JP6279921B2 - 配線基板及び半導体パッケージ - Google Patents

配線基板及び半導体パッケージ Download PDF

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Publication number
JP6279921B2
JP6279921B2 JP2014024472A JP2014024472A JP6279921B2 JP 6279921 B2 JP6279921 B2 JP 6279921B2 JP 2014024472 A JP2014024472 A JP 2014024472A JP 2014024472 A JP2014024472 A JP 2014024472A JP 6279921 B2 JP6279921 B2 JP 6279921B2
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JP
Japan
Prior art keywords
wiring
insulating layer
protrusion
adhesive layer
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014024472A
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English (en)
Japanese (ja)
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JP2015153823A5 (https=
JP2015153823A (ja
Inventor
堀川　泰愛
泰愛 堀川
達明 傳田
達明 傳田
清水　浩
浩 清水
小林　和貴
和貴 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014024472A priority Critical patent/JP6279921B2/ja
Priority to US14/583,227 priority patent/US9282629B2/en
Publication of JP2015153823A publication Critical patent/JP2015153823A/ja
Publication of JP2015153823A5 publication Critical patent/JP2015153823A5/ja
Application granted granted Critical
Publication of JP6279921B2 publication Critical patent/JP6279921B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
JP2014024472A 2014-02-12 2014-02-12 配線基板及び半導体パッケージ Active JP6279921B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014024472A JP6279921B2 (ja) 2014-02-12 2014-02-12 配線基板及び半導体パッケージ
US14/583,227 US9282629B2 (en) 2014-02-12 2014-12-26 Wiring substrate and semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014024472A JP6279921B2 (ja) 2014-02-12 2014-02-12 配線基板及び半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2015153823A JP2015153823A (ja) 2015-08-24
JP2015153823A5 JP2015153823A5 (https=) 2017-01-05
JP6279921B2 true JP6279921B2 (ja) 2018-02-14

Family

ID=53776199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014024472A Active JP6279921B2 (ja) 2014-02-12 2014-02-12 配線基板及び半導体パッケージ

Country Status (2)

Country Link
US (1) US9282629B2 (https=)
JP (1) JP6279921B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6420966B2 (ja) * 2014-04-30 2018-11-07 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP6441696B2 (ja) * 2015-01-29 2018-12-19 京セラ株式会社 配線基板、電子装置および電子モジュール
WO2020144814A1 (ja) * 2019-01-10 2020-07-16 三菱電機株式会社 半導体装置
TWI672711B (zh) * 2019-01-10 2019-09-21 健策精密工業股份有限公司 絕緣金屬基板及其製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04123441A (ja) * 1990-09-14 1992-04-23 Hitachi Ltd 半導体集積回路装置
JPH09275170A (ja) * 1996-04-03 1997-10-21 Fuji Electric Co Ltd 半導体装置
JP2003282778A (ja) * 2002-03-26 2003-10-03 Fujikura Ltd 半導体装置及びプリント配線基板
TWI280657B (en) 2004-05-28 2007-05-01 Sanyo Electric Co Circuit device
JP4511245B2 (ja) 2004-05-28 2010-07-28 三洋電機株式会社 回路装置
JP5025113B2 (ja) * 2005-09-29 2012-09-12 三洋電機株式会社 回路装置
JP2007214427A (ja) * 2006-02-10 2007-08-23 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2010080572A (ja) * 2008-09-25 2010-04-08 Denso Corp 電子装置
JP5357706B2 (ja) * 2009-11-10 2013-12-04 パナソニック株式会社 半導体実装構造体
EP2779377B1 (en) * 2011-11-09 2018-04-18 Mitsubishi Electric Corporation Rotating electrical machine
HK1201906A1 (en) * 2011-11-16 2015-09-11 福特恩控股有限公司 Systems, methods and/or devices for providing led lighting
JP6230777B2 (ja) 2012-01-30 2017-11-15 新光電気工業株式会社 配線基板、配線基板の製造方法、及び発光装置
JP5952032B2 (ja) * 2012-03-07 2016-07-13 新光電気工業株式会社 配線基板及び配線基板の製造方法
US8998454B2 (en) * 2013-03-15 2015-04-07 Sumitomo Electric Printed Circuits, Inc. Flexible electronic assembly and method of manufacturing the same

Also Published As

Publication number Publication date
US20150230328A1 (en) 2015-08-13
US9282629B2 (en) 2016-03-08
JP2015153823A (ja) 2015-08-24

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