JP6285359B2 - 改善された熱安定性を有するゲルを形成する方法 - Google Patents

改善された熱安定性を有するゲルを形成する方法 Download PDF

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Publication number
JP6285359B2
JP6285359B2 JP2014534790A JP2014534790A JP6285359B2 JP 6285359 B2 JP6285359 B2 JP 6285359B2 JP 2014534790 A JP2014534790 A JP 2014534790A JP 2014534790 A JP2014534790 A JP 2014534790A JP 6285359 B2 JP6285359 B2 JP 6285359B2
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Prior art keywords
gel
acetylacetonate
iron
iron acetylacetonate
hydrosilylation
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Japanese (ja)
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JP2014530280A (ja
JP2014530280A5 (enExample
Inventor
ディー ドーランド マット
ディー ドーランド マット
デソプ ヒュン
デソプ ヒュン
ジェイ ケナン ジョン
ジェイ ケナン ジョン
アール ラーソン ケント
アール ラーソン ケント
ジー シュミット ランドール
ジー シュミット ランドール
シュイ シュヨンチーン
シュイ シュヨンチーン
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Dow Silicones Corp
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Dow Corning Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2014534790A 2011-10-06 2012-10-05 改善された熱安定性を有するゲルを形成する方法 Active JP6285359B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161544001P 2011-10-06 2011-10-06
US61/544,001 2011-10-06
PCT/US2012/059015 WO2013052838A1 (en) 2011-10-06 2012-10-05 Method of forming a gel having improved thermal stability

Publications (3)

Publication Number Publication Date
JP2014530280A JP2014530280A (ja) 2014-11-17
JP2014530280A5 JP2014530280A5 (enExample) 2015-11-19
JP6285359B2 true JP6285359B2 (ja) 2018-02-28

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JP2014534790A Active JP6285359B2 (ja) 2011-10-06 2012-10-05 改善された熱安定性を有するゲルを形成する方法

Country Status (7)

Country Link
US (1) US20140287247A1 (enExample)
EP (1) EP2764055B1 (enExample)
JP (1) JP6285359B2 (enExample)
KR (1) KR101901122B1 (enExample)
CN (1) CN103917603B (enExample)
TW (1) TWI575025B (enExample)
WO (1) WO2013052838A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180127552A1 (en) * 2011-10-06 2018-05-10 Dow Corning Corporation Method Of Forming A Gel Having Improved Thermal Stability
JP5962599B2 (ja) * 2013-06-26 2016-08-03 信越化学工業株式会社 耐熱性に優れたシリコーンゲル組成物
JP6204595B2 (ja) * 2013-09-03 2017-09-27 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ シリコーン封止材用添加剤
WO2015034821A1 (en) 2013-09-03 2015-03-12 Dow Corning Corporation Additive for a silicone encapsulant
FR3028258B1 (fr) * 2014-11-07 2017-01-13 Bluestar Silicones France Nouveaux catalyseurs de reticulation de compositions silicones
CN111757189B (zh) * 2014-12-01 2022-07-15 构造数据有限责任公司 用于连续介质片段识别的系统和方法
JP6889408B2 (ja) * 2015-11-13 2021-06-18 戸田工業株式会社 鉄酸化物−炭素複合体粒子粉末及びその製造方法
CN119300975A (zh) * 2022-05-03 2025-01-10 埃肯有机硅法国简易股份公司 适于食品接触的制品及其制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029629A (en) * 1975-10-06 1977-06-14 General Electric Company Solvent resistant room temperature vulcanizable silicone rubber composition
US4374967A (en) 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
US4528313A (en) * 1984-06-15 1985-07-09 Dow Corning Corporation Polydimethylsiloxanes having improved thermal stability
JPS62149751A (ja) * 1985-12-25 1987-07-03 Dow Corning Kk 耐熱性ポリオルガノシロキサン組成物
GB9219208D0 (en) * 1992-09-10 1992-10-28 Dow Corning Gmbh Elastomer-forming composition
JP3008766B2 (ja) * 1992-12-14 2000-02-14 信越化学工業株式会社 ヒドロシリル化反応方法
US5371163A (en) * 1993-11-02 1994-12-06 Dow Corning Corporation Organosiloxane compositions yielding tough elastomeric materials
JP3765444B2 (ja) 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
US6020409A (en) * 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
JP3923716B2 (ja) * 2000-09-29 2007-06-06 株式会社東芝 半導体装置
US6962685B2 (en) * 2002-04-17 2005-11-08 International Business Machines Corporation Synthesis of magnetite nanoparticles and the process of forming Fe-based nanomaterials
US20050038183A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved surface properties and curable silicone compositions for preparing the silicones
JP4605342B2 (ja) * 2004-05-11 2011-01-05 信越化学工業株式会社 耐熱用付加反応硬化型シリコーンゴム組成物及びシリコーン接着剤
JP2006283012A (ja) * 2005-03-08 2006-10-19 Adeka Corp ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP5168732B2 (ja) * 2007-09-21 2013-03-27 信越化学工業株式会社 変位耐久性を有する硬化物を与えるシリコーンゲル組成物
JP5288872B2 (ja) * 2008-04-28 2013-09-11 信越化学工業株式会社 加熱硬化型シリコーン組成物
WO2012102852A1 (en) * 2011-01-26 2012-08-02 Dow Corning Corporation High temperature stable thermally conductive materials

Also Published As

Publication number Publication date
JP2014530280A (ja) 2014-11-17
WO2013052838A1 (en) 2013-04-11
KR20140093674A (ko) 2014-07-28
CN103917603A (zh) 2014-07-09
TWI575025B (zh) 2017-03-21
TW201335285A (zh) 2013-09-01
KR101901122B1 (ko) 2018-09-28
EP2764055A1 (en) 2014-08-13
US20140287247A1 (en) 2014-09-25
CN103917603B (zh) 2016-08-24
EP2764055B1 (en) 2018-03-21

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