KR101901122B1 - 향상된 열안정성을 갖는 겔의 형성 방법 - Google Patents
향상된 열안정성을 갖는 겔의 형성 방법 Download PDFInfo
- Publication number
- KR101901122B1 KR101901122B1 KR1020147012185A KR20147012185A KR101901122B1 KR 101901122 B1 KR101901122 B1 KR 101901122B1 KR 1020147012185 A KR1020147012185 A KR 1020147012185A KR 20147012185 A KR20147012185 A KR 20147012185A KR 101901122 B1 KR101901122 B1 KR 101901122B1
- Authority
- KR
- South Korea
- Prior art keywords
- gel
- less
- acetylacetonate
- iron
- delete delete
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/203—Solid polymers with solid and/or liquid additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161544001P | 2011-10-06 | 2011-10-06 | |
| US61/544,001 | 2011-10-06 | ||
| PCT/US2012/059015 WO2013052838A1 (en) | 2011-10-06 | 2012-10-05 | Method of forming a gel having improved thermal stability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140093674A KR20140093674A (ko) | 2014-07-28 |
| KR101901122B1 true KR101901122B1 (ko) | 2018-09-28 |
Family
ID=47116380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147012185A Active KR101901122B1 (ko) | 2011-10-06 | 2012-10-05 | 향상된 열안정성을 갖는 겔의 형성 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140287247A1 (enExample) |
| EP (1) | EP2764055B1 (enExample) |
| JP (1) | JP6285359B2 (enExample) |
| KR (1) | KR101901122B1 (enExample) |
| CN (1) | CN103917603B (enExample) |
| TW (1) | TWI575025B (enExample) |
| WO (1) | WO2013052838A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180127552A1 (en) * | 2011-10-06 | 2018-05-10 | Dow Corning Corporation | Method Of Forming A Gel Having Improved Thermal Stability |
| JP5962599B2 (ja) * | 2013-06-26 | 2016-08-03 | 信越化学工業株式会社 | 耐熱性に優れたシリコーンゲル組成物 |
| JP6204595B2 (ja) * | 2013-09-03 | 2017-09-27 | ダウ コーニング コーポレーションDow Corning Corporation | シリコーン封止材用添加剤 |
| WO2015034821A1 (en) | 2013-09-03 | 2015-03-12 | Dow Corning Corporation | Additive for a silicone encapsulant |
| FR3028258B1 (fr) * | 2014-11-07 | 2017-01-13 | Bluestar Silicones France | Nouveaux catalyseurs de reticulation de compositions silicones |
| CN111757189B (zh) * | 2014-12-01 | 2022-07-15 | 构造数据有限责任公司 | 用于连续介质片段识别的系统和方法 |
| JP6889408B2 (ja) * | 2015-11-13 | 2021-06-18 | 戸田工業株式会社 | 鉄酸化物−炭素複合体粒子粉末及びその製造方法 |
| CN119300975A (zh) * | 2022-05-03 | 2025-01-10 | 埃肯有机硅法国简易股份公司 | 适于食品接触的制品及其制造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4029629A (en) * | 1975-10-06 | 1977-06-14 | General Electric Company | Solvent resistant room temperature vulcanizable silicone rubber composition |
| US4374967A (en) | 1981-07-06 | 1983-02-22 | Dow Corning Corporation | Low temperature silicone gel |
| US4528313A (en) * | 1984-06-15 | 1985-07-09 | Dow Corning Corporation | Polydimethylsiloxanes having improved thermal stability |
| JPS62149751A (ja) * | 1985-12-25 | 1987-07-03 | Dow Corning Kk | 耐熱性ポリオルガノシロキサン組成物 |
| GB9219208D0 (en) * | 1992-09-10 | 1992-10-28 | Dow Corning Gmbh | Elastomer-forming composition |
| JP3008766B2 (ja) * | 1992-12-14 | 2000-02-14 | 信越化学工業株式会社 | ヒドロシリル化反応方法 |
| US5371163A (en) * | 1993-11-02 | 1994-12-06 | Dow Corning Corporation | Organosiloxane compositions yielding tough elastomeric materials |
| JP3765444B2 (ja) | 1997-07-10 | 2006-04-12 | 東レ・ダウコーニング株式会社 | 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル |
| US6020409A (en) * | 1997-09-19 | 2000-02-01 | Dow Corning Corporation | Routes to dielectric gel for protection of electronic modules |
| JP3923716B2 (ja) * | 2000-09-29 | 2007-06-06 | 株式会社東芝 | 半導体装置 |
| US6962685B2 (en) * | 2002-04-17 | 2005-11-08 | International Business Machines Corporation | Synthesis of magnetite nanoparticles and the process of forming Fe-based nanomaterials |
| US20050038183A1 (en) * | 2003-08-14 | 2005-02-17 | Dongchan Ahn | Silicones having improved surface properties and curable silicone compositions for preparing the silicones |
| JP4605342B2 (ja) * | 2004-05-11 | 2011-01-05 | 信越化学工業株式会社 | 耐熱用付加反応硬化型シリコーンゴム組成物及びシリコーン接着剤 |
| JP2006283012A (ja) * | 2005-03-08 | 2006-10-19 | Adeka Corp | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 |
| JP5168732B2 (ja) * | 2007-09-21 | 2013-03-27 | 信越化学工業株式会社 | 変位耐久性を有する硬化物を与えるシリコーンゲル組成物 |
| JP5288872B2 (ja) * | 2008-04-28 | 2013-09-11 | 信越化学工業株式会社 | 加熱硬化型シリコーン組成物 |
| WO2012102852A1 (en) * | 2011-01-26 | 2012-08-02 | Dow Corning Corporation | High temperature stable thermally conductive materials |
-
2012
- 2012-10-05 WO PCT/US2012/059015 patent/WO2013052838A1/en not_active Ceased
- 2012-10-05 CN CN201280054255.5A patent/CN103917603B/zh active Active
- 2012-10-05 KR KR1020147012185A patent/KR101901122B1/ko active Active
- 2012-10-05 EP EP12780584.4A patent/EP2764055B1/en active Active
- 2012-10-05 JP JP2014534790A patent/JP6285359B2/ja active Active
- 2012-10-05 TW TW101137050A patent/TWI575025B/zh active
- 2012-10-05 US US14/349,625 patent/US20140287247A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014530280A (ja) | 2014-11-17 |
| JP6285359B2 (ja) | 2018-02-28 |
| WO2013052838A1 (en) | 2013-04-11 |
| KR20140093674A (ko) | 2014-07-28 |
| CN103917603A (zh) | 2014-07-09 |
| TWI575025B (zh) | 2017-03-21 |
| TW201335285A (zh) | 2013-09-01 |
| EP2764055A1 (en) | 2014-08-13 |
| US20140287247A1 (en) | 2014-09-25 |
| CN103917603B (zh) | 2016-08-24 |
| EP2764055B1 (en) | 2018-03-21 |
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| PA0105 | International application |
Patent event date: 20140502 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20171002 Comment text: Request for Examination of Application |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20180705 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20180917 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
Payment date: 20180918 End annual number: 3 Start annual number: 1 |
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| PR1001 | Payment of annual fee |
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