JP6324860B2 - 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 - Google Patents

半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 Download PDF

Info

Publication number
JP6324860B2
JP6324860B2 JP2014196728A JP2014196728A JP6324860B2 JP 6324860 B2 JP6324860 B2 JP 6324860B2 JP 2014196728 A JP2014196728 A JP 2014196728A JP 2014196728 A JP2014196728 A JP 2014196728A JP 6324860 B2 JP6324860 B2 JP 6324860B2
Authority
JP
Japan
Prior art keywords
die
rail
pressing
mounting apparatus
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014196728A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016072280A (ja
JP2016072280A5 (enExample
Inventor
勇輝 名久井
勇輝 名久井
昌起 松山
昌起 松山
岡本　直樹
直樹 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fasford Technology Co Ltd
Original Assignee
Fasford Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fasford Technology Co Ltd filed Critical Fasford Technology Co Ltd
Priority to JP2014196728A priority Critical patent/JP6324860B2/ja
Publication of JP2016072280A publication Critical patent/JP2016072280A/ja
Publication of JP2016072280A5 publication Critical patent/JP2016072280A5/ja
Application granted granted Critical
Publication of JP6324860B2 publication Critical patent/JP6324860B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2014196728A 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 Active JP6324860B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014196728A JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014196728A JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Publications (3)

Publication Number Publication Date
JP2016072280A JP2016072280A (ja) 2016-05-09
JP2016072280A5 JP2016072280A5 (enExample) 2017-06-01
JP6324860B2 true JP6324860B2 (ja) 2018-05-16

Family

ID=55864907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014196728A Active JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Country Status (1)

Country Link
JP (1) JP6324860B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018129324A (ja) * 2017-02-06 2018-08-16 株式会社東芝 ピックアップ装置
WO2025182629A1 (ja) * 2024-02-29 2025-09-04 東京エレクトロン株式会社 接合装置、及び接合方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031672A (ja) * 2002-06-26 2004-01-29 Sharp Corp チップのピックアップ装置
JP2005033065A (ja) * 2003-07-08 2005-02-03 Shinkawa Ltd 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム
JP2007165351A (ja) * 2005-12-09 2007-06-28 Shibuya Kogyo Co Ltd ダイボンディング方法

Also Published As

Publication number Publication date
JP2016072280A (ja) 2016-05-09

Similar Documents

Publication Publication Date Title
KR102495699B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
KR101977987B1 (ko) 다이 본더 및 본딩 방법
KR101970401B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
CN110323146B (zh) 电子零件封装装置
JP6470054B2 (ja) ダイボンダおよびボンディング方法
CN110943008B (zh) 半导体制造装置、顶推夹具及半导体器件的制造方法
JP6941513B2 (ja) 半導体製造装置および半導体装置の製造方法
KR102003130B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
CN111106037B (zh) 电子零件的拾取装置以及安装装置
JP2019054209A (ja) 半導体製造装置、半導体装置の製造方法およびコレット
JP2015076410A (ja) ボンディング方法及びダイボンダ
JP2001351930A (ja) ダイ及び小物部品の移送装置
KR20190042419A (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
JP6324860B2 (ja) 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法
JP2022114399A (ja) ダイボンディング装置および半導体装置の製造方法
JP6367672B2 (ja) 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法
JP2010171088A (ja) 圧着装置及び圧着方法
JP4369298B2 (ja) ダイピックアップ装置及びダイピックアップ方法
JP6200735B2 (ja) ダイボンダ及びボンディング方法
CN111983829A (zh) 部件压接装置以及部件压接方法
CN118992450A (zh) 控制装置、面板搬运系统、控制方法以及程序
US20230290666A1 (en) Semiconductor manufacturing apparatus, carrier jig, and manufacturing method of semiconductor device
JP5953069B2 (ja) ダイボンダ
JP2007187707A (ja) 液晶表示パネルの製造方法、液晶表示パネルの製造装置、液晶表示パネル、電子機器
JP6093610B2 (ja) ダイボンダ及びボンディング方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170417

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170417

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180116

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180123

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180319

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180403

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180411

R150 Certificate of patent or registration of utility model

Ref document number: 6324860

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250