JP6301003B2 - 金属配線形成方法 - Google Patents
金属配線形成方法 Download PDFInfo
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- JP6301003B2 JP6301003B2 JP2017501030A JP2017501030A JP6301003B2 JP 6301003 B2 JP6301003 B2 JP 6301003B2 JP 2017501030 A JP2017501030 A JP 2017501030A JP 2017501030 A JP2017501030 A JP 2017501030A JP 6301003 B2 JP6301003 B2 JP 6301003B2
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- barrier layer
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- metal wiring
- metal
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- 229910052751 metal Inorganic materials 0.000 title claims description 72
- 239000002184 metal Substances 0.000 title claims description 72
- 238000000034 method Methods 0.000 title claims description 51
- 230000015572 biosynthetic process Effects 0.000 title description 7
- 230000004888 barrier function Effects 0.000 claims description 127
- 238000005530 etching Methods 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000005498 polishing Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- 239000012808 vapor phase Substances 0.000 claims description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 235000019441 ethanol Nutrition 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 238000001039 wet etching Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000012811 non-conductive material Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- -1 SiOC Inorganic materials 0.000 description 1
- 229910020177 SiOF Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
- H01L21/76865—Selective removal of parts of the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76814—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
Claims (17)
- 金属配線形成方法であって、
ハードマスク層と誘電体層とに、凹部を形成する凹部形成ステップと、
前記ハードマスク層及び前記凹部の側壁並びに底面に、バリヤ層を成膜するバリヤ層成膜ステップと、
前記バリヤ層に金属を堆積させ、前記金属で前記凹部を充填する金属堆積ステップと、
電解研磨により、前記凹部以外の箇所に堆積された前記金属を除去するステップであって、前記凹部に充填された前記金属は過剰に研磨されることにより皿形にくぼみ、前記電解研磨工程中に、前記バリヤ層に酸化膜が形成され、前記凹部の側壁に成膜された前記バリヤ層の前記酸化膜は、前記ハードマスク層に成膜された前記バリヤ層の前記酸化膜よりも厚い、金属除去ステップと、
前記ハードマスク層に成膜された前記バリヤ層の前記酸化膜を除去し、前記凹部の側壁に成膜された前記バリヤ層の酸化膜を一定の厚みに維持する、酸化膜除去ステップと、
前記バリヤ層と前記ハードマスク層とをエッチングにより除去するステップで、前記エッチングでは、前記酸化膜に対する選択比が大きく、残された前記酸化膜は、前記凹部の側壁に成膜された前記バリヤ層が過剰にエッチングされることを防ぐ、バリヤ層及びハードマスク層除去ステップと、を有することを特徴とする金属配線形成方法。 - 請求項1において、前記金属は銅であることを特徴とする金属配線形成方法。
- 請求項1において、前記バリヤ層はタンタル、窒化タンタル、チタン、窒化チタン、ルテニウム、又は コバルトから選択されることを特徴とする金属配線形成方法。
- 請求項1において、前記バリヤ層に形成された前記酸化膜の厚さは、前記凹部に充填された前記金属が過剰に研磨された量に比例することを特徴とする金属配線形成方法。
- 請求項4において、前記金属が過剰に研磨された量は、前記バリヤ層及び前記ハードマスク層を合わせた厚さ以上であることを特徴とする金属配線形成方法。
- 請求項4において、過剰に研磨された前記金属の量は300〜500オングストロームであることを特徴とする金属配線形成方法。
- 請求項1において、前記バリヤ層の前記酸化膜は、ウエットエッチングにより除去されることを特徴とする金属配線形成方法。
- 請求項7において、前記バリヤ層の前記酸化膜は、BHF溶液により除去されることを特徴とする金属配線形成方法。
- 請求項1において、前記バリヤ層の前記酸化膜は、ドライエッチングにより除去されることを特徴とする金属配線形成方法。
- 請求項9において、前記バリヤ層の前記酸化膜は、HF蒸気又はHF蒸気とエチルアルコール、メチルアルコール若しくはイソプロピルアルコールの何れか1種類との混合物により除去されることを特徴とする金属配線形成方法。
- 請求項1において、残された前記酸化膜は、前記バリヤ層に切れ目なく形成されることを特徴とする金属配線形成方法。
- 請求項11において、残された前記酸化膜は、5オングストロームより厚いことを特徴とする金属配線形成方法。
- 請求項1において、前記バリヤ層と前記ハードマスク層とは、気相エッチングにより除去されることを特徴とする金属配線形成方法。
- 請求項13において、 前記気相エッチングで使用するガスは、XeF2、XeF4、XeF6、KrF2、BrF3の中から選択されることを特徴とする金属配線形成方法。
- 請求項1において、前記誘電体層の前記材料は、低誘電率誘電体であることを特徴とする金属配線形成方法。
- 請求項1において、前記誘電体層は2層又はそれ以上の層数からなることを特徴とする金属配線形成方法。
- 請求項16において、前記誘電体層は2層からなり、上層は下層よりも誘電率が高いことを特徴とする金属配線形成方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2014/081790 WO2016004573A1 (en) | 2014-07-08 | 2014-07-08 | Method for forming metal interconnection |
Publications (2)
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JP2017523610A JP2017523610A (ja) | 2017-08-17 |
JP6301003B2 true JP6301003B2 (ja) | 2018-03-28 |
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Country Status (4)
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JP (1) | JP6301003B2 (ja) |
KR (1) | KR102247940B1 (ja) |
CN (1) | CN106463455B (ja) |
WO (1) | WO2016004573A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106653683B (zh) * | 2016-12-29 | 2019-09-13 | 上海集成电路研发中心有限公司 | 一种在后道互连中刻蚀埋层的方法 |
CN108873172A (zh) * | 2018-06-29 | 2018-11-23 | 中国科学院上海光学精密机械研究所 | 一种片上电可调高品质薄膜微光学器件的制备方法 |
CN110911350A (zh) * | 2019-11-22 | 2020-03-24 | 上海集成电路研发中心有限公司 | 一种斜孔的形成方法 |
CN115881549B (zh) * | 2023-01-19 | 2023-05-09 | 合肥晶合集成电路股份有限公司 | 半导体结构的制作方法以及半导体结构 |
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JPH11111656A (ja) * | 1997-09-30 | 1999-04-23 | Nec Corp | 半導体装置の製造方法 |
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US6881664B2 (en) * | 2001-08-28 | 2005-04-19 | Lsi Logic Corporation | Process for planarizing upper surface of damascene wiring structure for integrated circuit structures |
JP2003203911A (ja) * | 2002-01-07 | 2003-07-18 | Sony Corp | 電解研磨方法および配線の製造方法 |
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US6790336B2 (en) * | 2002-06-19 | 2004-09-14 | Intel Corporation | Method of fabricating damascene structures in mechanically weak interlayer dielectrics |
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JP2004214508A (ja) * | 2003-01-07 | 2004-07-29 | Ebara Corp | 配線形成方法及びその装置 |
US7229907B2 (en) * | 2004-09-15 | 2007-06-12 | Tom Wu | Method of forming a damascene structure with integrated planar dielectric layers |
US8012872B2 (en) * | 2004-11-08 | 2011-09-06 | Nxp B.V. | Planarising damascene structures |
US7422983B2 (en) * | 2005-02-24 | 2008-09-09 | International Business Machines Corporation | Ta-TaN selective removal process for integrated device fabrication |
DE102005046975A1 (de) * | 2005-09-30 | 2007-04-05 | Advanced Micro Devices, Inc., Sunnyvale | Technik zur Herstellung einer kupferbasierten Metallisierungsschicht mit einer leitenden Deckschicht |
JP2007173511A (ja) * | 2005-12-22 | 2007-07-05 | Sony Corp | 半導体装置の製造方法 |
JP2009108405A (ja) * | 2007-10-10 | 2009-05-21 | Ebara Corp | 基板を電解研磨する方法及び電解研磨装置 |
JP2009194195A (ja) * | 2008-02-15 | 2009-08-27 | Panasonic Corp | 半導体装置及びその製造方法 |
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CN103199083A (zh) * | 2013-04-09 | 2013-07-10 | 上海华力微电子有限公司 | 复合铜扩散阻挡层及其制备方法 |
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- 2014-07-08 WO PCT/CN2014/081790 patent/WO2016004573A1/en active Application Filing
- 2014-07-08 JP JP2017501030A patent/JP6301003B2/ja active Active
- 2014-07-08 CN CN201480079797.7A patent/CN106463455B/zh active Active
- 2014-07-08 KR KR1020177000636A patent/KR102247940B1/ko active IP Right Grant
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KR102247940B1 (ko) | 2021-05-07 |
CN106463455A (zh) | 2017-02-22 |
JP2017523610A (ja) | 2017-08-17 |
KR20170030522A (ko) | 2017-03-17 |
CN106463455B (zh) | 2019-02-15 |
WO2016004573A1 (en) | 2016-01-14 |
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