JP6344914B2 - フレキシブル銅張積層板及びフレキシブル回路基板 - Google Patents
フレキシブル銅張積層板及びフレキシブル回路基板 Download PDFInfo
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- JP6344914B2 JP6344914B2 JP2013273161A JP2013273161A JP6344914B2 JP 6344914 B2 JP6344914 B2 JP 6344914B2 JP 2013273161 A JP2013273161 A JP 2013273161A JP 2013273161 A JP2013273161 A JP 2013273161A JP 6344914 B2 JP6344914 B2 JP 6344914B2
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- copper foil
- copper
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- clad laminate
- flexible
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
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| JP2013273161A JP6344914B2 (ja) | 2013-12-27 | 2013-12-27 | フレキシブル銅張積層板及びフレキシブル回路基板 |
| CN201410724669.5A CN104754864B (zh) | 2013-12-27 | 2014-12-02 | 挠性覆铜积层板及挠性电路基板 |
| KR1020140170265A KR102288004B1 (ko) | 2013-12-27 | 2014-12-02 | 플렉시블 구리 피복 적층판 및 플렉시블 회로 기판 |
| TW103143982A TWI633006B (zh) | 2013-12-27 | 2014-12-17 | 撓性覆銅積層板及撓性電路基板 |
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| KR (1) | KR102288004B1 (zh) |
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| TWI728102B (zh) * | 2016-04-26 | 2021-05-21 | 日商陶氏東麗股份有限公司 | 可撓性積層體及具備其之可撓性顯示器 |
| JP6440656B2 (ja) | 2016-07-12 | 2018-12-19 | 古河電気工業株式会社 | 電解銅箔 |
| WO2021120117A1 (zh) * | 2019-12-19 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | 双面混合铜箔基材板 |
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| JPH11268183A (ja) | 1998-03-19 | 1999-10-05 | Mitsui Chem Inc | ポリイミド−金属積層体およびその製造方法 |
| JP4781930B2 (ja) * | 2005-07-27 | 2011-09-28 | 新日鐵化学株式会社 | 高屈曲性フレキシブル銅張積層板の製造方法 |
| TWI394659B (zh) * | 2005-07-27 | 2013-05-01 | Nippon Steel Chemical Co | 高屈曲性可撓性覆銅積層板之製造方法 |
| JP2007208087A (ja) | 2006-02-03 | 2007-08-16 | Kaneka Corp | 高屈曲性フレキシブルプリント配線板 |
| JP4790582B2 (ja) * | 2006-12-12 | 2011-10-12 | 新日鐵化学株式会社 | 高屈曲性フレキシブル銅張積層板の製造方法 |
| JP5245813B2 (ja) * | 2008-12-25 | 2013-07-24 | 日立電線株式会社 | 圧延銅箔 |
| JP2010239095A (ja) * | 2009-03-31 | 2010-10-21 | Nippon Mining & Metals Co Ltd | プリント配線板用銅箔 |
| JP2010280191A (ja) | 2009-06-08 | 2010-12-16 | Hitachi Cable Ltd | 熱処理用銅箔、熱処理用銅箔の製造方法およびフレキシブルプリント配線板 |
| JP5689277B2 (ja) * | 2009-10-22 | 2015-03-25 | 新日鉄住金化学株式会社 | フレキシブル回路基板及び多層回路基板 |
| JP2011093229A (ja) * | 2009-10-30 | 2011-05-12 | Jx Nippon Mining & Metals Corp | 両面銅張積層板の製造方法、及びそれに用いる１組の銅又は銅合金箔 |
| JP5689284B2 (ja) * | 2009-11-11 | 2015-03-25 | 新日鉄住金化学株式会社 | フレキシブル両面銅張積層板の製造方法 |
| WO2012020677A1 (ja) * | 2010-08-09 | 2012-02-16 | 新日鐵化学株式会社 | 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話 |
| JP6069023B2 (ja) * | 2012-02-28 | 2017-01-25 | Ｊｘ金属株式会社 | 圧延銅箔 |
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| Publication number | Publication date |
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| JP2015127120A (ja) | 2015-07-09 |
| CN104754864A (zh) | 2015-07-01 |
| KR102288004B1 (ko) | 2021-08-09 |
| CN104754864B (zh) | 2018-07-24 |
| TW201524759A (zh) | 2015-07-01 |
| TWI633006B (zh) | 2018-08-21 |
| KR20150077300A (ko) | 2015-07-07 |
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