JP6269506B2 - 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法 - Google Patents

積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法 Download PDF

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Publication number
JP6269506B2
JP6269506B2 JP2014553165A JP2014553165A JP6269506B2 JP 6269506 B2 JP6269506 B2 JP 6269506B2 JP 2014553165 A JP2014553165 A JP 2014553165A JP 2014553165 A JP2014553165 A JP 2014553165A JP 6269506 B2 JP6269506 B2 JP 6269506B2
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JP
Japan
Prior art keywords
laminate
resin
layer
resin composition
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014553165A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2014098099A1 (ja
Inventor
由香 山崎
由香 山崎
真裕 青嶌
真裕 青嶌
上方　康雄
康雄 上方
藤本　大輔
大輔 藤本
薫平 山田
薫平 山田
村井　曜
曜 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2014098099A1 publication Critical patent/JPWO2014098099A1/ja
Application granted granted Critical
Publication of JP6269506B2 publication Critical patent/JP6269506B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Surface Treatment Of Glass (AREA)
JP2014553165A 2012-12-18 2013-12-17 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法 Expired - Fee Related JP6269506B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012276250 2012-12-18
JP2012276250 2012-12-18
PCT/JP2013/083802 WO2014098099A1 (fr) 2012-12-18 2013-12-17 Corps multicouche, stratifié, carte imprimée, procédé de production d'un corps multicouche et procédé de fabrication d'un stratifié

Publications (2)

Publication Number Publication Date
JPWO2014098099A1 JPWO2014098099A1 (ja) 2017-01-12
JP6269506B2 true JP6269506B2 (ja) 2018-01-31

Family

ID=50978425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014553165A Expired - Fee Related JP6269506B2 (ja) 2012-12-18 2013-12-17 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法

Country Status (3)

Country Link
JP (1) JP6269506B2 (fr)
TW (1) TWI618630B (fr)
WO (1) WO2014098099A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6690356B2 (ja) * 2016-03-29 2020-04-28 味の素株式会社 熱硬化性樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19961842B4 (de) * 1999-12-21 2008-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mehrschichtleiterplatte
US7226653B2 (en) * 2000-10-13 2007-06-05 Ppc Electronic Ag Printed circuit board and method for producing a printed circuit board
KR101312369B1 (ko) * 2005-10-31 2013-09-27 니폰 가야꾸 가부시끼가이샤 고무 변성 폴리아미드 수지, 에폭시 수지　조성물　및 그경화물
WO2008126817A1 (fr) * 2007-04-11 2008-10-23 Hitachi Chemical Company, Ltd. Plaque stratifiée revêtue d'une feuille métallique et carte de câblage imprimée
JP5716522B2 (ja) * 2011-05-02 2015-05-13 日立化成株式会社 接着補助層用樹脂組成物
JP5212578B1 (ja) * 2011-05-31 2013-06-19 日立化成株式会社 めっきプロセス用プライマー層、配線板用積層板及びその製造方法、多層配線板及びその製造方法
KR20190064661A (ko) * 2011-09-22 2019-06-10 히타치가세이가부시끼가이샤 적층체, 적층판, 다층 적층판, 프린트 배선판 및 적층판의 제조 방법
JP6295663B2 (ja) * 2011-09-22 2018-03-20 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
WO2013042750A1 (fr) * 2011-09-22 2013-03-28 日立化成株式会社 Corps stratifié, carte stratifiée, carte stratifiée multicouche, carte imprimée et procédé de production de carte stratifiée
JPWO2013042752A1 (ja) * 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法

Also Published As

Publication number Publication date
WO2014098099A1 (fr) 2014-06-26
TW201446499A (zh) 2014-12-16
TWI618630B (zh) 2018-03-21
JPWO2014098099A1 (ja) 2017-01-12

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