JP6230595B2 - 試験プローブアセンブリおよび関連方法 - Google Patents
試験プローブアセンブリおよび関連方法 Download PDFInfo
- Publication number
- JP6230595B2 JP6230595B2 JP2015505735A JP2015505735A JP6230595B2 JP 6230595 B2 JP6230595 B2 JP 6230595B2 JP 2015505735 A JP2015505735 A JP 2015505735A JP 2015505735 A JP2015505735 A JP 2015505735A JP 6230595 B2 JP6230595 B2 JP 6230595B2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- spring
- electrically conductive
- distal
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49119—Brush
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261624083P | 2012-04-13 | 2012-04-13 | |
| US61/624,083 | 2012-04-13 | ||
| PCT/US2013/031240 WO2013154738A1 (en) | 2012-04-13 | 2013-03-14 | Test probe assembly and related methods |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015516571A JP2015516571A (ja) | 2015-06-11 |
| JP2015516571A5 JP2015516571A5 (enExample) | 2016-03-03 |
| JP6230595B2 true JP6230595B2 (ja) | 2017-11-15 |
Family
ID=48045061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015505735A Expired - Fee Related JP6230595B2 (ja) | 2012-04-13 | 2013-03-14 | 試験プローブアセンブリおよび関連方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9829506B2 (enExample) |
| EP (1) | EP2836847B1 (enExample) |
| JP (1) | JP6230595B2 (enExample) |
| MY (1) | MY176424A (enExample) |
| PT (1) | PT2836847T (enExample) |
| SG (1) | SG11201406561XA (enExample) |
| WO (1) | WO2013154738A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI573332B (zh) * | 2014-07-23 | 2017-03-01 | 鴻騰精密科技股份有限公司 | 電連接器及其端子 |
| US20180095110A1 (en) * | 2016-09-30 | 2018-04-05 | Xcerra Corporation | Compact testing system |
| MY177005A (en) * | 2016-11-30 | 2020-09-01 | Nidec Read Corp | Contact terminal, inspection jig, and inspection device |
| USD869305S1 (en) * | 2017-02-10 | 2019-12-10 | Kabushiki Kaisha Nihon Micronics | Probe pin |
| JP1592871S (enExample) * | 2017-02-10 | 2017-12-11 | ||
| JP1623279S (enExample) * | 2018-02-02 | 2019-01-28 | ||
| JP1622970S (enExample) * | 2018-02-02 | 2019-01-28 | ||
| JP1623280S (enExample) * | 2018-02-02 | 2019-01-28 | ||
| JP1622969S (enExample) * | 2018-02-02 | 2019-01-28 | ||
| JP1626668S (enExample) * | 2018-02-02 | 2019-03-18 | ||
| TWD197822S (zh) * | 2018-02-02 | 2019-06-01 | Nihon Micronics Kk | 電性接觸子之部分 |
| JP1626667S (enExample) * | 2018-02-02 | 2019-03-18 | ||
| JP1622968S (enExample) * | 2018-02-02 | 2019-01-28 | ||
| PH12021552664A1 (en) * | 2019-04-23 | 2022-09-19 | Yokowo Seisakusho Kk | Contact probe |
| CN113009196B (zh) * | 2021-03-02 | 2022-03-18 | 上海捷策创电子科技有限公司 | 一种芯片测试用探针和芯片测试装置 |
| US11387587B1 (en) * | 2021-03-13 | 2022-07-12 | Plastronics Socket Partners, Ltd. | Self-retained slider contact pin |
| KR102619576B1 (ko) * | 2021-04-21 | 2023-12-29 | 리노공업주식회사 | 프로브 콘텍트 |
| US11906576B1 (en) | 2021-05-04 | 2024-02-20 | Johnstech International Corporation | Contact assembly array and testing system having contact assembly array |
| US11867752B1 (en) | 2021-05-13 | 2024-01-09 | Johnstech International Corporation | Contact assembly and kelvin testing system having contact assembly |
| USD1015282S1 (en) | 2022-02-01 | 2024-02-20 | Johnstech International Corporation | Spring pin tip |
| US20240003938A1 (en) * | 2022-07-01 | 2024-01-04 | LST Co., Ltd | Contact pin and test socket having the same |
| CN115184652B (zh) * | 2022-07-06 | 2024-07-09 | 渭南木王智能科技股份有限公司 | 一种细长稳流测试探针 |
| CN118091212A (zh) * | 2022-11-28 | 2024-05-28 | 恩普乐斯股份有限公司 | 接触探针 |
| USD1090440S1 (en) * | 2023-01-12 | 2025-08-26 | Johnstech International Corporation | Spring probe contact assembly |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5936421A (en) * | 1994-10-11 | 1999-08-10 | Virginia Panel Corporation | Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith |
| JP4060919B2 (ja) | 1997-11-28 | 2008-03-12 | 富士通株式会社 | 電気的接続装置、接触子製造方法、及び半導体試験方法 |
| DE19882938T1 (de) * | 1998-01-05 | 2001-04-26 | Rika Electronics Internat Inc | Koaxialkontaktanordnungs-Vorrichtung |
| US6506082B1 (en) * | 2001-12-21 | 2003-01-14 | Interconnect Devices, Inc. | Electrical contact interface |
| US6746252B1 (en) * | 2002-08-01 | 2004-06-08 | Plastronics Socket Partners, L.P. | High frequency compression mount receptacle with lineal contact members |
| US6967492B2 (en) * | 2003-11-26 | 2005-11-22 | Asm Assembly Automation Ltd. | Spring contact probe device for electrical testing |
| WO2006135680A2 (en) * | 2005-06-10 | 2006-12-21 | Delaware Capital Formation Inc. | Electrical contact probe with compliant internal interconnect |
| JP4999079B2 (ja) * | 2007-04-10 | 2012-08-15 | サンユー工業株式会社 | プローブ |
| US7862391B2 (en) * | 2007-09-18 | 2011-01-04 | Delaware Capital Formation, Inc. | Spring contact assembly |
| DE102008023761B9 (de) * | 2008-05-09 | 2012-11-08 | Feinmetall Gmbh | Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung |
| US8105119B2 (en) * | 2009-01-30 | 2012-01-31 | Delaware Capital Formation, Inc. | Flat plunger round barrel test probe |
| WO2011036800A1 (ja) * | 2009-09-28 | 2011-03-31 | 株式会社日本マイクロニクス | 接触子及び電気的接続装置 |
| US8710856B2 (en) * | 2010-01-15 | 2014-04-29 | LTX Credence Corporation | Terminal for flat test probe |
| JPWO2011096067A1 (ja) * | 2010-02-05 | 2013-06-10 | 株式会社日本マイクロニクス | 接触子及び電気的接続装置 |
| JP5352525B2 (ja) * | 2010-04-28 | 2013-11-27 | 日本航空電子工業株式会社 | プローブピン用コンタクト、プローブピンおよび電子デバイス用接続治具 |
| TWM393066U (en) * | 2010-05-06 | 2010-11-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| JP5618729B2 (ja) * | 2010-09-24 | 2014-11-05 | シチズンセイミツ株式会社 | コンタクトプローブ及びこれを用いた電子回路試験装置 |
-
2013
- 2013-03-14 JP JP2015505735A patent/JP6230595B2/ja not_active Expired - Fee Related
- 2013-03-14 MY MYPI2014703010A patent/MY176424A/en unknown
- 2013-03-14 EP EP13713634.7A patent/EP2836847B1/en active Active
- 2013-03-14 US US14/394,252 patent/US9829506B2/en active Active
- 2013-03-14 PT PT137136347T patent/PT2836847T/pt unknown
- 2013-03-14 WO PCT/US2013/031240 patent/WO2013154738A1/en not_active Ceased
- 2013-03-14 SG SG11201406561XA patent/SG11201406561XA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SG11201406561XA (en) | 2014-11-27 |
| US9829506B2 (en) | 2017-11-28 |
| EP2836847A1 (en) | 2015-02-18 |
| EP2836847B1 (en) | 2016-05-18 |
| PT2836847T (pt) | 2016-08-23 |
| WO2013154738A1 (en) | 2013-10-17 |
| US20150070040A1 (en) | 2015-03-12 |
| JP2015516571A (ja) | 2015-06-11 |
| MY176424A (en) | 2020-08-07 |
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