JP6306296B2 - 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 - Google Patents

感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 Download PDF

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Publication number
JP6306296B2
JP6306296B2 JP2013144034A JP2013144034A JP6306296B2 JP 6306296 B2 JP6306296 B2 JP 6306296B2 JP 2013144034 A JP2013144034 A JP 2013144034A JP 2013144034 A JP2013144034 A JP 2013144034A JP 6306296 B2 JP6306296 B2 JP 6306296B2
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Japan
Prior art keywords
bis
resin composition
dianhydride
resin
thermosetting resin
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JP2013144034A
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English (en)
Japanese (ja)
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JP2015018049A (ja
JP2015018049A5 (zh
Inventor
宮部　英和
英和 宮部
亮 林
亮 林
横山　裕
裕 横山
直之 小池
直之 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Ink Manufacturing Co Ltd
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Taiyo Ink Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Manufacturing Co Ltd filed Critical Taiyo Ink Manufacturing Co Ltd
Priority to JP2013144034A priority Critical patent/JP6306296B2/ja
Priority to KR1020167003054A priority patent/KR102372561B1/ko
Priority to PCT/JP2014/066078 priority patent/WO2015005077A1/ja
Priority to CN201480039321.0A priority patent/CN105378564B/zh
Priority to TW103122978A priority patent/TWI637665B/zh
Publication of JP2015018049A publication Critical patent/JP2015018049A/ja
Publication of JP2015018049A5 publication Critical patent/JP2015018049A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Optics & Photonics (AREA)
JP2013144034A 2013-07-09 2013-07-09 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 Active JP6306296B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013144034A JP6306296B2 (ja) 2013-07-09 2013-07-09 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
KR1020167003054A KR102372561B1 (ko) 2013-07-09 2014-06-17 감광성 열경화성 수지 조성물 및 플렉시블 프린트 배선판
PCT/JP2014/066078 WO2015005077A1 (ja) 2013-07-09 2014-06-17 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
CN201480039321.0A CN105378564B (zh) 2013-07-09 2014-06-17 感光性热固性树脂组合物和柔性印刷电路板
TW103122978A TWI637665B (zh) 2013-07-09 2014-07-03 Photosensitive thermosetting resin composition and flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013144034A JP6306296B2 (ja) 2013-07-09 2013-07-09 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018041156A Division JP6547025B2 (ja) 2018-03-07 2018-03-07 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板

Publications (3)

Publication Number Publication Date
JP2015018049A JP2015018049A (ja) 2015-01-29
JP2015018049A5 JP2015018049A5 (zh) 2016-07-28
JP6306296B2 true JP6306296B2 (ja) 2018-04-04

Family

ID=52279763

Family Applications (1)

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JP2013144034A Active JP6306296B2 (ja) 2013-07-09 2013-07-09 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板

Country Status (5)

Country Link
JP (1) JP6306296B2 (zh)
KR (1) KR102372561B1 (zh)
CN (1) CN105378564B (zh)
TW (1) TWI637665B (zh)
WO (1) WO2015005077A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6363861B2 (ja) * 2014-03-31 2018-07-25 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化被膜を有するプリント配線板
TWI652281B (zh) * 2015-02-18 2019-03-01 日商住友電木股份有限公司 含有光產鹼劑的光可成像聚烯烴組成物
KR102040224B1 (ko) * 2016-08-09 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
WO2018030761A1 (ko) * 2016-08-09 2018-02-15 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
WO2018043262A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 パターン形成方法、積層体の製造方法および電子デバイスの製造方法
KR102040225B1 (ko) * 2016-11-11 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
WO2018088754A1 (ko) * 2016-11-11 2018-05-17 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
KR102207604B1 (ko) * 2018-11-06 2021-01-26 (주)이녹스첨단소재 Fpic 필름 및 이의 제조방법
CN110239163B (zh) * 2019-06-13 2021-01-08 东莞市政潮电子科技有限公司 一种提高PI膜与Cu箔间粘结性能的柔性印刷电路板基材

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62263692A (ja) 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板
JPS63110224A (ja) 1986-10-27 1988-05-14 Dainippon Printing Co Ltd フレキシブルオ−バ−レイフイルム
TW436491B (en) * 1997-08-22 2001-05-28 Ciba Sc Holding Ag Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions
JP4191956B2 (ja) * 2002-05-24 2008-12-03 サンノプコ株式会社 感光性樹脂組成物
TWI398724B (zh) * 2005-03-15 2013-06-11 Toray Industries 感光性樹脂組成物
US7977028B2 (en) * 2005-06-30 2011-07-12 Toray Industries, Inc. Photosensitive resin composition and adhesion promoter
KR20090038390A (ko) * 2006-07-11 2009-04-20 니폰 가야꾸 가부시끼가이샤 감광성 알칼리 수용액 가용형 폴리이미드 수지 및 이를 함유하는 감광성 수지 조성물
JP5125747B2 (ja) * 2007-05-25 2013-01-23 東レ株式会社 感光性樹脂組成物
TW200908839A (en) * 2007-08-09 2009-02-16 Nichigo Morton Co Ltd Solder mask, photoresist pattern forming method and the light-emitting device thereof
JP2009258471A (ja) * 2008-04-18 2009-11-05 Toray Ind Inc 感光性樹脂組成物フィルムおよびそれを用いたレジスト形成方法
JP5402332B2 (ja) * 2009-07-09 2014-01-29 東レ株式会社 感光性樹脂組成物、感光性樹脂組成物フィルムおよびそれを用いた多層配線基板
JP5935323B2 (ja) * 2010-07-09 2016-06-15 東レ株式会社 感光性接着剤組成物、感光性接着剤フィルムおよびこれらを用いた半導体装置
JP5740915B2 (ja) * 2010-10-28 2015-07-01 東レ株式会社 フィルム積層体
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板

Also Published As

Publication number Publication date
JP2015018049A (ja) 2015-01-29
CN105378564A (zh) 2016-03-02
TWI637665B (zh) 2018-10-01
WO2015005077A1 (ja) 2015-01-15
TW201519708A (zh) 2015-05-16
CN105378564B (zh) 2020-02-07
KR102372561B1 (ko) 2022-03-10
KR20160029111A (ko) 2016-03-14

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