JP6294862B2 - プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 - Google Patents

プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 Download PDF

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Publication number
JP6294862B2
JP6294862B2 JP2015240007A JP2015240007A JP6294862B2 JP 6294862 B2 JP6294862 B2 JP 6294862B2 JP 2015240007 A JP2015240007 A JP 2015240007A JP 2015240007 A JP2015240007 A JP 2015240007A JP 6294862 B2 JP6294862 B2 JP 6294862B2
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JP
Japan
Prior art keywords
copper foil
printed wiring
coupling agent
silane coupling
roughened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015240007A
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English (en)
Japanese (ja)
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JP2017106069A (ja
Inventor
貴広 齋藤
貴広 齋藤
健 繪面
健 繪面
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2015240007A priority Critical patent/JP6294862B2/ja
Priority to CN201680004945.8A priority patent/CN107109679B/zh
Priority to PCT/JP2016/086281 priority patent/WO2017099093A1/ja
Priority to KR1020177027515A priority patent/KR102054281B1/ko
Priority to TW105140617A priority patent/TWI645759B/zh
Publication of JP2017106069A publication Critical patent/JP2017106069A/ja
Application granted granted Critical
Publication of JP6294862B2 publication Critical patent/JP6294862B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2015240007A 2015-12-09 2015-12-09 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 Active JP6294862B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015240007A JP6294862B2 (ja) 2015-12-09 2015-12-09 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
CN201680004945.8A CN107109679B (zh) 2015-12-09 2016-12-06 印刷线路板用表面处理铜箔、印刷线路板用覆铜层压板及印刷线路板
PCT/JP2016/086281 WO2017099093A1 (ja) 2015-12-09 2016-12-06 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
KR1020177027515A KR102054281B1 (ko) 2015-12-09 2016-12-06 프린트 배선판용 표면 처리 동박, 프린트 배선판용 구리 피복 적층판 및 프린트 배선판
TW105140617A TWI645759B (zh) 2015-12-09 2016-12-08 印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015240007A JP6294862B2 (ja) 2015-12-09 2015-12-09 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
JP2017106069A JP2017106069A (ja) 2017-06-15
JP6294862B2 true JP6294862B2 (ja) 2018-03-14

Family

ID=59013245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015240007A Active JP6294862B2 (ja) 2015-12-09 2015-12-09 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP6294862B2 (zh)
KR (1) KR102054281B1 (zh)
CN (1) CN107109679B (zh)
TW (1) TWI645759B (zh)
WO (1) WO2017099093A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU101698B1 (en) 2020-03-18 2021-09-20 Circuit Foil Luxembourg Surface-treated copper foil for high-frequency circuit and method for producing same

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Publication number Priority date Publication date Assignee Title
JP7492807B2 (ja) * 2016-12-06 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6632739B2 (ja) * 2017-04-25 2020-01-22 古河電気工業株式会社 表面処理銅箔
JP6965660B2 (ja) * 2017-09-26 2021-11-10 昭和電工マテリアルズ株式会社 表面状態の数値化方法、接合特性の評価方法及び接合体の製造方法
JP7040056B2 (ja) * 2017-09-28 2022-03-23 株式会社Ｇｓユアサ 鉛蓄電池
CN111655908B (zh) * 2017-12-05 2022-03-29 古河电气工业株式会社 表面处理铜箔以及使用该表面处理铜箔的覆铜层叠板和印刷布线板
JP6413039B1 (ja) * 2018-03-29 2018-10-24 Ｊｘ金属株式会社 表面処理銅箔及び銅張積層板
JP7251928B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
US11365486B2 (en) 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
TWI656682B (zh) * 2018-10-16 2019-04-11 長春石油化學股份有限公司 電解銅箔、包含其的電極、及包含其的鋰離子電池
JP7463831B2 (ja) * 2019-05-13 2024-04-09 大日本印刷株式会社 積層体
CN110344105B (zh) * 2019-08-05 2020-10-09 中色奥博特铜铝业有限公司 一种压延铜箔的双面表面处理方法
CN111364032A (zh) * 2020-04-22 2020-07-03 山东金宝电子股份有限公司 一种高频高速覆铜板用铜箔的表面处理剂
CN111640845A (zh) * 2020-05-29 2020-09-08 旭宇光电（深圳）股份有限公司 深紫外led光源及其封装方法
CN113099605B (zh) * 2021-06-08 2022-07-12 广州方邦电子股份有限公司 金属箔、带载体金属箔、覆铜层叠板及印刷线路板

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US4185781A (en) 1978-01-16 1980-01-29 Spraying Systems Co. Quick-disconnect nozzle connection
WO2003096776A1 (fr) 2002-05-13 2003-11-20 Mitsui Mining & Smelting Co.,Ltd. Carte imprimee souple pour puce montee sur bande
WO2003102277A1 (fr) * 2002-06-04 2003-12-11 Mitsui Mining & Smelting Co.,Ltd. Feuille de cuivre traitee en surface pour substrat dielectrique faible, stratifie cuivre comportant cette feuille et carte a cablage imprime
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
WO2015016271A1 (ja) * 2013-08-01 2015-02-05 古河電気工業株式会社 プリント配線基板用銅箔
JP6343204B2 (ja) * 2013-08-20 2018-06-13 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いたキャリア付銅箔、積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2015061757A (ja) * 2013-08-21 2015-04-02 Jx日鉱日石金属株式会社 キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
WO2015040998A1 (ja) * 2013-09-20 2015-03-26 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP5710737B1 (ja) * 2013-11-29 2015-04-30 Jx日鉱日石金属株式会社 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器
JP5819569B1 (ja) * 2013-12-10 2015-11-24 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU101698B1 (en) 2020-03-18 2021-09-20 Circuit Foil Luxembourg Surface-treated copper foil for high-frequency circuit and method for producing same
EP3882378A1 (en) 2020-03-18 2021-09-22 Circuit Foil Luxembourg Surface-treated copper foil for high-frequency circuit and method for producing the same

Also Published As

Publication number Publication date
TW201735754A (zh) 2017-10-01
JP2017106069A (ja) 2017-06-15
KR102054281B1 (ko) 2019-12-10
TWI645759B (zh) 2018-12-21
WO2017099093A1 (ja) 2017-06-15
CN107109679B (zh) 2019-10-29
CN107109679A (zh) 2017-08-29
KR20180037133A (ko) 2018-04-11

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