja
Priority to CN201410123065.5A priority patent/CN104070256B/zh
Publication of JP2014197630A publication Critical patent/JP2014197630A/ja
Publication of JP2014197630A5 publication Critical patent/JP2014197630A5/ja
Application granted granted Critical
Publication of JP6355893B2 publication Critical patent/JP6355893B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2013072980A 2013-03-29 2013-03-29 フラックス塗布装置およびフラックス塗布方法 Active JP6355893B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013072980A JP6355893B2 (ja) 2013-03-29 2013-03-29 フラックス塗布装置およびフラックス塗布方法
CN201410123065.5A CN104070256B (zh) 2013-03-29 2014-03-28 焊剂涂布装置以及焊剂涂布方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013072980A JP6355893B2 (ja) 2013-03-29 2013-03-29 フラックス塗布装置およびフラックス塗布方法

Publications (3)

Publication Number Publication Date
JP2014197630A JP2014197630A (ja) 2014-10-16
JP2014197630A5 JP2014197630A5 (enExample) 2016-03-17
JP6355893B2 true JP6355893B2 (ja) 2018-07-11

Family

ID=51592084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013072980A Active JP6355893B2 (ja) 2013-03-29 2013-03-29 フラックス塗布装置およびフラックス塗布方法

Country Status (2)

Country Link
JP (1) JP6355893B2 (enExample)
CN (1) CN104070256B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6269568B2 (ja) * 2015-05-12 2018-01-31 株式会社村田製作所 フラックス塗布装置及びフラックス塗布方法
JP5910787B1 (ja) * 2015-10-22 2016-04-27 千住金属工業株式会社 フラックス回収装置
CN105789093A (zh) * 2016-03-28 2016-07-20 珠海迈科智能科技股份有限公司 一种散热器自动贴装设备
WO2023002557A1 (ja) * 2021-07-20 2023-01-26 株式会社新川 フラックス転写装置
CN118385692B (zh) * 2024-06-26 2024-09-06 深圳市丹宇电子有限公司 一种基于人工智能的波峰焊助焊剂喷雾控制方法及介质

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2535473B2 (ja) * 1987-08-27 1996-09-18 富士機械製造株式会社 プリント基板用高粘性流体塗布装置
JP2708957B2 (ja) * 1990-04-19 1998-02-04 三洋電機株式会社 塗布装置
JP2538701B2 (ja) * 1990-06-28 1996-10-02 日本電気株式会社 噴霧式フラックス塗布装置
GB2245508B (en) * 1990-06-28 1995-02-01 Nec Corp Spray type flux applying device
JPH04113476U (ja) * 1991-03-19 1992-10-05 日本電気株式会社 フラツクス塗布装置
JP2592948Y2 (ja) * 1993-07-20 1999-03-31 大阪アサヒ化学株式会社 スプレー塗布量のコントロール装置
JP2820595B2 (ja) * 1993-07-30 1998-11-05 日本電熱計器株式会社 噴霧式フラックス塗布装置および塗布方法
JPH07321430A (ja) * 1994-05-20 1995-12-08 Nippon Avionics Co Ltd プリント配線板の接着剤塗布径測定方法およびプリント配線板
JP4365946B2 (ja) * 1999-08-06 2009-11-18 株式会社タムラ製作所 フラックス塗布方法およびフラックス塗布装置
TW200800411A (en) * 2006-06-28 2008-01-01 Nordson Corp Conformal coating system with closed loop control
JP5326565B2 (ja) * 2008-12-27 2013-10-30 千住金属工業株式会社 フラックス塗布装置及び方法
JP2011025294A (ja) * 2009-07-28 2011-02-10 Hioki Ee Corp フラックス塗布装置およびフラックス塗布方法

Also Published As

Publication number Publication date
CN104070256A (zh) 2014-10-01
JP2014197630A (ja) 2014-10-16
CN104070256B (zh) 2018-09-25

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