JP6231982B2 - 無電解金めっき処理方法、および金めっき被覆材料 - Google Patents
無電解金めっき処理方法、および金めっき被覆材料 Download PDFInfo
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- JP6231982B2 JP6231982B2 JP2014524860A JP2014524860A JP6231982B2 JP 6231982 B2 JP6231982 B2 JP 6231982B2 JP 2014524860 A JP2014524860 A JP 2014524860A JP 2014524860 A JP2014524860 A JP 2014524860A JP 6231982 B2 JP6231982 B2 JP 6231982B2
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- gold plating
- layer
- plating
- gold
- electroless
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
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- C22C5/02—Alloys based on gold
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- C23C18/1651—Two or more layers only obtained by electroless plating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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Description
本発明の無電解金めっき処理方法により得られる金めっき被覆材料は、基材上に、下地合金層と、金めっき層と、を備え、前記下地合金層が、M1−M2−M3合金(ただし、M1は、Ni、Fe、Co、Cu、Zn、およびSnから選択される少なくとも1つの元素、M2は、Pd、Re、Pt、Rh、Ag、およびRuから選択される少なくとも1つの元素、M3は、P、およびBから選択される少なくとも1つの元素である。)であることを特徴とする。
基材としては、特に限定されないが、鋼、ステンレス鋼、Al、Al合金、Ti、Ti合金、Cu、Cu合金、Ni、Ni合金などが挙げられる。基材の形状としては、特に限定されず、使用用途に応じて適宜選択することができるが、たとえば、線状や板状に加工された導電性の金属部品、板を凹凸状に加工してなる導電性部材、ばね状や筒状に加工された電子機器の部品などの用途に応じて必要な形状に加工したもの用いることができる。また、基材の太さ(直径)や厚み(板厚)は、特に限定されず、使用用途に応じて適宜選択することができる。
下地合金層は、金めっき層を良好に形成するための下地層であり、M1−M2−M3合金からなる。ここで、M1−M2−M3合金は、互いに異なる元素であるM1、M2、およびM3から構成され、M1は、Ni、Fe、Co、Cu、Zn、およびSnから選択される少なくとも1つの元素であり、また、M2は、Pd、Re、Pt、Rh、Ag、およびRuから選択される少なくとも1つの元素であり、さらに、M3は、P、およびBから選択される少なくとも1つの元素である。
金めっき層は、下地合金層上に、直接、非シアン系の金めっき浴を用いて、無電解還元めっき処理を施すことにより形成される層である。
JIS H4000に規定された5000系の5086アルミニウム合金(Si:0.4重量%、Fe:0.5重量%、Cu:0.1重量%、Mn:0.2重量%、Mg:3.5重量%、Zn:0.25重量%、Cr:0.25重量%、Al:残部)上に、無電解めっきにより、表面の算術平均粗さRaが0.1nmであり、厚みが10μmであるNi−P層(Pの含有割合が12重量%)が形成された、総厚1.27mmの基材を準備した。次いで、準備した基材を脱脂した後、水洗し、Ni−Pめっき浴(奥野製薬工業社製、ICPニコロンGM−NP)を用いて、無電解めっきにより、基材上に、厚さ2μmのNi−Pめっき層(Pの含有割合が7重量%)を形成した。
<Pdめっき浴>
パラジウム塩:Pdめっき浴中におけるPdが0.15重量%となる量
還元剤:1.8重量%
錯化剤:0.63重量%
水:97.2重量%
pH:5.8
<Ni−Pめっき浴>
ニッケル塩(塩化ニッケル):1.8重量%
還元剤(次亜燐酸ナトリウム):2.4重量%
錯化剤:2.4重量%
水:93.2重量%
pH:5.2
そして、このようにして得られた金めっき被覆材料について、目視、および走査型電子顕微鏡(日立ハイテクノロジーズ社製、S−4800)にて観察し、得られた金めっき被覆材料の表面について、金めっき層の外観、および金の未析出部の有無を確認した。評価結果を表1に示す。
次いで、金めっき被覆材料の金めっき層に対し、密着性の評価を行った。密着性の評価は、具体的には、金めっき被覆材料の金めっき層に粘着テープ(ニチバン社製、ナイスタック強力タイプ)を貼付した後、剥がすことにより剥離試験を実施し、その後、金めっき層の剥離状態を観察して、以下の基準で評価した。評価結果を表1に示す。
○:金めっき層の剥離が確認されなかった。
×:金めっき層の剥離が発生した。
上述したNi−Pd−P合金層に代えて、Ptめっき浴(日本高純度化学社製、IM−PT)と、上述したNi−Pd−P合金層を形成する際に用いたNi−Pめっき浴とを、Ptめっき浴:Ni−Pめっき浴=3:7(体積比)の割合で混合しためっき浴を用いて、35℃、10分間、pH4.0の条件で、めっき処理を施すことにより、Ni−Pめっき層上に、厚さ50nmのNi−Pt−P合金層を形成し、さらに、金めっき層を形成する際の、無電解還元めっき処理における浸漬時間などを変更することにより、厚さ5nmの金めっき層を形成した以外は、実施例1と同様にして金めっき被覆材料を得て、同様に評価を行った。評価結果を表1に示す。
上述したNi−Pd−P合金層に代えて、Pdめっき浴(奥野製薬工業社製、パラトップ)と、下記に示すCoめっき浴とを、Pdめっき浴:Coめっき浴=1:6(体積比)の割合で混合しためっき浴を用いて、60℃、10分間、pH8.5の条件で、めっき処理を施すことにより、Ni−Pめっき層上に、厚さ50nmのCo−Pd−P合金層を形成し、さらに、金めっき層を形成する際の、無電解還元めっき処理における浸漬時間などを変更することにより、厚さ5nmの金めっき層を形成した以外は、実施例1と同様にして金めっき被覆材料を得て、同様に評価を行った。評価結果を表1に示す。
<Coめっき浴>
コバルト塩(硫酸コバルト):10g/L
還元剤(次亜燐酸ナトリウム):25g/L
錯化剤(クエン酸3ナトリウム):30g/L
錯化剤(酒石酸ナトリウム):30g/L
錯化剤(グリシン):7.58g/L
酢酸鉛:0.3ppm
上述したNi−Pd−P合金層を形成せずに、Ni−Pめっき層上に、直接、非シアン系の無電解還元金めっき浴(奥野製薬工業社製、セルフゴールドOTK)を用いて、無電解還元めっき処理を施した以外は、実施例1と同様にして金めっき被覆材料を得て、同様に評価を行った。評価結果を表1に示す。
Ni−Pd−P合金層を形成する代わりに、Pdめっき浴(奥野製薬工業社製、パラトップ)を用いて、無電解めっきにより、Ni−Pめっき層上に厚さ0.5μmのパラジウムめっき層を形成し、形成したパラジウムめっき上に、直接、非シアン系の無電解還元金めっき浴(奥野製薬工業社製、セルフゴールドOTK)を用いて、無電解還元めっき処理を施した以外は、実施例1と同様にして金めっき被覆材料を得て、同様に評価を行った。評価結果を表1に示す。
金めっき層を形成する際の、無電解還元めっきにおける浸漬時間などを変更して、形成される金めっき層の厚みを、36nm(実施例4)、49nm(実施例5)、および63nm(実施例6)とした以外は、実施例1と同様にして金めっき被覆材料を得た。
比較例3については、Ni−Pd−P合金層を形成せず、Ni−Pめっき層上に、直接、非シアン系の無電解置換金めっき浴(奥野製薬工業社製、フラッシュゴールドNC)を用いて、55℃、1分間の条件で無電解置換めっき処理を施し、次いで、非シアン系の無電解還元金めっき浴(奥野製薬工業社製、セルフゴールドOTK)を用いて、60℃、1分間の条件で無電解還元めっき処理を施し、厚さ35nmの金めっき層を形成した以外は、実施例1と同様にして金めっき被覆材料を得た。
金めっき層を形成する際の、無電解還元めっきにおける浸漬時間などを変更して、形成される金めっき層の厚みを、78nm(比較例4)、132nm(比較例5)、および186nm(比較例6)とした以外は、比較例3と同様にして金めっき被覆材料を得た。
次いで、実施例4〜6、および比較例3〜6においては、得られた金めっき被覆材料に対し、耐食性の評価を行った。耐食性の評価は、具体的には、金めっき被覆材料を縦35mm、横20mmの面積が露出するようにポリイミドテープでマスキングし、90℃の硫酸水溶液(体積80ml、pH:1)に50時間浸漬した後、金めっき被覆材料を取り出し、金めっき被覆材料から硫酸水溶液中に溶出したイオン(Ni、Pd、P)の濃度を誘導結合プラズマ発光分析装置(島津製作所社製、ICPE−9000)により測定することにより行った。結果を図2に示す。なお、図2に示す結果は、比較例3における、金めっき層の厚みが35nmであるときのイオン(Ni、Pd、P)溶出濃度を100として、相対値で示している。
Claims (2)
- 基材上に、下地合金層を形成する工程と、
前記下地合金層上に、直接、非シアン系の金めっき浴を用いて、無電解還元めっきにより金めっき層を形成する工程と、を有する無電解金めっき処理方法であって、
前記下地合金層が、M1−M2−M3合金(ただし、M1は、Ni、Fe、Co、Cu、Zn、およびSnから選択される少なくとも1つの元素、M2は、Pd、Re、Pt、Rh、Ag、およびRuから選択される少なくとも1つの元素、M3は、P、およびBから選択される少なくとも1つの元素である。)であり、
前記M1−M2−M3合金における各元素の比率について、M1を20〜50原子%、M2を30〜50原子%、M3を20〜30原子%とする無電解金めっき処理方法。 - 基材と、
前記基材上に形成された下地合金層と、
前記下地合金層上に形成された金めっき層と、を備える金めっき被覆材料であって、
前記下地合金層が、M1−M2−M3合金(ただし、M1は、Ni、Fe、Co、Cu、Zn、およびSnから選択される少なくとも1つの元素、M2は、Pd、Re、Pt、Rh、Ag、およびRuから選択される少なくとも1つの元素、M3は、P、およびBから選択される少なくとも1つの元素である。)であり、
前記M1−M2−M3合金における各元素の比率は、M1が20〜50原子%、M2が30〜50原子%、M3が20〜30原子%であることを特徴とする金めっき被覆材料。
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