MY176424A - Test probe assembly and related methods abstract - Google Patents

Test probe assembly and related methods abstract

Info

Publication number
MY176424A
MY176424A MYPI2014703010A MYPI2014703010A MY176424A MY 176424 A MY176424 A MY 176424A MY PI2014703010 A MYPI2014703010 A MY PI2014703010A MY PI2014703010 A MYPI2014703010 A MY PI2014703010A MY 176424 A MY176424 A MY 176424A
Authority
MY
Malaysia
Prior art keywords
spring
plunger
latch
longitudinal axis
spring latch
Prior art date
Application number
MYPI2014703010A
Other languages
English (en)
Inventor
Valts Treibergs
Aaron Magnuson
Sergey Yakushev
Scott Hanson
Original Assignee
Xcerra Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xcerra Corp filed Critical Xcerra Corp
Publication of MY176424A publication Critical patent/MY176424A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49119—Brush

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
MYPI2014703010A 2012-04-13 2013-03-14 Test probe assembly and related methods abstract MY176424A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261624083P 2012-04-13 2012-04-13

Publications (1)

Publication Number Publication Date
MY176424A true MY176424A (en) 2020-08-07

Family

ID=48045061

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014703010A MY176424A (en) 2012-04-13 2013-03-14 Test probe assembly and related methods abstract

Country Status (7)

Country Link
US (1) US9829506B2 (enExample)
EP (1) EP2836847B1 (enExample)
JP (1) JP6230595B2 (enExample)
MY (1) MY176424A (enExample)
PT (1) PT2836847T (enExample)
SG (1) SG11201406561XA (enExample)
WO (1) WO2013154738A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573332B (zh) * 2014-07-23 2017-03-01 鴻騰精密科技股份有限公司 電連接器及其端子
US20180095110A1 (en) * 2016-09-30 2018-04-05 Xcerra Corporation Compact testing system
MY177005A (en) * 2016-11-30 2020-09-01 Nidec Read Corp Contact terminal, inspection jig, and inspection device
USD869305S1 (en) * 2017-02-10 2019-12-10 Kabushiki Kaisha Nihon Micronics Probe pin
JP1592871S (enExample) * 2017-02-10 2017-12-11
JP1623279S (enExample) * 2018-02-02 2019-01-28
JP1622970S (enExample) * 2018-02-02 2019-01-28
JP1623280S (enExample) * 2018-02-02 2019-01-28
JP1622969S (enExample) * 2018-02-02 2019-01-28
JP1626668S (enExample) * 2018-02-02 2019-03-18
TWD197822S (zh) * 2018-02-02 2019-06-01 Nihon Micronics Kk 電性接觸子之部分
JP1626667S (enExample) * 2018-02-02 2019-03-18
JP1622968S (enExample) * 2018-02-02 2019-01-28
PH12021552664A1 (en) * 2019-04-23 2022-09-19 Yokowo Seisakusho Kk Contact probe
CN113009196B (zh) * 2021-03-02 2022-03-18 上海捷策创电子科技有限公司 一种芯片测试用探针和芯片测试装置
US11387587B1 (en) * 2021-03-13 2022-07-12 Plastronics Socket Partners, Ltd. Self-retained slider contact pin
KR102619576B1 (ko) * 2021-04-21 2023-12-29 리노공업주식회사 프로브 콘텍트
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly
USD1015282S1 (en) 2022-02-01 2024-02-20 Johnstech International Corporation Spring pin tip
US20240003938A1 (en) * 2022-07-01 2024-01-04 LST Co., Ltd Contact pin and test socket having the same
CN115184652B (zh) * 2022-07-06 2024-07-09 渭南木王智能科技股份有限公司 一种细长稳流测试探针
CN118091212A (zh) * 2022-11-28 2024-05-28 恩普乐斯股份有限公司 接触探针
USD1090440S1 (en) * 2023-01-12 2025-08-26 Johnstech International Corporation Spring probe contact assembly

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US5936421A (en) * 1994-10-11 1999-08-10 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
JP4060919B2 (ja) 1997-11-28 2008-03-12 富士通株式会社 電気的接続装置、接触子製造方法、及び半導体試験方法
DE19882938T1 (de) * 1998-01-05 2001-04-26 Rika Electronics Internat Inc Koaxialkontaktanordnungs-Vorrichtung
US6506082B1 (en) * 2001-12-21 2003-01-14 Interconnect Devices, Inc. Electrical contact interface
US6746252B1 (en) * 2002-08-01 2004-06-08 Plastronics Socket Partners, L.P. High frequency compression mount receptacle with lineal contact members
US6967492B2 (en) * 2003-11-26 2005-11-22 Asm Assembly Automation Ltd. Spring contact probe device for electrical testing
WO2006135680A2 (en) * 2005-06-10 2006-12-21 Delaware Capital Formation Inc. Electrical contact probe with compliant internal interconnect
JP4999079B2 (ja) * 2007-04-10 2012-08-15 サンユー工業株式会社 プローブ
US7862391B2 (en) * 2007-09-18 2011-01-04 Delaware Capital Formation, Inc. Spring contact assembly
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US8105119B2 (en) * 2009-01-30 2012-01-31 Delaware Capital Formation, Inc. Flat plunger round barrel test probe
WO2011036800A1 (ja) * 2009-09-28 2011-03-31 株式会社日本マイクロニクス 接触子及び電気的接続装置
US8710856B2 (en) * 2010-01-15 2014-04-29 LTX Credence Corporation Terminal for flat test probe
JPWO2011096067A1 (ja) * 2010-02-05 2013-06-10 株式会社日本マイクロニクス 接触子及び電気的接続装置
JP5352525B2 (ja) * 2010-04-28 2013-11-27 日本航空電子工業株式会社 プローブピン用コンタクト、プローブピンおよび電子デバイス用接続治具
TWM393066U (en) * 2010-05-06 2010-11-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP5618729B2 (ja) * 2010-09-24 2014-11-05 シチズンセイミツ株式会社 コンタクトプローブ及びこれを用いた電子回路試験装置

Also Published As

Publication number Publication date
SG11201406561XA (en) 2014-11-27
US9829506B2 (en) 2017-11-28
EP2836847A1 (en) 2015-02-18
EP2836847B1 (en) 2016-05-18
JP6230595B2 (ja) 2017-11-15
PT2836847T (pt) 2016-08-23
WO2013154738A1 (en) 2013-10-17
US20150070040A1 (en) 2015-03-12
JP2015516571A (ja) 2015-06-11

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