JP2016072280A5 - - Google Patents

Download PDF

Info

Publication number
JP2016072280A5
JP2016072280A5 JP2014196728A JP2014196728A JP2016072280A5 JP 2016072280 A5 JP2016072280 A5 JP 2016072280A5 JP 2014196728 A JP2014196728 A JP 2014196728A JP 2014196728 A JP2014196728 A JP 2014196728A JP 2016072280 A5 JP2016072280 A5 JP 2016072280A5
Authority
JP
Japan
Prior art keywords
rail
pressing
die
film
changing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014196728A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016072280A (ja
JP6324860B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014196728A priority Critical patent/JP6324860B2/ja
Priority claimed from JP2014196728A external-priority patent/JP6324860B2/ja
Publication of JP2016072280A publication Critical patent/JP2016072280A/ja
Publication of JP2016072280A5 publication Critical patent/JP2016072280A5/ja
Application granted granted Critical
Publication of JP6324860B2 publication Critical patent/JP6324860B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014196728A 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 Active JP6324860B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014196728A JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014196728A JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Publications (3)

Publication Number Publication Date
JP2016072280A JP2016072280A (ja) 2016-05-09
JP2016072280A5 true JP2016072280A5 (enExample) 2017-06-01
JP6324860B2 JP6324860B2 (ja) 2018-05-16

Family

ID=55864907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014196728A Active JP6324860B2 (ja) 2014-09-26 2014-09-26 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法

Country Status (1)

Country Link
JP (1) JP6324860B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018129324A (ja) * 2017-02-06 2018-08-16 株式会社東芝 ピックアップ装置
WO2025182629A1 (ja) * 2024-02-29 2025-09-04 東京エレクトロン株式会社 接合装置、及び接合方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031672A (ja) * 2002-06-26 2004-01-29 Sharp Corp チップのピックアップ装置
JP2005033065A (ja) * 2003-07-08 2005-02-03 Shinkawa Ltd 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム
JP2007165351A (ja) * 2005-12-09 2007-06-28 Shibuya Kogyo Co Ltd ダイボンディング方法

Similar Documents

Publication Publication Date Title
JP2016221643A5 (enExample)
DK3321168T3 (da) Indretning til indstilling af fartpositionen i et elektrisk drev på en båd
HUE042017T2 (hu) Eljárás, berendezés és rendszer elektromos függõleges dõlésszög beállításra egy több bemenetû, több kimenetû rendszerben
SG10202101208YA (en) Method and device for lithographically producing a target structure on a non-planar initial structure
EP3657916A4 (en) STRUCTURE INCLUDING ELECTRO-CONDUCTIVE REGIONS, ITS PRODUCTION PROCESS, LAMINATE, ITS PRODUCTION PROCESS AND COPPER WIRING
EP3500660A4 (en) FEEDBACK SYSTEM FOR CONTROLLING PARALLEL DROPLETS IN A DIGITAL MICROFLUIDIC DEVICE
EP3100830A3 (en) Robot, robot control apparatus, robot control method, and robot system
JP2015009525A5 (enExample)
EP3089865A4 (en) Methods and apparatus for positioning a structure on a polymer layer
EP2783815A3 (en) Robot system and method for producing to-be-processed material
JP2014237545A5 (enExample)
CA2852497C (en) Machine and method for cracking a connecting rod
PT3349963T (pt) Processo e dispositivo para a produção de um substrato 3d laminado com um material laminado
EP2759393A3 (en) Composites lay-up system with exchangeable lay-up heads
EP3246116A4 (en) Three-dimensional laminate moulding device, control method for three-dimensional laminate moulding device, and control program for three-dimensional laminate moulding device
PL3454995T3 (pl) Urządzenie do rozprowadzania lepiszcza na folii i instalacja do wytwarzania folii wielowarstwowej wyposażona we wspomniane urządzenie rozprowadzające
JP2017191457A5 (ja) 医用レポート作成装置、およびその制御方法、医用レポート作成システム、プログラム
FR3040336B1 (fr) Panneau de commande a led imprimee pour un vehicule et procede pour le realiser
EP3753201A4 (en) ELECTRONIC SUBSYSTEM HAVING MULTIPLE ELECTRICAL DEVICES IN ORDER OF PRIORITY TO PROVIDE ENERGY TO THE SUBSYSTEM
PT3875248T (pt) Método para produzir uma estrutura tridimensional numa superfície de um substrato plano
SG10201400613TA (en) Method and apparatus for spatially locating lens components on a lens precursor
WO2014195245A3 (de) Bearbeitungseinrichtung und bearbeitungsverfahren
JP2016072280A5 (enExample)
WO2016102454A3 (de) Verfahren und vorrichtung zur herstellung eines sandwichbauteils
GB2510650B (en) Method and apparatus for sound source separation based on a binary activation model