JP6230595B2 - 試験プローブアセンブリおよび関連方法 - Google Patents

試験プローブアセンブリおよび関連方法 Download PDF

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Publication number
JP6230595B2
JP6230595B2 JP2015505735A JP2015505735A JP6230595B2 JP 6230595 B2 JP6230595 B2 JP 6230595B2 JP 2015505735 A JP2015505735 A JP 2015505735A JP 2015505735 A JP2015505735 A JP 2015505735A JP 6230595 B2 JP6230595 B2 JP 6230595B2
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Japan
Prior art keywords
plunger
spring
electrically conductive
distal
test
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Expired - Fee Related
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JP2015505735A
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Japanese (ja)
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JP2015516571A5 (enExample
JP2015516571A (ja
Inventor
バルツ トレイバーグス,
バルツ トレイバーグス,
アーロン マグヌスン,
アーロン マグヌスン,
セルゲイ ヤクシェフ,
セルゲイ ヤクシェフ,
スコット ハンソン,
スコット ハンソン,
Original Assignee
エクセラ コーポレイション
エクセラ コーポレイション
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Publication of JP2015516571A5 publication Critical patent/JP2015516571A5/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06722Spring-loaded
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06705Apparatus for holding or moving single probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49119Brush

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2015505735A 2012-04-13 2013-03-14 試験プローブアセンブリおよび関連方法 Expired - Fee Related JP6230595B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261624083P 2012-04-13 2012-04-13
US61/624,083 2012-04-13
PCT/US2013/031240 WO2013154738A1 (en) 2012-04-13 2013-03-14 Test probe assembly and related methods

Publications (3)

Publication Number Publication Date
JP2015516571A JP2015516571A (ja) 2015-06-11
JP2015516571A5 JP2015516571A5 (enExample) 2016-03-03
JP6230595B2 true JP6230595B2 (ja) 2017-11-15

Family

ID=48045061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015505735A Expired - Fee Related JP6230595B2 (ja) 2012-04-13 2013-03-14 試験プローブアセンブリおよび関連方法

Country Status (7)

Country Link
US (1) US9829506B2 (enExample)
EP (1) EP2836847B1 (enExample)
JP (1) JP6230595B2 (enExample)
MY (1) MY176424A (enExample)
PT (1) PT2836847T (enExample)
SG (1) SG11201406561XA (enExample)
WO (1) WO2013154738A1 (enExample)

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Publication number Priority date Publication date Assignee Title
TWI573332B (zh) * 2014-07-23 2017-03-01 鴻騰精密科技股份有限公司 電連接器及其端子
US20180095110A1 (en) * 2016-09-30 2018-04-05 Xcerra Corporation Compact testing system
MY177005A (en) * 2016-11-30 2020-09-01 Nidec Read Corp Contact terminal, inspection jig, and inspection device
USD869305S1 (en) * 2017-02-10 2019-12-10 Kabushiki Kaisha Nihon Micronics Probe pin
JP1592871S (enExample) * 2017-02-10 2017-12-11
JP1623279S (enExample) * 2018-02-02 2019-01-28
JP1622970S (enExample) * 2018-02-02 2019-01-28
JP1623280S (enExample) * 2018-02-02 2019-01-28
JP1622969S (enExample) * 2018-02-02 2019-01-28
JP1626668S (enExample) * 2018-02-02 2019-03-18
TWD197822S (zh) * 2018-02-02 2019-06-01 Nihon Micronics Kk 電性接觸子之部分
JP1626667S (enExample) * 2018-02-02 2019-03-18
JP1622968S (enExample) * 2018-02-02 2019-01-28
PH12021552664A1 (en) * 2019-04-23 2022-09-19 Yokowo Seisakusho Kk Contact probe
CN113009196B (zh) * 2021-03-02 2022-03-18 上海捷策创电子科技有限公司 一种芯片测试用探针和芯片测试装置
US11387587B1 (en) * 2021-03-13 2022-07-12 Plastronics Socket Partners, Ltd. Self-retained slider contact pin
KR102619576B1 (ko) * 2021-04-21 2023-12-29 리노공업주식회사 프로브 콘텍트
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly
USD1015282S1 (en) 2022-02-01 2024-02-20 Johnstech International Corporation Spring pin tip
US20240003938A1 (en) * 2022-07-01 2024-01-04 LST Co., Ltd Contact pin and test socket having the same
CN115184652B (zh) * 2022-07-06 2024-07-09 渭南木王智能科技股份有限公司 一种细长稳流测试探针
CN118091212A (zh) * 2022-11-28 2024-05-28 恩普乐斯股份有限公司 接触探针
USD1090440S1 (en) * 2023-01-12 2025-08-26 Johnstech International Corporation Spring probe contact assembly

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US5936421A (en) * 1994-10-11 1999-08-10 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
JP4060919B2 (ja) 1997-11-28 2008-03-12 富士通株式会社 電気的接続装置、接触子製造方法、及び半導体試験方法
DE19882938T1 (de) * 1998-01-05 2001-04-26 Rika Electronics Internat Inc Koaxialkontaktanordnungs-Vorrichtung
US6506082B1 (en) * 2001-12-21 2003-01-14 Interconnect Devices, Inc. Electrical contact interface
US6746252B1 (en) * 2002-08-01 2004-06-08 Plastronics Socket Partners, L.P. High frequency compression mount receptacle with lineal contact members
US6967492B2 (en) * 2003-11-26 2005-11-22 Asm Assembly Automation Ltd. Spring contact probe device for electrical testing
WO2006135680A2 (en) * 2005-06-10 2006-12-21 Delaware Capital Formation Inc. Electrical contact probe with compliant internal interconnect
JP4999079B2 (ja) * 2007-04-10 2012-08-15 サンユー工業株式会社 プローブ
US7862391B2 (en) * 2007-09-18 2011-01-04 Delaware Capital Formation, Inc. Spring contact assembly
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US8105119B2 (en) * 2009-01-30 2012-01-31 Delaware Capital Formation, Inc. Flat plunger round barrel test probe
WO2011036800A1 (ja) * 2009-09-28 2011-03-31 株式会社日本マイクロニクス 接触子及び電気的接続装置
US8710856B2 (en) * 2010-01-15 2014-04-29 LTX Credence Corporation Terminal for flat test probe
JPWO2011096067A1 (ja) * 2010-02-05 2013-06-10 株式会社日本マイクロニクス 接触子及び電気的接続装置
JP5352525B2 (ja) * 2010-04-28 2013-11-27 日本航空電子工業株式会社 プローブピン用コンタクト、プローブピンおよび電子デバイス用接続治具
TWM393066U (en) * 2010-05-06 2010-11-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP5618729B2 (ja) * 2010-09-24 2014-11-05 シチズンセイミツ株式会社 コンタクトプローブ及びこれを用いた電子回路試験装置

Also Published As

Publication number Publication date
SG11201406561XA (en) 2014-11-27
US9829506B2 (en) 2017-11-28
EP2836847A1 (en) 2015-02-18
EP2836847B1 (en) 2016-05-18
PT2836847T (pt) 2016-08-23
WO2013154738A1 (en) 2013-10-17
US20150070040A1 (en) 2015-03-12
JP2015516571A (ja) 2015-06-11
MY176424A (en) 2020-08-07

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