KR20150097475A - 레이저 미세기계가공에 의한 이미지 형성 방법 - Google Patents

레이저 미세기계가공에 의한 이미지 형성 방법 Download PDF

Info

Publication number
KR20150097475A
KR20150097475A KR1020157013490A KR20157013490A KR20150097475A KR 20150097475 A KR20150097475 A KR 20150097475A KR 1020157013490 A KR1020157013490 A KR 1020157013490A KR 20157013490 A KR20157013490 A KR 20157013490A KR 20150097475 A KR20150097475 A KR 20150097475A
Authority
KR
South Korea
Prior art keywords
laser
parameter values
concave
range
processing parameters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020157013490A
Other languages
English (en)
Korean (ko)
Inventor
로베르트 레이첸바크
제프리 하워튼
히사쉬 마츠모토
팡 샨
마이클 셰인 노엘
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20150097475A publication Critical patent/KR20150097475A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B23K26/0066—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B23K26/0018—
    • B23K26/0075—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B23K26/365—
    • B23K26/367—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/401—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/14—Titanium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
KR1020157013490A 2012-12-20 2013-12-19 레이저 미세기계가공에 의한 이미지 형성 방법 Withdrawn KR20150097475A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261740430P 2012-12-20 2012-12-20
US61/740,430 2012-12-20
PCT/US2013/076677 WO2014100469A1 (en) 2012-12-20 2013-12-19 Methods of forming images by laser micromachining

Publications (1)

Publication Number Publication Date
KR20150097475A true KR20150097475A (ko) 2015-08-26

Family

ID=50973462

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157013490A Withdrawn KR20150097475A (ko) 2012-12-20 2013-12-19 레이저 미세기계가공에 의한 이미지 형성 방법

Country Status (6)

Country Link
US (1) US20140175067A1 (enExample)
JP (1) JP6318171B2 (enExample)
KR (1) KR20150097475A (enExample)
CN (1) CN104884205A (enExample)
TW (1) TWI604909B (enExample)
WO (1) WO2014100469A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102254339B1 (ko) * 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117224A1 (ja) * 2015-01-20 2016-07-28 東レエンジニアリング株式会社 マーキング装置および方法、パターン生成装置、並びに被加工物
EP3047932B1 (en) * 2015-01-21 2018-12-26 Agie Charmilles New Technologies SA Method of laser ablation for engraving of a surface with patch optimization, with corresponding software and machine tool
DE102015007216B4 (de) * 2015-06-03 2023-07-20 Asml Netherlands B.V. Verfahren zur Herstellung einer Halteplatte, insbesondere für einen Clamp zur Waferhalterung, Verfahren zur Herstellung einer Haltevorrichtung zur Halterung eines Bauteils, Halteplatte und Haltevorrichtung
GB201603991D0 (en) * 2016-03-08 2016-04-20 Univ Dundee Processing method and apparatus
CA3002318A1 (en) * 2015-06-24 2016-12-29 University Of Dundee Method of, and apparatus for, reducing photoelectron yield and/or secondary electron yield
WO2017034533A1 (en) * 2015-08-22 2017-03-02 Tokyo Electron Limited Substrate backside texturing
AT519177B1 (de) * 2016-10-06 2019-04-15 Trotec Laser Gmbh Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes mit
KR102437366B1 (ko) * 2017-02-09 2022-08-29 유에스 신써틱 코포레이션 에너지 가공된 다결정 다이아몬드 컴팩트들 및 이에 관련된 방법
DE102017202269A1 (de) * 2017-02-13 2018-08-16 Sauer Gmbh Verfahren zur bearbeitung einer werkstückoberfläche mittels eines lasers
JP6722617B2 (ja) * 2017-05-12 2020-07-15 三菱電線工業株式会社 金属表面の粗面化方法
KR102630873B1 (ko) * 2019-05-03 2024-01-31 삼성디스플레이 주식회사 윈도우의 제조 방법
JP2021122635A (ja) * 2020-02-07 2021-08-30 国際化工株式会社 レーザーマーキング樹脂成形品
EP4046817B1 (fr) * 2021-02-23 2024-01-03 DM Surfaces SA Procede de traitement laser d'un composant horloger visant a en noircir au moins une portion
US11784130B2 (en) * 2021-08-27 2023-10-10 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and formation method of package with underfill
CN115819121B (zh) * 2022-12-15 2023-11-07 潮州三环（集团）股份有限公司 一种氧化锆陶瓷表面哑光处理方法、氧化锆陶瓷盖板

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
FI92112C (fi) * 1992-11-09 1994-09-26 Partek Cargotec Oy Menetelmä taustastaan tummempina erottuvien alueiden muodostamiseksi kirkkaaseen metallipintaan ja tällä tavoin värjättyjä alueita käsittävä metallipinta
US5461212A (en) * 1993-06-04 1995-10-24 Summit Technology, Inc. Astigmatic laser ablation of surfaces
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
EP0996549B1 (en) * 1997-07-16 2003-04-09 Otis Elevator Company Method and compositions for laser imprinting, and articles imprinted using such methods and compositions
JPH11207477A (ja) * 1998-01-26 1999-08-03 Mitsubishi Electric Corp きさげ加工装置およびきさげ加工方法
JP4465065B2 (ja) * 1998-10-30 2010-05-19 シャープ株式会社 配線の断線修復方法
DE60124938T2 (de) * 2000-10-26 2007-09-20 Xsil Technology Ltd. Steueurung von laserbearbeitung
US6864459B2 (en) * 2001-02-08 2005-03-08 The Regents Of The University Of California High precision, rapid laser hole drilling
US7357486B2 (en) * 2001-12-20 2008-04-15 Hewlett-Packard Development Company, L.P. Method of laser machining a fluid slot
US20050087522A1 (en) * 2003-10-24 2005-04-28 Yunlong Sun Laser processing of a locally heated target material
US7486705B2 (en) * 2004-03-31 2009-02-03 Imra America, Inc. Femtosecond laser processing system with process parameters, controls and feedback
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20070235902A1 (en) * 2006-03-31 2007-10-11 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
JP4910100B2 (ja) * 2006-07-06 2012-04-04 日本ケミコン株式会社 電子部品の金属ケース
US10876193B2 (en) * 2006-09-29 2020-12-29 University Of Rochester Nanostructured materials, methods, and applications
GB2444037A (en) * 2006-11-27 2008-05-28 Xsil Technology Ltd Laser Machining
US8710402B2 (en) * 2007-06-01 2014-04-29 Electro Scientific Industries, Inc. Method of and apparatus for laser drilling holes with improved taper
KR101235617B1 (ko) * 2007-10-16 2013-02-28 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 ｕ자 형상 홈 가공 방법 및 이것을 사용한 제거 가공 방법 및 도려내기 가공 방법 및 모따기 방법
GB0804955D0 (en) * 2008-03-18 2008-04-16 Rumsby Philip T Method and apparatus for laser processing the surface of a drum
JP5454080B2 (ja) * 2008-10-23 2014-03-26 住友電気工業株式会社 レーザ加工方法およびレーザ加工装置
JP4612733B2 (ja) * 2008-12-24 2011-01-12 東芝機械株式会社 パルスレーザ加工装置
JP5473414B2 (ja) * 2009-06-10 2014-04-16 株式会社ディスコ レーザ加工装置
US8389895B2 (en) * 2010-06-25 2013-03-05 Electro Scientifix Industries, Inc. Method and apparatus for reliably laser marking articles
JP2012183549A (ja) * 2011-03-04 2012-09-27 Mitsubishi Electric Corp ＳｉＣ半導体ウェハのマーキング方法およびＳｉＣ半導体ウェハ
EP2692474B1 (en) * 2011-03-30 2018-04-04 NGK Insulators, Ltd. Method for marking metal member

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102254339B1 (ko) * 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
WO2022169032A1 (ko) * 2021-02-03 2022-08-11 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
US12109650B2 (en) 2021-02-03 2024-10-08 21Th Century Co., Ltd Planing-polishing apparatus and method using femtosecond pulsed laser

Also Published As

Publication number Publication date
WO2014100469A1 (en) 2014-06-26
US20140175067A1 (en) 2014-06-26
CN104884205A (zh) 2015-09-02
TW201433396A (zh) 2014-09-01
JP6318171B2 (ja) 2018-04-25
TWI604909B (zh) 2017-11-11
JP2016505390A (ja) 2016-02-25
WO2014100469A8 (en) 2014-12-31

Similar Documents

Publication Publication Date Title
KR20150097475A (ko) 레이저 미세기계가공에 의한 이미지 형성 방법
Knowles et al. Micro-machining of metals, ceramics and polymers using nanosecond lasers
US10112263B2 (en) Method and apparatus for reliably laser marking articles
US7469831B2 (en) Laser-based method and system for processing targeted surface material and article produced thereby
CN103889642B (zh) 在压花钢辊上产生具有结构的表面的方法和设备
CN103831534B (zh) 采用期望的色彩对金属表面激光标记的方法
CA3002315A1 (en) Method of, and apparatus for, laser blackening of a surface, wherein the laser has a specific power density and/or a specific pulse duration
US20150158116A1 (en) Method and apparatus for internally marking a substrate having a rough surface
EP2704872B1 (en) Laser-based marking method and apparatus
GB2569798A (en) Improvements in or relating to laser based machining
Wlodarczyk et al. Investigation of an interlaced laser beam scanning method for ultrashort pulse laser micromachining applications
Karnakis et al. Microhole drilling using reshaped pulsed Gaussian laser beams
EP4003636B1 (en) Method for the removal of a coating from a metal substrate by laser ablation
JP2011036865A (ja) 有底孔の形成方法
TW201446378A (zh) 使用散光加長型光束點以及使用超短脈波及／或較長波長的雷射處理方法
JP5305928B2 (ja) 周期構造の作成方法
JP2005034865A (ja) ロール加工装置および加工方法
KR101425190B1 (ko) 레이저 어블레이션을 이용한 금형 표면 마이크로 구조물 형성방법
JP2024538599A (ja) 基板の切断又は分割のための基板の下処理
Zubauskas et al. Classical top-down fused silica milling with a femtosecond laser using different laser pulse burst regimes
JP7606188B2 (ja) 生地の表面加工方法
DE102023201553A1 (de) Verfahren und System zur Herstellung mikroelektronischer Komponenten mit Schichtaufbau
JP2004188437A (ja) 微細傾斜面の加工方法
Bovatsek et al. High-power, nanosecond-pulse Q-switch laser technology with flattop beam-shaping technique for efficient industrial laser processing
Alesenkov Micromachining of nontransparent materials inair and water with femtosecond laser pulses

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20150521

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid