JP6328582B2 - めっき装置、および基板ホルダの電気接点の電気抵抗を決定する方法 - Google Patents

めっき装置、および基板ホルダの電気接点の電気抵抗を決定する方法 Download PDF

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JP6328582B2
JP6328582B2 JP2015063239A JP2015063239A JP6328582B2 JP 6328582 B2 JP6328582 B2 JP 6328582B2 JP 2015063239 A JP2015063239 A JP 2015063239A JP 2015063239 A JP2015063239 A JP 2015063239A JP 6328582 B2 JP6328582 B2 JP 6328582B2
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Prior art keywords
substrate
resistance
electrical contacts
electrical
substrate holder
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JP2015200017A5 (https=
JP2015200017A (ja
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吉夫 南
吉夫 南
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Ebara Corp
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Ebara Corp
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Priority to JP2015063239A priority Critical patent/JP6328582B2/ja
Priority to US14/670,647 priority patent/US9677189B2/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
JP2015063239A 2014-03-31 2015-03-25 めっき装置、および基板ホルダの電気接点の電気抵抗を決定する方法 Active JP6328582B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015063239A JP6328582B2 (ja) 2014-03-31 2015-03-25 めっき装置、および基板ホルダの電気接点の電気抵抗を決定する方法
US14/670,647 US9677189B2 (en) 2014-03-31 2015-03-27 Plating apparatus and method of determining electric resistance of electric contact of substrate holder

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014073289 2014-03-31
JP2014073289 2014-03-31
JP2015063239A JP6328582B2 (ja) 2014-03-31 2015-03-25 めっき装置、および基板ホルダの電気接点の電気抵抗を決定する方法

Publications (3)

Publication Number Publication Date
JP2015200017A JP2015200017A (ja) 2015-11-12
JP2015200017A5 JP2015200017A5 (https=) 2017-12-07
JP6328582B2 true JP6328582B2 (ja) 2018-05-23

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JP2015063239A Active JP6328582B2 (ja) 2014-03-31 2015-03-25 めっき装置、および基板ホルダの電気接点の電気抵抗を決定する方法

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US (1) US9677189B2 (https=)
JP (1) JP6328582B2 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015119029A1 (ja) * 2014-02-06 2015-08-13 株式会社 荏原製作所 基板ホルダ、めっき装置、およびめっき方法
CN108368626B (zh) * 2015-12-03 2020-05-12 东京毅力科创株式会社 半导体装置的制造装置以及制造方法
JP6695750B2 (ja) * 2016-07-04 2020-05-20 株式会社荏原製作所 基板ホルダの検査装置、これを備えためっき装置、及び外観検査装置
KR102522815B1 (ko) * 2016-09-08 2023-04-17 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더, 도금 장치, 기판 홀더의 제조 방법 및 기판을 유지하는 방법
WO2018066315A1 (ja) 2016-10-07 2018-04-12 東京エレクトロン株式会社 電解処理治具及び電解処理方法
KR102222776B1 (ko) 2017-01-24 2021-03-05 가부시키가이샤 에바라 세이사꾸쇼 도금 장치, 도금 방법, 기판 홀더, 저항 측정 모듈, 및 기판 홀더를 검사하는 방법
JP6872913B2 (ja) * 2017-01-24 2021-05-19 株式会社荏原製作所 めっき装置、基板ホルダ、抵抗測定モジュール、および基板ホルダを検査する方法
JP6952007B2 (ja) * 2017-06-28 2021-10-20 株式会社荏原製作所 基板ホルダ及びめっき装置
KR102557221B1 (ko) 2017-06-28 2023-07-20 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더 및 도금 장치
GB2564896B (en) 2017-07-27 2021-12-01 Semsysco Gmbh Substrate locking system for chemical and/or electrolytic surface treatment
JP6975650B2 (ja) 2018-01-18 2021-12-01 株式会社荏原製作所 検査用基板を用いる電流測定モジュールおよび検査用基板
JP7182911B2 (ja) * 2018-06-21 2022-12-05 株式会社荏原製作所 めっき装置、及びめっき方法
JP6971922B2 (ja) 2018-06-27 2021-11-24 株式会社荏原製作所 基板ホルダ
US12221713B2 (en) * 2018-07-30 2025-02-11 RENA Technologies GmbH Flow generator, deposition device and method for the deposition of a material
JP7626695B2 (ja) 2021-12-28 2025-02-04 株式会社荏原製作所 めっき装置およびめっき方法

Family Cites Families (16)

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US2802182A (en) * 1954-02-01 1957-08-06 Fox Prod Co Current density responsive apparatus
US4109196A (en) * 1976-12-03 1978-08-22 Honeywell Inc. Resistance measuring circuit
US4519401A (en) * 1983-09-20 1985-05-28 Case Western Reserve University Pressure telemetry implant
EP1048755A4 (en) * 1997-12-16 2006-05-31 Ebara Corp PLATING DEVICE AND METHOD FOR CONFIRMING THE POWER SUPPLY
JP4128230B2 (ja) 1998-07-10 2008-07-30 株式会社荏原製作所 メッキ装置
JP3285007B2 (ja) * 1999-05-07 2002-05-27 日本電気株式会社 めっき装置用検出器
JP2001152396A (ja) * 1999-11-25 2001-06-05 Hitachi Ltd 半導体製造装置及び半導体製造方法
EP1229154A4 (en) 2000-03-17 2006-12-13 Ebara Corp METHOD AND DEVICE FOR ELECTROPLATING
US6790763B2 (en) * 2000-12-04 2004-09-14 Ebara Corporation Substrate processing method
US6935922B2 (en) * 2002-02-04 2005-08-30 Kla-Tencor Technologies Corp. Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
JP2005146399A (ja) * 2003-11-19 2005-06-09 Ebara Corp めっき装置及び接点の接触状態検査方法
JP3715637B2 (ja) * 2004-03-11 2005-11-09 新光電気工業株式会社 めっき方法
JP5370886B2 (ja) * 2009-03-10 2013-12-18 関東化学株式会社 金微細構造体形成用無電解金めっき液およびこれを用いた金微細構造体形成方法ならびにこれを用いた金微細構造体
JP2013007692A (ja) * 2011-06-27 2013-01-10 Hioki Ee Corp 接地抵抗測定方法
US9518334B2 (en) * 2013-03-11 2016-12-13 Taiwan Semiconductor Manufacturing Company, Ltd. Electro-plating and apparatus for performing the same
US10260855B2 (en) * 2013-06-12 2019-04-16 Applied Materials, Inc. Electroplating tool with feedback of metal thickness distribution and correction

Also Published As

Publication number Publication date
US20150276835A1 (en) 2015-10-01
JP2015200017A (ja) 2015-11-12
US9677189B2 (en) 2017-06-13

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