JP6307766B2 - タッチセンサの製造方法およびタッチセンサ - Google Patents

タッチセンサの製造方法およびタッチセンサ Download PDF

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Publication number
JP6307766B2
JP6307766B2 JP2014032024A JP2014032024A JP6307766B2 JP 6307766 B2 JP6307766 B2 JP 6307766B2 JP 2014032024 A JP2014032024 A JP 2014032024A JP 2014032024 A JP2014032024 A JP 2014032024A JP 6307766 B2 JP6307766 B2 JP 6307766B2
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protective layer
sensor electrode
layer
conductive
conductive layer
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JP2015158722A (ja
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山崎　広太
広太 山崎
本松　良文
良文 本松
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Sekisui Polymatech Co Ltd
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Sekisui Polymatech Co Ltd
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Priority to CN201510073544.5A priority patent/CN104866132B/zh
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JP2014032024A 2014-02-21 2014-02-21 タッチセンサの製造方法およびタッチセンサ Active JP6307766B2 (ja)

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JP2014032024A JP6307766B2 (ja) 2014-02-21 2014-02-21 タッチセンサの製造方法およびタッチセンサ
CN201510073544.5A CN104866132B (zh) 2014-02-21 2015-02-11 触摸传感器的制造方法及触摸传感器

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JP2014032024A JP6307766B2 (ja) 2014-02-21 2014-02-21 タッチセンサの製造方法およびタッチセンサ

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JP2015158722A JP2015158722A (ja) 2015-09-03
JP6307766B2 true JP6307766B2 (ja) 2018-04-11

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105138176A (zh) * 2015-09-09 2015-12-09 广西和金光电有限公司 触摸屏加工方法
CN106125972A (zh) * 2016-06-12 2016-11-16 京东方科技集团股份有限公司 保护层的制作方法、阵列基板及其制作方法和触摸屏
DE102017113376A1 (de) * 2016-07-08 2018-01-11 Weidmüller Interface GmbH & Co. KG Überwachungsaufsatz zur Überwachung einer Mutter einer Schraubverbindung und Verfahren zur Herstellung des Überwachungsaufsatzes
KR102249961B1 (ko) 2017-08-08 2021-05-11 알프스 알파인 가부시키가이샤 입력 장치의 제조 방법 및 입력 장치

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US7477242B2 (en) * 2002-05-20 2009-01-13 3M Innovative Properties Company Capacitive touch screen with conductive polymer
JP2005209691A (ja) * 2004-01-20 2005-08-04 Sony Corp 透明電極パターニング方法及び液晶表示装置の製造方法
JP4332174B2 (ja) * 2006-12-01 2009-09-16 アルプス電気株式会社 入力装置及びその製造方法
CN100446222C (zh) * 2007-03-28 2008-12-24 友达光电股份有限公司 薄膜晶体管基板的制造方法
US8173487B2 (en) * 2007-04-06 2012-05-08 Sharp Kabushiki Kaisha Semiconductor element, method for manufacturing same, and electronic device including same
CN101320309A (zh) * 2007-06-06 2008-12-10 介面光电股份有限公司 单层触控感测结构以及使用该结构的触控显示面板
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JPWO2011013279A1 (ja) * 2009-07-31 2013-01-07 シャープ株式会社 電極基板、電極基板の製造方法、および画像表示装置
JP5306256B2 (ja) * 2010-02-18 2013-10-02 株式会社ジャパンディスプレイウェスト 電気的固体装置基板の製造方法および電気的固体装置
US8405199B2 (en) * 2010-07-08 2013-03-26 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive pillar for semiconductor substrate and method of manufacture
CN101893976B (zh) * 2010-07-08 2012-07-25 汕头超声显示器（二厂）有限公司 投射式电容触摸屏的制造方法
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JP5308421B2 (ja) * 2010-10-06 2013-10-09 ビジョン開発株式会社 基板製造方法及び基板を用いた静電容量式タッチパネル
KR101230191B1 (ko) * 2010-12-14 2013-02-06 삼성디스플레이 주식회사 터치 스크린 패널 및 그 제조방법
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KR101821694B1 (ko) * 2011-04-25 2018-01-25 삼성디스플레이 주식회사 표시장치
CN102799295A (zh) * 2011-05-26 2012-11-28 胜华科技股份有限公司 触控装置及触控显示装置
CN102437194A (zh) * 2011-11-22 2012-05-02 上海中科高等研究院 金属氧化物薄膜晶体管及其制备方法
KR101932662B1 (ko) * 2012-03-16 2018-12-26 삼성전자 주식회사 이미지 센서
CN104205250A (zh) * 2012-03-30 2014-12-10 阿尔卑斯电气株式会社 导电图案形成基板的制造方法
JP2013222590A (ja) * 2012-04-16 2013-10-28 Shin Etsu Polymer Co Ltd 導電パターン形成基板及びその製造方法
CN103425349B (zh) * 2013-08-12 2016-09-21 南昌欧菲光科技有限公司 透明导电体及制备方法

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Publication number Publication date
JP2015158722A (ja) 2015-09-03
CN104866132B (zh) 2020-02-28
CN104866132A (zh) 2015-08-26

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