JP6276947B2 - 加工方法 - Google Patents

加工方法 Download PDF

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Publication number
JP6276947B2
JP6276947B2 JP2013181016A JP2013181016A JP6276947B2 JP 6276947 B2 JP6276947 B2 JP 6276947B2 JP 2013181016 A JP2013181016 A JP 2013181016A JP 2013181016 A JP2013181016 A JP 2013181016A JP 6276947 B2 JP6276947 B2 JP 6276947B2
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JP
Japan
Prior art keywords
device wafer
protective film
processing
laser beam
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013181016A
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English (en)
Japanese (ja)
Other versions
JP2015047618A (ja
Inventor
哲 熊澤
哲 熊澤
健太郎 小田中
健太郎 小田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2013181016A priority Critical patent/JP6276947B2/ja
Priority to TW103126219A priority patent/TWI660415B/zh
Priority to KR1020140111381A priority patent/KR102104138B1/ko
Publication of JP2015047618A publication Critical patent/JP2015047618A/ja
Application granted granted Critical
Publication of JP6276947B2 publication Critical patent/JP6276947B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
JP2013181016A 2013-09-02 2013-09-02 加工方法 Active JP6276947B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013181016A JP6276947B2 (ja) 2013-09-02 2013-09-02 加工方法
TW103126219A TWI660415B (zh) 2013-09-02 2014-07-31 加工方法
KR1020140111381A KR102104138B1 (ko) 2013-09-02 2014-08-26 가공 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013181016A JP6276947B2 (ja) 2013-09-02 2013-09-02 加工方法

Publications (2)

Publication Number Publication Date
JP2015047618A JP2015047618A (ja) 2015-03-16
JP6276947B2 true JP6276947B2 (ja) 2018-02-07

Family

ID=52698092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013181016A Active JP6276947B2 (ja) 2013-09-02 2013-09-02 加工方法

Country Status (3)

Country Link
JP (1) JP6276947B2 (ko)
KR (1) KR102104138B1 (ko)
TW (1) TWI660415B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102358063B1 (ko) * 2020-05-18 2022-02-04 (주)미래컴퍼니 박막 제거 장치 및 박막 제거 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05100435A (ja) * 1991-10-07 1993-04-23 Nikon Corp 薄膜除去方法
JPH05327186A (ja) * 1992-05-18 1993-12-10 Fujitsu Ltd パターンカット方法
US5493096A (en) * 1994-05-10 1996-02-20 Grumman Aerospace Corporation Thin substrate micro-via interconnect
US6562698B2 (en) * 1999-06-08 2003-05-13 Kulicke & Soffa Investments, Inc. Dual laser cutting of wafers
JP3484396B2 (ja) * 2000-05-09 2004-01-06 新光電気工業株式会社 ウェハーの切断方法
JP4447325B2 (ja) * 2002-02-25 2010-04-07 株式会社ディスコ 半導体ウェーハの分割方法
JP2004188475A (ja) * 2002-12-13 2004-07-08 Disco Abrasive Syst Ltd レーザー加工方法
JP4471632B2 (ja) * 2003-11-18 2010-06-02 株式会社ディスコ ウエーハの加工方法
US7211500B2 (en) * 2004-09-27 2007-05-01 United Microelectronics Corp. Pre-process before cutting a wafer and method of cutting a wafer
KR100689698B1 (ko) * 2005-01-12 2007-03-08 주식회사 이오테크닉스 패시베이션층이 형성된 대상물 가공 방법
US7265034B2 (en) * 2005-02-18 2007-09-04 Taiwan Semiconductor Manufacturing Company, Ltd. Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade
JP4932372B2 (ja) * 2006-07-31 2012-05-16 オプトレックス株式会社 マザー基板の切断方法
JP4959422B2 (ja) * 2007-05-30 2012-06-20 株式会社ディスコ ウエーハの分割方法
JP2012000622A (ja) * 2010-06-14 2012-01-05 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザスクライブ方法
CA2772727A1 (en) * 2011-04-01 2012-10-01 Esi-Pyrophotonics Lasers Inc. Method and apparatus to scribe thin film layers of cadium telluride solar cells
JP5881464B2 (ja) * 2012-02-27 2016-03-09 株式会社ディスコ ウェーハのレーザー加工方法

Also Published As

Publication number Publication date
KR102104138B1 (ko) 2020-04-23
KR20150026884A (ko) 2015-03-11
TWI660415B (zh) 2019-05-21
TW201515082A (zh) 2015-04-16
JP2015047618A (ja) 2015-03-16

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