JP6318171B2 - レーザ微細加工によりイメージを形成する方法 - Google Patents

レーザ微細加工によりイメージを形成する方法 Download PDF

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JP6318171B2
JP6318171B2 JP2015549732A JP2015549732A JP6318171B2 JP 6318171 B2 JP6318171 B2 JP 6318171B2 JP 2015549732 A JP2015549732 A JP 2015549732A JP 2015549732 A JP2015549732 A JP 2015549732A JP 6318171 B2 JP6318171 B2 JP 6318171B2
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laser
laser pulse
concave surface
range
pulse beam
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JP2016505390A5 (enExample
JP2016505390A (ja
Inventor
ライヘンバッハ，ロバート
ハワートン，ジェフリー
松本　久
久 松本
シャン，ファン
ノエル，マイケル，シェーン
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/14—Titanium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
JP2015549732A 2012-12-20 2013-12-19 レーザ微細加工によりイメージを形成する方法 Active JP6318171B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261740430P 2012-12-20 2012-12-20
US61/740,430 2012-12-20
PCT/US2013/076677 WO2014100469A1 (en) 2012-12-20 2013-12-19 Methods of forming images by laser micromachining

Publications (3)

Publication Number Publication Date
JP2016505390A JP2016505390A (ja) 2016-02-25
JP2016505390A5 JP2016505390A5 (enExample) 2017-01-19
JP6318171B2 true JP6318171B2 (ja) 2018-04-25

Family

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Application Number Title Priority Date Filing Date
JP2015549732A Active JP6318171B2 (ja) 2012-12-20 2013-12-19 レーザ微細加工によりイメージを形成する方法

Country Status (6)

Country Link
US (1) US20140175067A1 (enExample)
JP (1) JP6318171B2 (enExample)
KR (1) KR20150097475A (enExample)
CN (1) CN104884205A (enExample)
TW (1) TWI604909B (enExample)
WO (1) WO2014100469A1 (enExample)

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EP3047932B1 (en) * 2015-01-21 2018-12-26 Agie Charmilles New Technologies SA Method of laser ablation for engraving of a surface with patch optimization, with corresponding software and machine tool
DE102015007216B4 (de) * 2015-06-03 2023-07-20 Asml Netherlands B.V. Verfahren zur Herstellung einer Halteplatte, insbesondere für einen Clamp zur Waferhalterung, Verfahren zur Herstellung einer Haltevorrichtung zur Halterung eines Bauteils, Halteplatte und Haltevorrichtung
GB201603991D0 (en) * 2016-03-08 2016-04-20 Univ Dundee Processing method and apparatus
CA3002318A1 (en) 2015-06-24 2016-12-29 University Of Dundee Method of, and apparatus for, reducing photoelectron yield and/or secondary electron yield
KR20220078733A (ko) * 2015-08-22 2022-06-10 도쿄엘렉트론가부시키가이샤 기판 배면 텍스처링
AT519177B1 (de) * 2016-10-06 2019-04-15 Trotec Laser Gmbh Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes mit
KR20190126780A (ko) * 2017-02-09 2019-11-12 유에스 신써틱 코포레이션 에너지 가공된 다결정 다이아몬드 컴팩트들 및 이에 관련된 방법
DE102017202269A1 (de) * 2017-02-13 2018-08-16 Sauer Gmbh Verfahren zur bearbeitung einer werkstückoberfläche mittels eines lasers
JP6722617B2 (ja) * 2017-05-12 2020-07-15 三菱電線工業株式会社 金属表面の粗面化方法
KR102630873B1 (ko) * 2019-05-03 2024-01-31 삼성디스플레이 주식회사 윈도우의 제조 방법
JP2021122635A (ja) * 2020-02-07 2021-08-30 国際化工株式会社 レーザーマーキング樹脂成形品
KR102254339B1 (ko) 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
EP4046817B1 (fr) * 2021-02-23 2024-01-03 DM Surfaces SA Procede de traitement laser d'un composant horloger visant a en noircir au moins une portion
US11784130B2 (en) * 2021-08-27 2023-10-10 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and formation method of package with underfill
CN115819121B (zh) * 2022-12-15 2023-11-07 潮州三环（集团）股份有限公司 一种氧化锆陶瓷表面哑光处理方法、氧化锆陶瓷盖板

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Also Published As

Publication number Publication date
WO2014100469A8 (en) 2014-12-31
US20140175067A1 (en) 2014-06-26
WO2014100469A1 (en) 2014-06-26
TWI604909B (zh) 2017-11-11
JP2016505390A (ja) 2016-02-25
CN104884205A (zh) 2015-09-02
TW201433396A (zh) 2014-09-01
KR20150097475A (ko) 2015-08-26

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