JP6348660B2 - オプトエレクトロニクス半導体部品およびオプトエレクトロニクス半導体部品の製造方法 - Google Patents
オプトエレクトロニクス半導体部品およびオプトエレクトロニクス半導体部品の製造方法 Download PDFInfo
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- JP6348660B2 JP6348660B2 JP2017519893A JP2017519893A JP6348660B2 JP 6348660 B2 JP6348660 B2 JP 6348660B2 JP 2017519893 A JP2017519893 A JP 2017519893A JP 2017519893 A JP2017519893 A JP 2017519893A JP 6348660 B2 JP6348660 B2 JP 6348660B2
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- 239000004065 semiconductor Substances 0.000 title claims description 148
- 230000005693 optoelectronics Effects 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 81
- 239000002184 metal Substances 0.000 claims description 81
- 239000000919 ceramic Substances 0.000 claims description 53
- 238000004382 potting Methods 0.000 claims description 51
- 238000004020 luminiscence type Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 15
- 239000011265 semifinished product Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000003698 laser cutting Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 63
- 239000011162 core material Substances 0.000 description 37
- 238000000926 separation method Methods 0.000 description 9
- 239000000969 carrier Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Description
− 金属の半製品を作製し、この半製品を、金属コアが形成されるように、エッチング、押し抜き、ソーイング、切断、および/またはレーザ処理によってキャリアアセンブリに成形するステップと、
− キャリアアセンブリの金属コアの表面にセラミック層を形成するステップと、
− 電気的コンタクトパッドも形成されるように、セラミック層の表面に金属層を形成して構造化するステップと、
− 半導体チップを取り付けて電気的に接触させるステップと、
− 少なくとも1つのポッティング体を形成するステップと、
− キャリアアセンブリを分離して、キャリアおよびオプトエレクトロニクス半導体部品を形成するステップと、
を、好ましくは示した順に含む。
10 実装面
2 キャリア
20 キャリアアセンブリ
21 キャリア部分
22 キャリアの端面
23 キャリア上面
24 キャリア下面
25 金属コア
26 セラミック層
27 金属層
28 スルーホール
3 発光半導体チップ
4 電気的コンタクトパッド
5 ポッティング体
6 ルミネセンスプレート
7 接続面
8 ボンディングワイヤ
9 ESD保護ダイオード
L キャリアの縦軸線
S 分離線
Claims (14)
- オプトエレクトロニクス半導体部品(1)であって、
− キャリア上面(23)と、前記キャリア上面(23)の反対側に位置するキャリア下面(24)とを有するキャリア(2)と、
− 前記キャリア上面(23)に取り付けられているいくつかの発光半導体チップ(3)と、
− 前記半導体部品(1)を外部に電気的に接触させるための、前記キャリア下面(24)における少なくとも2つの電気コンタクトパッド(4)と、
を備えており、
− 前記キャリア(2)が金属コア(25)を有し、前記金属コア(25)が、前記キャリア(2)の厚さの少なくとも60%を占めており、かつ前記キャリア(2)の機械的剛性に少なくとも70%寄与し、
− 前記金属コア(25)が、少なくとも部分的にセラミック層(26)によって直接被覆されており、前記セラミック層(26)の厚さが最大で100μmであり、
− 前記セラミック層(26)が、互いに電気的に絶縁された第1、第2および第3の金属層(27)によって部分的に直接被覆されており、
− 前記半導体チップ(3)が前記第1の金属層(27)を介して前記コンタクトパッド(4)に電気的に接続されており、
− 前記キャリア(2)がいくつかのキャリア部分(21)から形成されており、
− 各キャリア部分(21)の前記セラミック層(26)が、関連する前記金属コア(25)の周囲の、密着性の閉じた単一の層を形成しており、
− 前記キャリア上面(23)それぞれが、関連する前記キャリア下面(24)より大きい面積を有し、
− すべてのキャリア下面(24)が少なくとも1つのポッティング体(5)の下面と同一平面内にあるように、前記キャリア部分(21)が前記ポッティング体(5)を介して互いに機械的にしっかりと結合されており、前記ポッティング体(5)が、前記キャリア部分(21)と合わせて、前記半導体部品(1)の機械的支持要素であり、
前記半導体チップ(3)が電気的に直列に接続されており、
前記半導体チップ(3)が配置されている前記キャリア上面(23)における前記第2の金属層(27)が構造化されて導体トラックおよび電気接続面(7)が形成されており、
前記半導体チップ(3)が取り付けられる前記キャリア部分(21)のキャリア下面(24)に電位が存在しないように、かつ、前記キャリア下面(24)が前記第3の金属層(27)で完全に覆われるように、前記キャリア上面(23)における前記電気接続面(7)が、関連する前記キャリア下面(24)から電気的に絶縁されている、
オプトエレクトロニクス半導体部品(1)。 - 前記キャリア(2)が、互いに距離をおいて隔置されている正確に3つの個別のキャリア部分(21)から形成されており、
前記キャリア部分(21)が共通平面内に配置されておりかつ互いに距離をおいて隔置されており、前記半導体チップ(3)が、前記キャリア部分(21)のうちの最も大きい中央のキャリア部分(21)に配置されており、前記コンタクトパッド(4)が、より小さい外側の2つのキャリア部分(21)に配置されている、
請求項1に記載のオプトエレクトロニクス半導体部品(1)。 - すべてのキャリア部分(21)の前記キャリア上面(23)および前記キャリア下面(24)が、平坦に形成されておりかつ共通平面内に位置しており、すべてのキャリア部分(21)の前記金属コア(25)が、同じ金属薄板の半製品から、押し抜き、エッチング、および/またはソーイングによって形成されている、
請求項2に記載のオプトエレクトロニクス半導体部品(1)。 - 前記半導体チップ(3)が取り付けられている前記キャリア部分(21)に前記コンタクトパッド(4)が存在せず、
前記キャリア上面(23)における、隣り合うキャリア部分(21)の間の距離それぞれが、関連する前記キャリア下面(24)におけるよりも小さい、
請求項2または請求項3のいずれかに記載のオプトエレクトロニクス半導体部品(1)。 - 前記半導体部品(1)が、前記キャリア下面(24)を備えている平坦な実装面(10)を有する、
請求項1から請求項4のいずれかに記載のオプトエレクトロニクス半導体部品(1)。 - 前記半導体部品(1)が、光不透過性の第1のポッティング体(5a)および半透明の第2のポッティング体(5b)を備えており、
前記第1のポッティング体(5a)が、その上面および下面が前記キャリア上面(23)およびキャリア下面(24)と同一平面内にあり、これに加えて、その側面が前記キャリア(2)の端面(22)と同一平面内にあり、各場合における公差が最大で25μmである、
請求項5に記載のオプトエレクトロニクス半導体部品(1)。 - 少なくとも3個の前記半導体チップ(3)から形成されている、
請求項1から請求項6のいずれかに記載のオプトエレクトロニクス半導体部品(1)。 - 前記半導体チップ(3)それぞれが、向かい合う2つの主面において電気的に接触しており、かつ、正確に1つの前記電気接続面(7)に電気的に直接接触しており、かつ、対応する前記接続面(7)に機械的に取り付けられている、
請求項1から請求項7のいずれかに記載のオプトエレクトロニクス半導体部品(1)。 - 前記半導体部品(1)が、個別に作製されるいくつかのルミネセンスプレート(6)を備えており、前記ルミネセンスプレートそれぞれが、正確に1つの前記半導体チップ(3)に関連付けられており、かつ、関連する前記半導体チップ(3)の光の一部分を、より長い波長の光に変換するように構成されている、
請求項1から請求項8のいずれかに記載のオプトエレクトロニクス半導体部品(1)。 - 前記ルミネセンスプレート(6)が、前記キャリア(2)から離れる方向において、その上面が前記ポッティング体(5)の上面と同一平面内にあり、
前記ルミネセンスプレート(6)の平均厚さが、25μmから250μmの範囲内(両端値を含む)であり、関連する前記半導体チップ(3)からの前記ルミネセンスプレート(6)の平均距離が、最大で10μmである、
請求項9に記載のオプトエレクトロニクス半導体部品(1)。 - 前記キャリア部分(21)それぞれが、断面において見たとき、前記キャリア上面(23)から離れる方向に最初は一定の幅を有し、そこから前記キャリア部分(21)の幅が前記キャリア下面(24)までしだいに狭まっている、
請求項1から請求項10のいずれかに記載のオプトエレクトロニクス半導体部品(1)。 - 前記金属コア(25)が前記セラミック層(26)によって完全に被覆されており、前記セラミック層(26)が少なくとも2μm、最大で15μmの厚さを有し、前記セラミック層(26)が、最大で250μmの平均粒径を有するAlN粒子から作製されており、
前記金属コア(25)が、Al、Cu、Al合金、またはCu合金からなり、前記金属層(27)が、Al、Ag、Au、Cu、Ni、Pd、および/またはPtを含む、またはそのような材料からなる、
請求項1から請求項11のいずれかに記載のオプトエレクトロニクス半導体部品(1)。 - 請求項1から請求項12のいずれかに記載のオプトエレクトロニクス半導体部品(1)を製造する方法であって、
− 金属の半製品を作製し、前記半製品を、前記金属コア(25)が形成されるように、エッチング、押し抜き、ソーイング、および/またはレーザ切断によって、キャリアアセンブリ(20)に成形するステップと、
− 前記キャリアアセンブリ(20)の前記金属コア(25)の表面にセラミック層(26)を形成するステップと、
− 前記電気的コンタクトパッド(4)も形成されるように、前記セラミック層の表面に前記金属層(27)を形成して構造化するステップと、
− 前記半導体チップ(3)を取り付けて電気的接触を形成するステップと、
− 少なくとも1つのポッティング体(5)を形成するステップと、
− 前記キャリアアセンブリ(20)を分離して、前記キャリアおよび前記オプトエレクトロニクス半導体部品(1)を形成するステップと、
を含む、方法。 - 前記方法ステップが、指定された順序で実行され、
前記半製品を前記キャリアアセンブリ(20)に成形するステップにおいて、前記半製品の向かい合う2つの主面のエッチングが行われる、
請求項13に記載の方法。
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DE102014116529.2 | 2014-11-12 | ||
PCT/EP2015/074743 WO2016074914A1 (de) | 2014-11-12 | 2015-10-26 | Optoelektronisches halbleiterbauteil und verfahren zur herstellung eines optoelektronischen halbleiterbauteils |
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DE102017117165B4 (de) | 2017-07-28 | 2023-04-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils |
DE102018111319A1 (de) * | 2018-05-11 | 2019-11-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
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EP4125126A1 (en) * | 2021-07-28 | 2023-02-01 | Excellence Opto. Inc. | Led package with multiple test pads and parallel circuit elements |
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JP2006100316A (ja) * | 2004-09-28 | 2006-04-13 | Sumitomo Metal Electronics Devices Inc | 発光素子収納用パッケージ |
JP2006245032A (ja) * | 2005-02-28 | 2006-09-14 | Toyoda Gosei Co Ltd | 発光装置およびledランプ |
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US7993979B2 (en) * | 2007-12-26 | 2011-08-09 | Stats Chippac Ltd. | Leadless package system having external contacts |
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MY155671A (en) * | 2010-01-29 | 2015-11-13 | Toshiba Kk | LED package and method for manufacturing same |
DE102010024864B4 (de) * | 2010-06-24 | 2021-01-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil |
DE102010045783A1 (de) * | 2010-09-17 | 2012-03-22 | Osram Opto Semiconductors Gmbh | Trägersubstrat für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
US9551082B2 (en) | 2011-02-08 | 2017-01-24 | Cambridge Nanotherm Limited | Insulated metal substrate |
DE102011050450A1 (de) | 2011-05-18 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
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