JP6354468B2 - 乾燥装置、及び画像形成装置 - Google Patents
乾燥装置、及び画像形成装置 Download PDFInfo
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- JP6354468B2 JP6354468B2 JP2014178080A JP2014178080A JP6354468B2 JP 6354468 B2 JP6354468 B2 JP 6354468B2 JP 2014178080 A JP2014178080 A JP 2014178080A JP 2014178080 A JP2014178080 A JP 2014178080A JP 6354468 B2 JP6354468 B2 JP 6354468B2
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- 238000001035 drying Methods 0.000 title claims description 41
- 238000011144 upstream manufacturing Methods 0.000 claims description 59
- 239000007788 liquid Substances 0.000 claims description 5
- 238000009826 distribution Methods 0.000 description 26
- 239000000976 ink Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Ink Jet (AREA)
- Semiconductor Lasers (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
- Drying Of Solid Materials (AREA)
Description
20 画像形成部
22 制御部
30 記憶部
40 ヘッド駆動部
50 印字ヘッド
60 レーザ駆動部
70 レーザ乾燥装置
71、72 VCSEL
76 レーザ素子
80 給紙ロール
81 表面電極
82、84 給電パッド(ボンディングパッド)
86 裏面電極
88 チップ本体
89 基板
90 排出ロール
100 搬送ローラ
110 用紙速度検出センサ
P 連続紙
Claims (6)
- 複数のレーザ素子を備えた面発光レーザ素子が記録媒体の搬送方向に沿って複数個配置され、前記面発光レーザ素子は、レーザ照射面と、前記レーザ照射面と反対側の裏面と、に電極が各々配置されると共に、
前記レーザ照射面の電極の前記記録媒体の搬送方向と交差する前記記録媒体の幅方向における両端側に第1の給電パッドが各々設けられ、且つ、前記裏面の電極の前記記録媒体の搬送方向における一端側に第2の給電パッドが設けられ、
前記記録媒体の搬送方向の上流側に配置される前記面発光レーザ素子の前記第1の給電パッドの各々と、前記記録媒体の搬送方向の下流側に配置される前記面発光レーザ素子の前記第2の給電パッドと、がワイヤで接続された
乾燥装置。 - 前記レーザ照射面から照射されるレーザを遮らないように、前記第1の給電パッドの各々と前記第2の給電パッドと、が前記ワイヤで接続された
請求項1記載の乾燥装置。 - 前記第1の給電パッドの各々は、前記記録媒体の搬送方向を長手方向とした形状であり、且つ、前記第1の給電パッドには前記ワイヤの接続点が複数設けられると共に、前記第2の給電パッドは、前記記録媒体の幅方向を長手方向とした形状であり、且つ、前記第2の給電パッドには前記ワイヤの接続点が複数設けられ、
前記記録媒体の搬送方向の上流側に配置される前記面発光レーザ素子の前記第1の給電パッドに設けられた複数の接続点のうち、前記記録媒体の搬送方向の下流側に配置される前記面発光レーザ素子に近い接続点と、前記記録媒体の搬送方向の下流側に配置される前記面発光レーザ素子の前記第2の給電パッドに設けられた複数の接続点のうち、前記記録媒体の幅方向において前記記録媒体の搬送方向の下流側に配置される前記面発光レーザ素子の中央に近い接続点と、が前記ワイヤで接続された
請求項2記載の乾燥装置。 - 前記記録媒体の搬送方向の上流側に配置される前記面発光レーザ素子の前記第1の給電パッドに設けられた複数の接続点のうち、前記記録媒体の搬送方向の下流側に配置される前記面発光レーザ素子に近い接続点から順に、前記記録媒体の搬送方向の下流側に配置される前記面発光レーザ素子の前記第2の給電パッドに設けられた複数の接続点のうち、前記記録媒体の幅方向において前記記録媒体の搬送方向の下流側に配置される前記面発光レーザ素子の中央に近い接続点と前記ワイヤで接続された
請求項3記載の乾燥装置。 - 前記記録媒体の搬送方向の下流側に配置される前記面発光レーザ素子の前記第2の給電パッドから前記記録媒体の搬送方向の上流側に配置される前記面発光レーザ素子の前記第1の給電パッドへ向かって前記ワイヤが接続された
請求項1〜請求項4の何れか1項に記載の乾燥装置。 - 画像に応じて液滴を記録媒体に吐出する吐出手段と、
前記記録媒体を搬送する搬送手段と、
請求項1〜請求項5の何れか1項に記載の乾燥装置と、
前記吐出手段、前記搬送手段、及び前記乾燥装置を制御する制御手段と、
を備えた画像形成装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014178080A JP6354468B2 (ja) | 2014-09-02 | 2014-09-02 | 乾燥装置、及び画像形成装置 |
US14/605,060 US9340041B2 (en) | 2014-09-02 | 2015-01-26 | Drying device and image forming apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014178080A JP6354468B2 (ja) | 2014-09-02 | 2014-09-02 | 乾燥装置、及び画像形成装置 |
Publications (2)
Publication Number | Publication Date |
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JP2016049755A JP2016049755A (ja) | 2016-04-11 |
JP6354468B2 true JP6354468B2 (ja) | 2018-07-11 |
Family
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JP2014178080A Active JP6354468B2 (ja) | 2014-09-02 | 2014-09-02 | 乾燥装置、及び画像形成装置 |
Country Status (2)
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US (1) | US9340041B2 (ja) |
JP (1) | JP6354468B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102018127977A1 (de) * | 2018-11-08 | 2020-05-14 | Osram Opto Semiconductors Gmbh | Diodenlaser und verfahren zum betreiben eines diodenlasers |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5936988A (ja) * | 1982-08-26 | 1984-02-29 | Agency Of Ind Science & Technol | 垂直発振型半導体レ−ザ |
JPH09283859A (ja) * | 1996-04-12 | 1997-10-31 | Canon Inc | 偏波変調可能な面発光半導体レーザ |
JPH11186670A (ja) * | 1997-12-22 | 1999-07-09 | Canon Inc | 面型光デバイスおよびその製造方法 |
JP2006239508A (ja) | 2005-03-01 | 2006-09-14 | Seiko Epson Corp | 液滴吐出装置 |
JP4420075B2 (ja) | 2007-07-17 | 2010-02-24 | セイコーエプソン株式会社 | 液滴吐出ヘッド |
TWM379163U (en) * | 2009-11-26 | 2010-04-21 | Truelight Corp | Packaging apparatus for high power and high orientation matrix semiconductor light-emitting devices |
DE102012209266A1 (de) * | 2012-06-01 | 2013-12-05 | Robert Bosch Gmbh | Schaltungsanordnung und Herstellungsverfahren hierfür |
JP6064514B2 (ja) * | 2012-10-24 | 2017-01-25 | 富士ゼロックス株式会社 | 液滴乾燥装置、印刷装置およびプログラム |
JP5983327B2 (ja) * | 2012-11-08 | 2016-08-31 | 富士ゼロックス株式会社 | 画像形成装置、定着装置、及び乾燥装置 |
US20140210880A1 (en) * | 2013-01-31 | 2014-07-31 | Hewlett-Packard Industrial Printing Ltd. | Uniform output of light-emitting diode array |
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2014
- 2014-09-02 JP JP2014178080A patent/JP6354468B2/ja active Active
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2015
- 2015-01-26 US US14/605,060 patent/US9340041B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US20160059583A1 (en) | 2016-03-03 |
JP2016049755A (ja) | 2016-04-11 |
US9340041B2 (en) | 2016-05-17 |
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